IP Library › Granted Patent US 9,511,469
Granted Patent B2
US 9,511,469 · App. 13/655,609 · Granted Dec 6, 2016

Polishing assembly and method for polishing using a platform and barrier in a tumbling process

Inventors: Chua Boon Beng (Singapore, SG); Thomas Tan (Singapore, SG); Kim Wei Cheah (Singapore, SG); Wai Tuck Chow (Singapore, SG)
Assignee: Pratt & Whitney Services PTE LTD.
B24B31/003B24B31/064B24B31/12F01D25/285F05D2230/18F05D2250/621Y10T428/31
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Quick Facts
Patent No.
US 9,511,469
App. No.
13/655,609
Granted
Dec 6, 2016
Kind
B2
Abstract

An example component polishing method includes polishing a component protecting portions of the component during the polishing using a barrier spaced from the component. The barrier is configured to move together with the component during the polishing.

Claims (24)

1. A component polishing method, comprising:

polishing a component;

protecting portions of the component during the polishing using a barrier spaced from the component, wherein the barrier is configured to move together with the component during the polishing;

holding the component and the barrier within a fixture during the polishing in one of a plurality of possible fixed positions, the component and the barrier selectively adjustable together relative to the fixture to the plurality of possible fixed positions within the fixture; and

prior to the polishing, adjusting the component and the barrier together relative to the fixture from the one of the plurality of possible fixed positions to another of the plurality of possible fixed positions, the adjusting changing how a media interfaces with the component and the barrier during the polishing,

wherein the barrier and the component move together relative to the fixture during the adjusting.

2. The component polishing method of claim 1 , wherein the polishing comprises vibratory polishing the component using a media held within a bin, wherein the component, the barrier, and the fixture are configured to move together relative to the bin during the polishing.

3. The component finishing method of claim 2 , wherein the barrier is spaced from the component a distance that is less than a thickness of a media used in the polishing.

4. The component finishing method of claim 1 , including holding the component and at least one other component within the fixture.

5. The component finishing method of claim 1 including holding first ends of the component and the barrier within a first platform and holding opposing second ends of the component and the barrier within a second platform.

6. a base structure of a polishing assembly, comprising:

a platform configured to engage a component; a barrier extending from the platform, the barrier spaced from the component when the platform engages the component, the barrier configured to move together with the component during a polishing process, wherein the platform is held within a support , and a position of the platform and the barrier relative to the support is selected from one of a plurality of possible fixed positions, the plurality of possible fixed positions defined by the platform , the support, or both, wherein a pin associated with each platform is received within one of a plurality of apertures to limit rotation of the barrier and the platform relative to the support, the plurality of apertures providing the plurality of possible fixed positions.

7. The base structure of claim 6 , wherein the polishing process is a vibratory polishing process using media held within a bin, wherein the platform, the barrier, and the component are configured to move together during the polishing process relative to the bin.

8. The base structure of claim 6 , wherein the platform is held within a recessed area of the support, and each of the at least one other platforms is held within another recessed area of the support.

9. The base structure of claim 6 , wherein the pin extends from the associated platform and the support establishes the plurality of apertures.

10. A polishing component, comprising:

A component having first surfaces and second surfaces, wherein the first surfaces were directly contacted by media during a polishing and a barrier extending from a platform held in a fixture was spaced from the second surfaces to limit contact between the media and the second surfaces during the polishing, wherein the component and the barrier were held within the fixture during the polishing, and wherein the component and the barrier are adjustable together relative to the fixture to one of a plurality of fixed positions, wherein a pin associated with each platform is received within one of a plurality of apertures to limit rotation of the barrier and the platform relative to the fixture, the plurality of apertures providing the plurality of possible fixed positions.

11. The polished component of claim 10 , wherein the component is a turbomachine component.

12. The polished component of claim 10 , wherein the first surfaces were directly contacted by media during a vibratory polishing, the media held within a bin, wherein the component, the barrier, and the fixture are configured to move relative to the bin during the vibratory polishing.

13. The polished component of claim 10 , wherein the component is an airfoil.

14. The polished component of claim 10 , wherein the component is an integrally bladed rotor.

15. the component polishing method of claim 1 , wherein the barrier and the component rotate together relative to the fixture during the adjusting.

16. The component polishing method of claim 5 , wherein the plurality of possible fixed positions are defined within the fixture, the first platform, or both, wherein the plurality of possible fixed positions are distributed annularly about an axis.

17. The base structure of claim 6 , wherein the platform and the barrier are moveable together relative to the support between the plurality of possible fixed positions, wherein the plurality of possible fixed positions are distributed annularly about an axis.

Assignments (2)
CHANGE OF NAME Recorded Jul 27, 2023
From: RAYTHEON TECHNOLOGIES CORPORATION
To: RTX CORPORATION
Reel/Frame 064714/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2012
From: BOON BENG, CHUA; TAN, THOMAS; CHEAH, KIM WEI; CHOW, WAI TUCK
To: PRATT & WHITNEY SERVICES PTE LTD.
Reel/Frame 029157/0584 →
Priority Claims (1)
SG 2012040689 · Jun 1, 2012 · national
Continuity (1)
Related Publication 20130323071A1 · Dec 5, 2013