Semiconductor device, and method for manufacturing the same
A semiconductor device (A 1 ) includes a semiconductor layer having a first face with a trench ( 3 ) formed thereon and a second face opposite to the first face, a gate electrode ( 41 ), and a gate insulating layer ( 5 ). The semiconductor layer includes a first n-type semiconductor layer ( 11 ), a second n-type semiconductor layer ( 12 ), a p-type semiconductor layer ( 13 ), and an n-type semiconductor region ( 14 ). The trench ( 3 ) is formed so as to penetrate through the p-type semiconductor layer ( 13 ) and to reach the second n-type semiconductor layer ( 12 ). The p-type semiconductor layer ( 13 ) includes an extended portion extending to a position closer to the second face of the semiconductor layer than the trench ( 3 ) is. Such structure allows suppressing dielectric breakdown in the gate insulating layer ( 5 ).
1. A semiconductor device comprising:
a semiconductor layer having a first face provided with a trench and a second face opposite to the first face;
a gate electrode provided in the trench; and
an insulating layer provided in the trench so as to insulate the semiconductor layer and the gate electrode from each other;
wherein the semiconductor layer includes a first semiconductor layer of a first conductivity type, and a second semiconductor layer of a second conductivity type opposite to the first conductivity type,
wherein the trench is formed so as to penetrate through the second semiconductor layer and to reach the first semiconductor layer,
wherein the second semiconductor layer includes a close portion close to the second face of the semiconductor layer, while also including a sublayer disposed farther from the second face of the semiconductor layer than the close portion is,
wherein a recessed portion is provided at the first semiconductor layer or the second semiconductor layer,
wherein the close portion and the recessed portion are disposed so as to overlap in a widthwise direction perpendicular to a depthwise direction of the trench,
wherein the second semiconductor layer includes a channel region formed along the trench and in contact with the first semiconductor layer,
wherein the sublayer is smaller in size measured in the depthwise direction of the trench than the close portion, and
wherein the recessed portion is smaller in size measured in the depthwise direction of the trench than the trench.
2. The semiconductor device according to claim 1 , wherein impurity concentration in the channel region is lower than the impurity concentration in the close portion.
3. The semiconductor device according to claim 1 , wherein the recessed portion has an opening that is smaller in size in the widthwise direction than the close portion.
4. The semiconductor device according to claim 1 , wherein the first semiconductor layer and the second semiconductor layer define a boundary between them, the boundary including a first bottom boundary adjacent to the close portion and a second bottom boundary adjacent to the trench, and wherein the recessed portion, is equal in size in the depthwise direction to a distance between the first bottom boundary and the second bottom boundary.
5. The semiconductor device according to claim 1 , wherein at least a part of the sublayer is located immediately above the close portion.
6. The semiconductor device according to claim 1 , wherein the close portion as a whole is disposed immediately below the sublayer.
7. The semiconductor device according to claim 1 , wherein the close portion is closer to the second face of the semiconductor layer than the trench is.
8. The semiconductor device according to claim 1 , wherein impurity concentration in the close portion is greater than impurity concentration in the sublayer so as to suppress a depletion layer in the close portion.
9. The semiconductor device according to claim 1 , wherein the semiconductor layer further includes a semiconductor region of the second conductivity type, and
wherein the semiconductor region is formed in the first semiconductor layer and spaced from the second semiconductor layer.
10. The semiconductor device according to claim 9 , wherein the semiconductor region is in contact with a bottom portion of the trench.
11. The semiconductor device according to claim 9 , wherein the semiconductor region is formed so as to make contact with the bottom portion of the trench and a lateral portion of the trench.
12. The semiconductor device according to claim 9 , wherein the semiconductor region is in contact with the trench, and
wherein a boundary between the semiconductor region and the trench is located only inside an opening of the trench, in a depthwise view of the trench.
13. The semiconductor device according to claim 1 , wherein the recessed portion includes a bottom surface facing the close portion and a side surface connected to the bottom surface, and an impurity concentration at the bottom surface is greater than an impurity concentration at the side surface.
14. The semiconductor device according to claim 13 , wherein the impurity concentration at the bottom surface is 1×10 17 cm −3 ˜1×10 20 cm −3 and the impurity concentration at the side surface is 1×10 16 cm −3 ˜1×10 19 cm −3 .