Light emitting device and manufacturing method thereof
The light-emitting device has a plurality of light-emitting elements that is mounted on one or more wiring patterns on a substrate. A new light-emitting element that replaces a defective element is mounted on the same wiring pattern on which the defective element is mounted. The defective element or a trace that remains alter removal of the defective element is sealed by a same sealing member by which the new light-emitting element is sealed.
1. A light-emitting device comprising:
a substrate including one or more wiring patterns provided thereon;
a trace of a defective element provided on one of the one or more wiring patterns, wherein the trace is a die bonding mark, a die bonding material residue, a wire bonding mark, and/or a wire residue;
a plurality of light-emitting elements provided on the one or more wiring patterns, wherein the plurality of light-emitting elements includes a replacement light-emitting element mounted on the same wiring pattern on which the trace of the defective element is provided;
a reflective member covering at least a part of the trace of the defective element; and
a sealing member covering the replacement light-emitting element and at least a part of the reflective member covering at least a part of the trace of the defective element.
2. The light-emitting device according to claim 1 , wherein a part the reflective member is provided under at least a part of the replacement light-emitting element.
3. The light-emitting device according to claim 1 , wherein the reflective member is a white member.
4. The light-emitting device according to claim 1 , wherein the plurality of light-emitting elements is ultrasonic-mounted on the one or more wiring patterns in accordance with a flip-chip scheme.
5. The light-emitting device according to claim 1 , wherein the sealing member is selected from the group consisting of epoxy resin, silicone resin, or modified epoxy resin and modified silicone resin.
6. The light-emitting device according to claim 1 , wherein the reflective member comprises a silicone resin, a modified silicone resin or a resist containing a material selected from the group consisting of titanium oxide, silicon oxide, barium sulfate, aluminum oxide, and a wavelength conversion member.
7. The light-emitting device according to claim 1 , wherein the reflective member comprises an insulating resin containing a white filler or white powder and having a property of high reflectance.
8. The light-emitting device according to claim 1 , wherein the reflective member is disposed so that at least a part of the replacement light emitting element is exposed from the reflective member.
9. The light-emitting device according to claim 1 , wherein at least a part of a top surface and a side surface of the replacement light emitting element is exposed from.
10. The light-emitting device according to claim 1 , wherein the defective element is an element that is not properly connected to the one or more wiring patterns. the reflective member.
11. A method for manufacturing a light-emitting device, comprising the steps of:
mounting a plurality of light-emitting elements on one or more wiring patterns on a substrate;
determining that at least one of plurality of light-emitting elements is defective; and then
removing the defective element of the plurality of light-emitting elements, leaving a trace of the defective element on one of the one or more wiring patterns, wherein the trace is a die bonding mark, a die bonding material residue, a wire bonding mark, and/or a wire residue;
mounting a replacement light-emitting element on the same wiring pattern on which the trace of the defective element is provided;
covering at least part of the trace of the defective element with a reflective member; and
sealing the replacement light-emitting element and at least a part of the reflective member covering at least a part of the trace of the defective element with a sealing member.
12. The method for manufacturing a light-emitting device according to claim 11 , wherein a part the reflective member is provided under at least a part of the replacement light-emitting element.
13. The method for manufacturing a light-emitting device according to claim 11 , wherein the reflective member is a white member.
14. The method for manufacturing a light-emitting device according to claim 11 , wherein the plurality of light-emitting elements is ultrasonic-mounted on the one or more wiring patterns in accordance with a flip-chip scheme.
15. The method for manufacturing a light-emitting device according to claim 11 , wherein the sealing member is selected from the group consisting of epoxy resin, silicone resin, or modified epoxy resin and modified silicone resin.
16. The method for manufacturing a light-emitting device according to claim 11 , wherein the reflective member comprises a silicone resin, a modified silicone resin or a resist containing a material selected from the group consisting of titanium oxide, silicon oxide, barium sulfate, aluminum oxide, and a wavelength conversion member.
17. The method for manufacturing a light-emitting device according to claim 11 , wherein the reflective member comprises an insulating resin containing a white filler or white powder and having a property of high reflectance.
18. The method for manufacturing a light-emitting device according to claim 11 , wherein the reflective member is disposed so that at least a part of the replacement light emitting element is exposed from the reflective member.
19. The method for manufacturing a light-emitting device according to claim 11 , wherein at least a part of a top surface and a side surface of the replacement light emitting element is exposed from the reflective member.
20. The method for manufacturing a light-emitting device according to claim 11 , wherein the step of mounting the plurality of light-emitting elements on one or more wiring patterns on the substrate comprises providing a reflective material layer on the one or more wiring patterns on the substrate, the reflective material layer having openings exposing the one or more wiring patterns, a size of each of the openings allowing about two light-emitting elements to be mounted in each of the openings on the one or more wiring patterns on the substrate, and mounting one light-emitting element in each of the openings.
21. The method for manufacturing a light-emitting device according to claim 11 , wherein the defective element is an element that is not properly connected to the one or more wiring patterns.