IP Library › Granted Patent US 9,475,092
Granted Patent B2
US 9,475,092 · App. 14/287,556 · Granted Oct 25, 2016

Electro-acoustic transducer and method of manufacturing the same

Inventors: Dong-sik Shim (Hwaseong-si, KR); Seog-woo Hong (Yongin-si, KR); Seok-whan Chung (Hwaseong-si, KR); Chang-jung Kim (Yongin-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
B06B1/0292B81C1/00182Y10T29/49005
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Quick Facts
Patent No.
US 9,475,092
App. No.
14/287,556
Filed
May 27, 2014
Granted
Oct 25, 2016
Kind
B2
Art Unit
2656
USPC
381/150
Abstract

An electro-acoustic transducer includes: a conductive substrate in which a first trench is formed, and which includes an electrode connection unit surrounded by the first trench; a membrane provided on the conductive substrate; an upper electrode provided on the membrane to contact an upper surface of the electrode connection unit; a first electrode provided on a lower surface of the conductive substrate to contact a lower surface of the electrode connection unit; and a second electrode spaced apart from the first electrode and provided to contact the lower surface of the conductive substrate.

Claims (18)

1. An electro-acoustic transducer comprising:

a conductive substrate in which a first trench is formed to penetrate the conductive substrate, and which comprises an electrode connection unit surrounded by the first trench;

a membrane provided on an upper portion of the conductive substrate;

an upper electrode provided on an upper surface of the membrane to contact an upper surface of the electrode connection unit;

a first electrode provided to contact a lower surface of the electrode connection unit; and

a second electrode spaced apart from the first electrode and provided to contact the lower surface of the conductive substrate,

wherein the electrode connection unit is provided to connect the first electrode and the upper electrode electrically.

2. The electro-acoustic transducer of claim 1 , wherein a cavity is formed in an upper surface of the conductive substrate to have a predetermined depth, and the membrane is provided on the upper surface of the conductive substrate to cover the cavity.

3. The electro-acoustic transducer of claim 2 , further comprising:

a first insulating layer provided on the lower surface of the conductive substrate; and

a second insulating layer provided in inner wall surfaces of the first trench and the cavity.

4. The electro-acoustic transducer of claim 1 , wherein a support in which a cavity is formed is provided on the conductive substrate, and a membrane is provided on an upper surface of the support to cover the cavity.

5. The electro-acoustic transducer of claim 4 , further comprising:

a first insulating layer provided on the lower surface of the conductive substrate; and

a second insulating layer provided on a bottom surface of the cavity.

6. The electro-acoustic transducer of claim 1 , further comprising:

a pad substrate coupled to the conductive substrate and comprising a plurality of pads bonded to the first electrode and the second electrode.

7. The electro-acoustic transducer of claim 1 , wherein a second trench for separating elements is formed in the conductive substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2014
From: SHIM, DONG-SIK; HONG, SEOG-WOO; CHUNG, SEOK-WHAN; KIM, CHANG-JUNG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 032966/0452 →
Priority Claims (1)
KR 10-2013-0150840 · Dec 5, 2013 · national
Continuity (1)
Related Publication 20150163599A1 · Jun 11, 2015