Nonvolatile semiconductor storage device
A nonvolatile semiconductor storage device includes a plurality of electrode films stacked in a first direction; a silicon pillar piercing the stacked electrode films and separated therefrom by a block insulating film; a charge storage film provided between the block insulating film and the silicon pillar; and a tunnel insulating film provided between the charge storage film and the silicon pillar. The tunnel insulating film comprises a first insulating film having silicon oxide as a base material and containing an added element, wherein a density of the element increases from the silicon pillar toward the charge storage film.
1. A nonvolatile semiconductor storage device, comprising:
a stacked structural unit including a plurality of electrode films stacked in a first direction;
a silicon pillar piercing the stacked structural unit;
a block insulating film provided between the electrode films and the silicon pillar;
a charge storage film provided between the block insulating film and the silicon pillar; and
a tunnel insulating film provided between the charge storage film and the silicon pillar,
wherein the tunnel insulating film includes silicon oxide as a base material and includes an element,
the tunnel insulating film includes a first point, a second point, and a third point in this order from the silicon pillar toward the charge storage film, and
a first density of the element at the first point is lower than a second density of the element at the second point and the second density of the element is lower than a third density of the element at the third point.
2. The device of claim 1 , wherein the first point is located at an interface between the tunnel insulating film and the silicon pillar and the third point is located at an interface between the tunnel insulating film and the charge storage film.
3. The device of claim 2 , wherein the second point is located at middle with the first point and the third point.
4. The device of claim 1 , wherein the element of the tunnel insulating film is nitrogen.
5. The device of claim 1 , wherein the element of the tunnel insulating film is one of aluminum and hafnium.
6. The device of claim 1 , further comprising:
a first insulating film provided between the tunnel insulating film and the silicon pillar, the first insulating film being containing silicon oxide.
7. The device of claim 1 , wherein a density gradient between the first point and the second point is smaller than a density gradient between the second point and the third point.
8. The device of claim 1 , wherein the charge storage film is a silicon nitride film.
9. The device of claim 1 , wherein the tunnel insulating film has a composition ratio of (SiO 2 ) x (Si 3 N 4 ) 1-x , where (0.75≦x≦1).
10. The device of claim 1 , wherein a density of the element monotonously increases from the silicon pillar toward the charge storage film.
11. The device of claim 1 , further comprising:
a first insulating layer being provided on an inner side of the silicon pillar.
12. A nonvolatile semiconductor storage device, comprising:
a stacked structural unit including a plurality of electrode films stacked in a first direction;
a silicon pillar piercing the stacked structural unit;
a block insulating film provided between the electrode films and the silicon pillar;
a charge storage film provided between the block insulating film and the silicon pillar; and
a tunnel insulating film provided between the charge storage film and the silicon pillar,
wherein the tunnel insulating film includes silicon oxide as a base material and includes nitrogen,
the tunnel insulating film includes a first point, a second point, and a third point in this order from the silicon pillar toward the charge storage film, and
a first density of nitrogen at the first point is lower than a second density of nitrogen at the second point and the second density of nitrogen is lower than a third density of nitrogen at the third point.
13. The device of claim 12 , wherein the first point is located at an interface between the tunnel insulating film and the silicon pillar and the third point is located at an interface between the tunnel insulating film and the charge storage film.
14. The device of claim 13 , wherein the second point is located at middle with the first point and the third point.
15. The device of claim 12 , further comprising:
a first insulating film provided between the tunnel insulating film and the silicon pillar, the first insulating film being containing silicon oxide.
16. The device of claim 12 , wherein a density gradient between the first point and the second point is smaller than a density gradient between the second point and the third point.
17. The device of claim 12 , wherein the charge storage film is a silicon nitride film.
18. The device of claim 12 , wherein the tunnel insulating film has a composition ratio of (SiO 2 ) x (Si 3 N 4 ) 1-x , where (0.75≦x≦1).
19. The device of claim 12 , wherein a density of nitrogen monotonously increases from the silicon pillar toward the charge storage film.
20. The device of claim 12 , further comprising:
a first insulating layer being provided on an inner side of the silicon pillar.
21. The device of claim 1 , wherein the element lowers a band gap of the base material by being added.