Small form factor transceiver compatible with solder processing
A fiber optic transceiver that is compatible with packaging into standard semiconductor packages and for SMT packaging, using materials and fabrication procedures that withstand solder assembly processes. The SMT package can have electrical contacts on the exterior of the package for creating electrical conduits to a substrate, such as a PCB, interposer, or circuit card within a larger assembly. The fiber optic transceiver can be of a non-SMT package configuration, being formed with electrical connection technology that allows direct connection to a substrate with electrical wiring, such as a PCB, interposer, or circuit card within a larger assembly. The fiber optic transceiver may have solderballs, metal posts or other electrical conduit technology that allows direct electrical connection to the substrate.
1. A solderable fiber optic transceiver device, comprising:
a connector guide, a top portion having an alignment guide hole configured to mate to an alignment pin of an attachable fiber optic connector and an optical port for light passage to/from an optical fiber in the attachable fiber optic connector;
a lens seal coupled to a bottom portion of the connector guide;
a collimating lens in alignment with the optical port and sealed to a bottom portion of the lens seal to prevent external contamination from gases and liquids;
a transparent carrier coupled to a bottom portion of the collimating lens, wherein the transparent carrier has a first electrical wiring, and a second electrical wiring for connection to a higher level substrate; and
an optoelectronic device in alignment with the collimating lens and mounted to an underside of the transparent carrier and connected to the first electrical wiring.
2. The device of claim 1 , further comprising:
at least one of an electrical circuit and an application specific integrated circuit (ASIC) attached to the second electrical wiring of the transparent carrier.
3. The device of claim 2 , wherein at least one of the transparent carrier and application specific circuit (ASIC) is configured for mounting to a higher level substrate via at least one of a Ball Grid Array (BGA), Column Grid Array (CGA), Bump Chip Carrier (BCC) configuration, Leaded Chip Carrier (LCC) configuration, Plastic Leaded Chip Carrier (PLCC) configuration, Quad-Flat No-Lead (QFN) configuration, flip-chip contact, conductive epoxy, solder ball, wire-bond and metal posts with solder caps.
4. The device of claim 3 , further comprising:
a higher level substrate connected to at least one of the second electrical wiring and ASIC, wherein the higher level substrate is at least one of a printed circuit board (PCB) and circuit card; and
a thermal interface region between the transparent carrier and the higher level substrate.
5. The device of claim 3 , further comprising a fiber optic connector attached to the connector guide.
6. The device of claim 5 , wherein the fiber optic connector comprises:
a connector lens with a corner turn lens to re-direct light from a fiber, fiber mounts, and a strain relief capture cavity;
a fiber cable containing a plurality of fibers coupled to the connector lens;
a strain relief attached to the plurality of fibers and coupled to the connector lens; and
a lens cap with a retention support feature for alignment, the lens cap coupled to the strain relief and connector lens.
7. The device of claim 6 , wherein a bottom portion of the connector lens further comprises a slip joint alignment feature configured to assist in alignment with the connector guide and an optical gasket coupled to the bottom portion of the connector lens.
8. The device of claim 6 , further comprising a connector retention coupled to the retention support feature and to a connector retention mount, wherein the connector retention mount is integral to a higher level substrate or coupled to a support frame of the higher level substrate.
9. The device of claim 1 , further comprising:
an interposer, a top portion connected to the second electrical wiring and a bottom portion having electrical contacts configured for mounting to a higher level substrate via at least one of a Ball Grid Array (BGA), Column Grid Array (CGA), Bump Chip Carrier (BCC) configuration, Leaded Chip Carrier (LCC) configuration, Plastic Leaded Chip Carrier (PLCC) configuration, Quad-Flat No-Lead (QFN) configuration, Chip Scale Packaging (CSP), flip-chip contact, conductive epoxy, solder ball, wire-bond and metal posts with solder caps; and
an interface region at a bottom portion of the interposer.
10. The device of claim 9 , further comprising a higher level substrate connected to the electrical contacts of the interposer, wherein the higher level substrate is at least one of a printed circuit board (PCB) and circuit card.
11. The device of claim 9 , further comprising a fiber optic connector attached to the connector guide.
12. The device of claim 11 , wherein the fiber optic connector comprises:
a connector lens with a corner turn lens to re-direct light from a fiber, fiber mounts, and a strain relief capture cavity;
a fiber cable containing a plurality of fibers coupled to the connector lens;
a strain relief attached to the plurality of fibers and coupled to the connector lens; and
a lens cap with a retention support feature for alignment, the lens cap coupled to the strain relief and connector lens.
13. The device of claim 1 , wherein the optoelectronic device is a laser and is flip-chip mounted to the first electrical wiring of the transparent carrier.
14. The device of claim 1 , wherein at least one of the collimating lens and lens seal have a pocket to contain a bonding material.
15. A method for fabricating a solderable optical transceiver device, comprising:
at least one of a wafer and flip-chip bonding a connector guide to a lens seal;
at least one of a wafer and flip-chip bonding the lens seal to a collimating lens;
at least one of a wafer and flip-chip bonding the collimating lens to a top side of a transparent substrate;
at least one of a wafer and flip-chip bonding an optoelectronic device to a bottom side of the transparent substrate;
populating a substrate with at least one of a passive electrical component, lead frame interconnect and a mechanical structure for supporting a lid;
at least one of wire-bonding, ribbon-bonding, and flip-chip attaching an optical Core to the substrate; and
sealing the device with at least one of a protective cover and optically transparent sealing compound.
16. The method of claim 15 , further comprising dicing out the bonded connector guide, lens seal, collimating lens, and transparent substrate.
17. The method of claim 15 , further mounting the device to a higher level substrate via at least one of a Ball Grid Array (BGA), Column Grid Array (CGA), Bump Chip Carrier (BCC) configuration, Leaded Chip Carrier (LCC) configuration, Plastic Leaded Chip Carrier (PLCC) configuration, Quad-Flat No-Lead (QFN) configuration, flip-chip contact, conductive epoxy, solder ball, wire-bond and metal posts with solder caps.
18. The method of claim 15 , further comprising mounting the device to an interposer having electrical contacts configured for mounting to a higher level substrate via at least one of a Ball Grid Array (BGA), Column Grid Array (CGA), Bump Chip Carrier (BCC) configuration, Leaded Chip Carrier (LCC) configuration, Plastic Leaded Chip Carrier (PLCC) configuration, Quad-Flat No-Lead (QFN) configuration, Chip Scale Packaging (CSP), flip-chip contact, conductive epoxy, solder ball, wire-bond and metal posts with solder caps.
19. The method of claim 15 , further comprising attaching a fiber connector to the connector guide and a connector retention to a retention support feature on the fiber connector and to a connector retention mount, wherein the connector retention mount is integral to a higher level substrate or coupled to a support frame of the higher level substrate.
20. The method of claim 15 , wherein the bonding process for the collimating lens to the top side of a transparent substrate includes forming registration marks to permit alignment of the optoelectronic device when bonded to the bottom side of the transparent substrate.