High-frequency signal transmission line and electronic device
A high-frequency signal transmission line includes a first ground conductor located at one side in a stacking direction of a stacked body of dielectric layers in relation to a signal line; a second ground conductor located at another side in the stacking direction in relation to the signal line; and a connection portion including interlayer connection conductors and connection conductors to connect the first ground conductor to the second ground conductor. Two of the interlayer connection conductors constituting both ends in the stacking direction of the connection portion are located farther away from a center of a bending section of the body than the other interlayer connection conductors. Openings are provided respectively in ones of the dielectric layers located at the one side and the another side in the stacking direction in relation to the other interlayer connection conductors, at positions that overlap with the other interlayer connection conductors.
1. A high-frequency signal transmission line that is bent when used, the high-frequency signal transmission line comprising:
a body including dielectric layers stacked on top of one another;
a signal line provided in the body;
a first ground conductor located at one side in a stacking direction in relation to the signal line so as to face the signal line across one or more of the dielectric layers;
a second ground conductor located at another side in the stacking direction in relation to the signal line so as to face the signal line across one or more of the dielectric layers; and
a connection portion including a plurality of interlayer connection conductors, each of the interlayer connection conductors pierced in one of the dielectric layers, and a plurality of connection conductors, each of the connection conductors provided on one of the dielectric layers, the connection portion configured to connect the first ground conductor to the second ground conductor; wherein
two of the interlayer connection conductors that constitute both ends in the stacking direction of the connection portion are located farther away from a center of a bending section where the body is to be bent than the other interlayer connection conductors of the connection portion; and
openings are located respectively in ones of the dielectric layers located at the one side and the another side in the stacking direction in relation to the other interlayer connection conductors, at positions that overlap with the other interlayer connection conductors.
2. The high-frequency signal transmission line according to claim 1 , wherein the connection portion is located within the bending section where the body is to be bent.
3. The high-frequency signal transmission line according to claim 1 , wherein
the second ground conductor includes a plurality of openings arranged along the signal line; and
the connection portion is connected to the second ground conductor by contacting with a portion between adjacent ones of the openings.
4. A high-frequency signal transmission line that is bent when used, the high-frequency signal transmission line comprising:
a body including dielectric layers stacked on top of one another;
a signal line provided in the body;
a first ground conductor located at a side in a stacking direction in relation to the signal line so as to face the signal line across one or more of the dielectric layers;
a second ground conductor located at another side in the stacking direction in relation to the signal line so as to face the signal line across one or more of the dielectric layers; and
a connection portion including a plurality of interlayer connection conductors, each of the interlayer connection conductors pierced in one of the dielectric layers, and a plurality of connection conductors, each of the connection conductors provided on one of the dielectric layers, the connection portion configured to connect the first ground conductor to the second ground conductor; wherein
two of the interlayer connection conductors that constitute both ends in the stacking direction of the connection portion are located farther away from a center of a bending section where the body is to be bent than another of the interlayer connection conductors of the connection portion crossing a neutral surface of the bending section.
5. The high-frequency signal transmission line according to claim 4 , wherein openings are located respectively in ones of the dielectric layers located at the one side and the another side in the stacking direction in relation to the another of the interlayer connection conductors crossing the neutral surface, at positions that overlap with the another of the interlayer connection conductors crossing the neutral surface.
6. The high-frequency signal transmission line according to claim 4 , wherein the connection portion is located within the bending section where the body is to be bent.
7. The high-frequency signal transmission line according to claim 4 , wherein
the second ground conductor includes a plurality of openings arranged along the signal line; and
the connection portion is connected to the second ground conductor by contacting with an area between adjacent ones of the openings.
8. An electronic device comprising:
an article; and
a high-frequency signal transmission line that is bent when used; wherein
the high-frequency signal transmission line includes:
a body including dielectric layers stacked on top of one another;
a signal line provided in the body;
a first ground conductor located at one side in a stacking direction in relation to the signal line so as to face the signal line across one or more of the dielectric layers;
a second ground conductor located at another side in the stacking direction in relation to the signal line so as to face the signal line across one or more of the dielectric layers; and
a connection portion including a plurality of interlayer connection conductors, each of the interlayer connection conductors pierced in one of the dielectric layers, and a plurality of connection conductors, each of the connection conductors provided on one of the dielectric layers, the connection portion configured to connect the first ground conductor to the second ground conductor; wherein
two of the interlayer connection conductors that constitute both ends in the stacking direction of the connection portion are located farther away from a center of a bending section where the body is to be bent than another of the interlayer connection conductors of the connection portion crossing a neutral surface of the bending section; and
a main surface of the body nearer to the first ground conductor in relation to the signal line contacts the article.
9. The electronic device according to claim 8 , wherein the second ground conductor includes a plurality of openings arranged along the signal line.
10. The electronic device according to claim 9 , further comprising a case housing the article and the high-frequency signal transmission line; wherein
a main surface of the body nearer to the second ground conductor in relation to the signal line faces an inner surface of the case with a predetermined space.
11. The electronic device according to claim 8 , wherein openings are located respectively in ones of the dielectric layers located at the one side and the another side in the stacking direction in relation to the another of the interlayer connection conductors crossing the neutral surface, at positions that overlap with the another of the interlayer connection conductors crossing the neutral surface.
12. The electronic device according to claim 8 , wherein the connection portion is located within the bending section where the body is to be bent.
13. The electronic device according to claim 8 , wherein
the second ground conductor includes a plurality of openings arranged along the signal line; and
the connection portion is connected to the second ground conductor by contacting with an area between adjacent ones of the openings.
14. An electronic device comprising:
an article; and
a high-frequency signal transmission line that is bent when used; wherein
the high-frequency signal transmission line includes:
a body including dielectric layers stacked on top of one another;
a signal line provided in the body;
a first ground conductor located at one side in a stacking direction in relation to the signal line so as to face the signal line across one or more of the dielectric layers;
a second ground conductor located at another side in the stacking direction in relation to the signal line so as to face the signal line across one or more of the dielectric layers; and
a connection portion including a plurality of interlayer connection conductors, each of the interlayer connection conductors pierced in one of the dielectric layers, and a plurality of connection conductors, each of the connection conductors provided on one of the dielectric layers, the connection portion configured to connect the first ground conductor to the second ground conductor; wherein
two of the interlayer connection conductors that constitute both ends in the stacking direction of the connection portion are located farther away from a center of a bending section where the body is to be bent than another of the interlayer connection conductors of the connection portion crossing a neutral surface of the bending section;
openings are located respectively in ones of the dielectric layers located at the one side and the another side in the stacking direction in relation to the other interlayer connection conductors, at positions that overlap with the other interlayer connection conductors; and
a main surface of the body nearer to the first ground conductor in relation to the signal line contacts the article.
15. The electronic device according to claim 14 , wherein the second ground conductor includes a plurality of openings arranged along the signal line.
16. The electronic device according to claim 15 , further comprising a case housing the article and the high-frequency signal transmission line; wherein
a main surface of the body nearer to the second ground conductor in relation to the signal line faces an inner surface of the case with a predetermined space.
17. The electronic device according to claim 14 , wherein the connection portion is located within the bending section where the body is to be bent.
18. The electronic device according to claim 14 , wherein
the second ground conductor includes a plurality of openings arranged along the signal line; and
the connection portion is connected to the second ground conductor by contacting with a portion between adjacent ones of the openings.