Flexible metal laminate containing fluoropolymer
The present invention relates to a flexible metal laminate with low dielectric constant, which may be applied for a substrate for a flexible printed circuit. A flexible metal laminate according to one aspect of the invention includes a first metal layer; a first polyimide layer; a polyimide layer including fluoropolymer dispersed therein, formed on the first polyimide layer; and a second polyimide layer formed on the polyimide layer including fluoropolymer dispersed therein; wherein in the polyimider layer including dispersed fluoropolymer, the content of the fluoropolymer per unit volume is higher at 40 to 60% depth than at 5 to 10% depth of the total thickness from the surface of the polyimide layer.
1. A flexible metal laminate comprising
a first metal layer;
a first polyimide layer;
a monolithic polyimide layer including fluoropolymer dispersed therein, formed on the first polyimide layer; and
a second polyimide layer formed on the polyimide layer including fluoropolymer dispersed therein;
wherein in the monolithic polyimide layer including dispersed fluoropolymer, the content of the fluoropolymer per unit volume is higher at 40 to 60% depth than at 5 to 10% depth of the total thickness from the surface of the polyimide layer;
wherein the fluoropolymer is dispersed by using a polyester-based dispersant in the polyimide layer,
wherein the polyimide layers including the first polyimide layer, the monolithic polyimide layer including dispersed fluoropolymer, and the second polyimide layer have dielectric constant of 2.2 to 3.2 at 1MHz, dielectric loss of 0.001 to 0.007, and thermal expansion coefficient of 15 to 35 ppm/K,
wherein the first metal layer has a peel strength value of 1.2 to 1.3 Kgf/cm, and wherein the peel strength value is measured using a tensile strength measuring device for the flexible metal laminate that the metal was peeled off with a width of 1 cm from the surface.
2. The flexible metal laminate according to claim 1 , wherein the monolithic polyimide layer including dispersed fluoropolymer has the lowest content of the fluoropolymer per unit volume at 5 to 10% depth of the total thickness from the surface of the polyimide layer.
3. The flexible metal laminate according to claim 1 , wherein the monolithic polyimide layer including dispersed fluoropolymer has the highest content of the fluoropolymer per unit volume at 40 to 60% depth of the total thickness from the surface of the polyimide layer.
4. The flexible metal laminate according to claim 1 , wherein in the monolithic polyimide layer including dispersed fluoropolymer, the content of the fluoropolymer per unit volume increases with depth, at 5 to 15% depth of the total thickness from the surface of the polyimide layer.
5. The flexible metal laminate according to claim 1 , further comprising a second metal layer formed on the second polyimide layer.
6. The flexible metal laminate according to claim 5 , wherein the surface of the first metal layer and the surface of the second metal layer respectively have ten point average roughness (Rz) of 0.5 to 2.5 μm.
7. The flexible metal laminate according to claim 1 , wherein the first polyimide layer and the second polyimide layer respectively have a thickness of 1 to 10 μm.
8. The flexible metal laminate according to claim 1 , wherein the monolithic polyimide layer including dispersed fluoropolymer has a thickness of 5 to 50 μm.
9. The flexible metal laminate according to claim 1 , wherein the fluoropolymer is at least one selected from the group consisting of polytetrafluoroethylene (PTEF), perfluoroalkoxy (PFA), fluorinated ethylene propylene (FEP), chlorotrifluoroethylene (CTFE), tetrafluoroethylene/chlorotrifluoroethylene (TFE/CTFE), ethylene chlorotrifuloroethylene (ECTFE), and polyfluorinated vinylidene (PVDF).
10. The flexible metal laminate according to claim 1 , wherein the fluoropolymer is included in the content of 10 to 60 wt % in the monolithic polyimide layer including dispersed fluoropolymer.
11. The flexible metal laminate according to claim 5 , wherein the first metal layer and the second metal layer are films of one selected from the group consisting of copper, iron, nickel, titanium, aluminum, silver and gold, or an alloy of two or more kinds thereof.