Metal-free CVD coating of graphene on glass and other dielectric substrates
A catalyst-free CVD method for forming graphene. The method involves placing a substrate within a reaction chamber, heating the substrate to a temperature between 600° C. and 1100° C., and introducing a carbon precursor into the chamber to form a graphene layer on a surface of the substrate. The method does not use plasma or a metal catalyst to form the graphene.
1. A method for forming graphene, comprising:
placing a substrate within a reaction chamber;
heating the substrate to a temperature between 600° C. and 1100° C.;
introducing a carbon precursor into the chamber and forming a graphene layer on a surface of the substrate, wherein the substrate is free of a metal catalyst and the chamber is free of plasma during the forming, wherein the substrate comprises glass or glass-ceramic.
2. The method according to claim 1 , wherein the substrate is a honeycomb substrate.
3. The method according to claim 1 , wherein the substrate is heated to a temperature between 700° C. and 1000° C.
4. The method according to claim 1 , wherein the carbon precursor is selected from the group consisting of acetylene, ethylene and methane.
5. The method according to claim 1 , wherein the chamber pressure is from 0.001 to 760 Torr.
6. The method according to claim 1 , wherein the graphene layer thickness is from 0.34 to 100 nm.
7. The method according to claim 1 , wherein the reaction chamber is free of hydrogen gas during the forming.
8. The method according to claim 1 , further comprising heating the graphene layer in vacuum without exposure to the carbon precursor.
9. The method according to claim 8 , wherein a metal catalyst is placed proximate to the graphene layer.
10. A method for forming graphene, comprising:
placing a honeycomb substrate within a reaction chamber;
heating the honeycomb substrate to a temperature between 600° C. and 1100° C.;
introducing a carbon precursor into the chamber and forming a graphene layer on a surface of the honeycomb substrate, wherein the honeycomb substrate is free of a metal catalyst and the chamber is free of plasma during the forming.