Method and apparatus for cooling electonic components
An apparatus for cooling electronic devices to be used in the vacuum of space is described. a window frame is provided as packaging for an electronic device having a substrate and a chip. The window frame includes an opening to allow a heat pipe to be in direct contact with a backside of the chip. The window frame is hermetically sealed to the backside of the chip. The window frame is also welded to a kovar ring located on the backside of the chip to provide a hermetic seal between the window frame and the substrate.
1. A method for cooling an electronic device, said method comprising:
providing a window frame as packaging for an electronic device having a substrate and a chip, wherein said window frame includes a center opening to allow a beat pipe to be in direct contact with a backside of said chip through said center opening;
sealing said window frame to said backside of said chip;
welding said window frame to an alloy ring located on said substrate to provide a hermetic seal between said window frame and said substrate; and
attaching a heat pipe to said backside of said chip.
2. The method of claim 1 , wherein said backside of said chip is metallized with a chrome/copper/gold stack.
3. The method of claim 1 , wherein said sealing further includes sealing said window-frame to said backside of said chip with a tin/antimony solder-preform.
4. The method of claim 1 , wherein said window frame is made of alloy.
5. A method for cooling an electronic device, said method comprising;
placing a heat spreader on a backside of a chip of an electronic device having a substrate;
bonding a window frame to said heat spreader, wherein said window frame includes a center opening to allow a heat pipe to be in direct contact with said heat spreader located on said backside of said chip through said center opening;
welding said window frame to an alloy ring located on said substrate to provide a hermetic seal between said window frame and said substrate; and
attaching a heat pipe to said heat spreader located on said backside of said chip.
6. The method of claim 5 , wherein said backside of said chip is metallized with a chrome/copper/gold stack.
7. The method of claim 6 , wherein silver glass is used as a bonding material for said chrome/copper/gold stack on said backside of said chip.
8. The method of claim 5 , wherein said bonding further includes bonding said window frame to said heat spreader via a gold-tin solder.
9. The method of claim 5 , wherein said window frame is made of alloy.
10. The method of claim 5 , wherein said heat spreader is made of aluminum nitride.
11. The method of claim 5 , wherein said heat spreader is made of silicon carbide.
12. An electronic device comprising:
a substrate;
a chip located on top of said substrate;
a heat spreader located on a backside of said chip;
an alloy ring located on top of said substrate; and
a window frame as packaging for said chip, wherein said window frame includes a center opening to allow a heat pipe to be in direct contact with said heat spreader located on said backside of said chip through said center opening, wherein said window frame is hermetically sealed to said heat spreader, wherein said window frame is welded to said alloy ring to provide a hermetic seal between said window frame and said substrate.
13. The electronic device of claim 12 , wherein said backside of said chip is metallized with a chrome/copper/gold stack.
14. The electronic device of claim 12 , wherein said heat spreader is made of aluminum nitride.
15. The electronic device of claim 12 , wherein said heat spreader is made of silicon carbide.
16. The electronic device of claim 12 , wherein said window frame is made of alloy.