IP Library › Granted Patent US 9,496,494
Granted Patent B2
US 9,496,494 · App. 14/096,448 · Granted Nov 15, 2016

Resistive random access memory devices formed on fiber and methods of manufacturing the same

Inventors: Sang-hun Jeon (Seoul, KR); Jong-jin Park (Hwaseong-si, KR); Ji-hyun Bae (Seoul, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H01L45/145H01L27/2409H01L45/04H01L45/12H01L45/1233H01L45/144H01L45/146H01L45/147H01L45/149H01L45/16
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Quick Facts
Patent No.
US 9,496,494
App. No.
14/096,448
Granted
Nov 15, 2016
Kind
B2
Abstract

Provided is a memory device formed on a fiber. The memory device includes a lower electrode, a memory resistance layer, and an upper electrode, which are sequentially formed on a surface of the fiber. The memory resistance layer may have variable resistance properties. The memory device may further include an intermediate electrode and a switching layer formed between the memory resistance layer and the upper electrode.

Claims (12)

1. A resistive random access memory (RRAM) device formed on at least one fiber, the RRAM device comprising:

an insulating layer directly formed on the at least one fiber for planarization of a surface of the at least one fiber;

a lower electrode directly disposed on the insulating layer;

a memory resistance layer disposed on the lower electrode; and

an upper electrode disposed on the memory resistance layer.

2. The RRAM device of claim 1 , further comprising an intermediate electrode and a switching layer, wherein the intermediate electrode and the switching layer are interposed between the memory resistance layer and the upper electrode.

3. The RRAM device of claim 1 , wherein the at least one fiber is a natural fiber, a chemical fiber, or a combination thereof.

4. The RRAM device of claim 3 , wherein the at least one fiber comprises polystyrene, polyester, or polyurethane.

5. The RRAM device of claim 1 , wherein the at least one fiber has a diameter of 20 nm to 150 μm.

6. The RRAM device of claim 1 , wherein the at least one fiber is a unidirectional fabric, a quasi-unidirectional fabric, a flat yarn, or a nanofiber.

7. The RRAM device of claim 1 , wherein the memory resistance layer is formed of one selected from the group consisting of silicon oxide, tungsten oxide, niobium oxide, germanium antimony telluride (Ge 2 Sb 2 Te 5 ), zirconium zirconium oxide, hafnium oxide, silicon carbide (SiC), titanium oxide, tantalum oxide, praseodymium calcium manganese oxide (PrCaMnO), polyflourene based organic material, zinc oxide, aluminum oxide, Nb-doped strontium titanium oxide (SrTiO 3 ), vanadium vanadium oxide, Al—Nb co-doped lead zirconium titanium oxide (PbZrTiO), lanthanum aluminum oxide (LaAlO 3 ), Cu-doped molybdenum oxide, gadolinium oxide, lanthanide oxide, praseodymium oxide, dysprosium oxide, europium oxide, and copper carbide (CuC).

8. The RRAM device of claim 1 , further comprising a connection to a textile-based sensor system.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 4, 2013
From: JEON, SANG-HUN; PARK, JONG-JIN; BAE, JI-HYUN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 031714/0839 →
Priority Claims (1)
KR 10-2012-0139831 · Dec 4, 2012 · national
Continuity (1)
Related Publication 20140151623A1 · Jun 5, 2014