Display device and method for manufacturing the same
A display device includes: a substrate; a pixel defining layer defining a pixel region on the substrate; a first electrode on the pixel region; a light emitting layer on the first electrode; a second electrode on the light emitting layer; a thin film encapsulation layer on the second electrode; a metal pattern on the thin film encapsulation layer and overlapping the pixel defining layer; and a multi-layer thin film layer on the metal pattern and the thin film encapsulation layer.
1. A method of manufacturing a display device, the method comprising:
forming a thin film encapsulation layer on a substrate, the substrate comprising a first electrode, a pixel defining layer defining a pixel region, a light emitting layer, and a second electrode;
coating a molybdenum thin film on the thin film encapsulation layer;
coating a molybdenum oxide (MoOx) thin film on the molybdenum thin film;
radiating laser light on the molybdenum oxide thin film overlapping the pixel region and oxidizing the molybdenum thin film overlapping the pixel region; and
forming a metal pattern by wet etching the oxidized molybdenum thin film and the molybdenum oxide thin film.
2. The method of claim 1 , wherein the forming of the metal pattern comprises wet etching the oxidized molybdenum thin film and the molybdenum oxide thin film utilizing water (H2O).
3. The method of claim 1 , wherein the oxidized molybdenum thin film is MoOx and X is in a range of X>2.
4. The method of claim 1 , further comprising forming a multi-layer thin film layer on the thin film encapsulation layer.
5. The method of claim 4 , wherein the forming of the multi-layer thin film layer comprises alternately laminating at least one dielectric layer and at least one metal layer.
6. The method of claim 1 , wherein the forming of the thin film encapsulation layer comprises alternately laminating at least one organic layer and at least one inorganic layer.
7. A method of manufacturing a display device, the method comprising:
forming a thin film encapsulation layer on a substrate, the substrate comprising a first electrode, a pixel defining layer defining a pixel region, a light emitting layer, and a second electrode;
coating a molybdenum thin film on the thin film encapsulation layer;
injecting oxygen (O2) into the molybdenum thin film overlapping the pixel region by ion implantation and oxidizing the molybdenum thin film overlapping the pixel region; and
forming a metal pattern by wet etching the oxidized molybdenum thin film.
8. The method of claim 7 , wherein the forming of the metal pattern comprises wet etching the oxidized molybdenum thin film utilizing water (H2O).
9. The method of claim 7 , wherein the oxidized molybdenum thin film is MoOx and X is in a range of X>2.
10. The method of claim 7 , further comprising forming a multi-layer thin film layer on the thin film encapsulation layer.
11. The method of claim 10 , wherein the forming of the multi-layer thin film layer comprises alternately laminating at least one dielectric layer and at least one metal layer.
12. The method of claim 7 , wherein the forming of the thin film encapsulation layer comprises alternately laminating at least one organic layer and at least one inorganic layer.