Conformally encapsulated multi-electrode arrays with seamless insulation
Thin-film multi-electrode arrays (MEA) having one or more electrically conductive beams conformally encapsulated in a seamless block of electrically insulating material, and methods of fabricating such MEAs using reproducible, microfabrication processes. One or more electrically conductive traces are formed on scaffold material that is subsequently removed to suspend the traces over a substrate by support portions of the trace beam in contact with the substrate. By encapsulating the suspended traces, either individually or together, with a single continuous layer of an electrically insulating material, a seamless block of electrically insulating material is formed that conforms to the shape of the trace beam structure, including any trace backings which provide suspension support. Electrical contacts, electrodes, or leads of the traces are exposed from the encapsulated trace beam structure by removing the substrate.
1. An electrode array comprising:
at least one thin-film electrically conductive trace beam(s) suspension-encapsulated in a seamless single deposition-formed coating of electrically insulating material so that the coating continuously and conformably covers all surfaces of the trace beam(s) except an electrically conductive surface of at least one support portion(s) of the encapsulated trace beam(s) which is exposed through the coating.
2. The electrode array of claim 1 ,
wherein the support portion(s) is a via-formed post(s) extending through the seamless coating.
3. The electrode array of claim 1 ,
further comprising at least one trace backing(s) reinforcing the trace beam(s) to form at least one trace beam structure(s), and wherein the trace beam structure(s) is suspension-encapsulated in the seamless coating.
4. The electrode array of claim 3 ,
wherein the trace backing(s) and multiple trace beams form a multi-tiered trace beam structure that is suspension-encapsulated in the seamless coating.
5. The electrode array of claim 3 ,
further comprising at least one adhesion layer(s) between the trace beam structure(s) and the seamless coating.
6. The electrode array of claim 1 ,
further comprising a second electrically insulating material connecting at least two independently suspension-encapsulated trace beams together.
7. The electrode array of claim 1 ,
further comprising an adhesion promoting layer between the trace beam(s) and the seamless coating.