Semiconductor device, semiconductor device mounting structure and power semiconductor device
A semiconductor device includes a plurality of die pad sections, a plurality of semiconductor chips, each of which is arranged in each of the die pad sections, a resin encapsulation portion having a recess portion for exposing at least a portion of the die pad sections, the resin encapsulation portion configured to cover the die pad sections and the semiconductor chips, and a heat radiation layer arranged in the recess portion. The heat radiation layer includes an elastic layer exposed toward a direction in which the recess portion is opened. The heat radiation layer directly faces at least a portion of the die pad sections. The elastic layer overlaps with at least a portion of the die pad sections when seen in a thickness direction of the heat radiation layer.
1. A semiconductor device, comprising:
a plurality of die pad sections;
a plurality of semiconductor chips, each of which is arranged on each of the die pad sections;
a resin encapsulation portion including a surface, the surface having a recess portion for exposing at least a portion of the die pad sections, the resin encapsulation portion configured to cover the die pad sections and the semiconductor chips; and
a heat radiation sheet arranged in the recess portion, the heat radiation sheet being insulating,
the heat radiation sheet composed of an elastic material exposed toward a direction in which the recess portion is opened, the heat radiation sheet directly facing at least a portion of the die pad sections, the elastic material overlapping with at least a portion of the die pad sections when seen in a thickness direction of the heat radiation sheet, wherein the recess portion has a recess side surface surrounding the heat radiation sheet,
wherein the heat radiation sheet has a section protruding from the surface of the resin encapsulation portion,
wherein the heat radiation sheet is elastically deformable and the heat radiation sheet makes direct contact with the recess side surface of the recess portion, and
wherein each of the die pad sections has a die pad rear surface with which the heat radiation sheet makes direct contact, the die pad rear surface being an irregular surface.
2. The device of claim 1 , wherein the resin encapsulation portion includes a resin bottom surface, the recess portion depressed from the resin bottom surface, the heat radiation sheet having a section protruding beyond the resin bottom surface.
3. The device of claim 1 , wherein the recess portion has a recess bottom surface from which the die pad sections are exposed, the recess bottom surface making direct contact with the heat radiation sheet.
4. The device of claim 1 , wherein all the die pad sections make direct contact with the heat radiation sheet.
5. The device of claim 3 , wherein the recess bottom surface is an irregular surface.
6. The device of claim 1 , wherein the heat radiation sheet overlaps with all the die pad sections when seen in the thickness direction of the heat radiation sheet.
7. The device of claim 1 , wherein the heat radiation sheet is formed of only the elastic material.
8. The device of claim 7 , wherein the elastic material makes contact with all the die pad sections.
9. The device of claim 1 , wherein the Young's modulus of the elastic material is smaller than the Young's modulus of the resin encapsulation portion.
10. The device of claim 1 , wherein the thickness of the heat radiation sheet is from 50 μm to 500 μm.
11. A semiconductor device mounting structure, comprising:
conductor device of claim 1 ;
a substrate to which the semiconductor device is mounted; and
a heat radiation member fixed to the substrate, the heat radiation member making direct contact with the elastic material.
12. A power semiconductor device, comprising:
a plurality of die pad sections;
a plurality of power chips, each of which is arranged on each of the die pad sections;
a Large Scale Integration (LSI) chip configured to control the power chips;
a resin encapsulation portion including a surface, the surface having a recess portion for exposing at least a portion of the die pad sections, the resin encapsulation portion configured to cover the die pad sections and the power chips; and
a heat radiation sheet arranged in the recess portion, the heat radiation sheet being insulating,
the heat radiation sheet composed of an elastic material exposed toward a direction in which the recess portion is opened, the heat radiation sheet directly facing at least a portion of the die pad sections, the elastic material overlapping with at least a portion of the die pad sections when seen in a thickness direction of the heat radiation sheet, wherein the recess portion has a recess side surface surrounding the heat radiation sheet,
wherein the heat radiation sheet has a section protruding from the surface of the resin encapsulation portion,
wherein the heat radiation sheet is elastically deformable and the heat radiation sheet makes direct contact with the recess side surface of the recess portion, and
wherein each of the die pad sections has a die pad rear surface with which the heat radiation sheet makes direct contact, the die pad rear surface being an irregular surface.