Thermoformable multilayer films and blister packs produced therefrom
A multi-layer film structure for use in forming blister packaging. The multi-layer structure includes a first polymeric layer having a first surface and a second surface, the first polymeric layer comprising a metalized polyethylene teraphthalate, a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer disposed adjacent the second surface of the first polymeric layer, the second polymeric layer comprising a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer disposed adjacent the second surface of the second polymeric layer, the third polymeric layer comprising polypropylene or polyvinyl chloride. A method of making a multi-layer film structure and a packaging structure are also provided.
1. A film in the form of a thermoformed body having a cupped shape, said thermoformed body having an outer surface, said film consisting of:
(a) a first polymeric layer having a first surface and a second surface, said first polymeric layer consisting essentially of a metalized polyethylene terephthalate which provides a chrome or mirror-like appearance to said outer surface;
(b) a second polymeric layer having a first surface and a second surface, said first surface of said second polymeric layer disposed adjacent said second surface of said first polymeric layer, said second polymeric layer consisting essentially of a cyclic olefin or a homopolymer of chlorotrifluoroethylene; and
(c) a third polymeric layer having a first surface and a second surface, said first surface of said third polymeric layer disposed adjacent said second surface of said second polymeric layer, said third polymeric layer consisting essentially of polypropylene or polyvinyl chloride,
wherein the thermoformed body having a cupped shape includes a planar base outwardly terminating in an upwardly extending side wall.
2. A multi-layer film structure consisting of:
(a) a first polymeric layer having a first surface and a second surface, said first polymeric layer consisting essentially of a metalized polyethylene terephthalate, in which a metalized layer is formed on the first polymeric layer by at least one of the processes of metallization consisting of vacuum deposition, indirect metallization, electro-less plating, electrolytic plating and lacquer painting, and the metal consists of at least one metal selected from a group of metals consisting of aluminum, copper, silver, gold, brass and bronze;
(b) a second polymeric layer having a first surface and a second surface, said first surface of said second polymeric layer disposed adjacent said second surface of said first polymeric layer, said second polymeric layer consisting essentially of a cyclic olefin or a homopolymer of chlorotrifluoroethylene; and
(c) a third polymeric layer having a first surface and a second surface, said first surface of said third polymeric layer disposed adjacent said second surface of said second polymeric layer, said third polymeric layer consisting essentially of polypropylene or polyvinyl chloride.