Display device and method of manufacturing the same
A display device and a method of manufacturing the same are disclosed. In one aspect, the display device includes a display area formed over a substrate and configured to display an image, and a pad area formed over the substrate surrounding the display area and configured to provide an electrical signal to the display area. The pad area includes a first electrode layer formed over the substrate and electrically connected to the display area and a second electrode layer formed over the first electrode layer and electrically connected to the first electrode layer. The pad area also includes a first organic layer bonded to a portion of the second electrode layer at a first adhesion strength, a third electrode layer bonded to the first organic layer at a second adhesion strength and electrically connected to the second electrode layer, and a flexible PCB electrically connected to the third electrode layer.
1. A display device comprising:
a flexible substrate;
a display area formed over one area of the substrate and configured to display an image; and
a pad area formed over another area of the substrate configured to provide an electrical signal to the display area,
wherein the pad area includes:
a first electrode layer formed over the substrate and electrically connected to the display area;
a second electrode layer formed over the first electrode layer and electrically connected to the first electrode layer;
a first organic layer bonded to a portion of the second electrode layer;
a third electrode layer bonded to the first organic layer and electrically connected to the second electrode layer; and
a flexible printed circuit board (PCB) electrically connected to the third electrode layer.
2. The display device of claim 1 , further comprising an adhesive layer bonded to the first organic layer and bonded to the third electrode layer.
3. The display device of claim 2 , wherein the adhesive layer is an amorphous silicon layer.
4. The display device of claim 1 , further comprising a second organic layer formed between the first and second electrode layers.
5. The display device of claim 4 , further comprising:
a fourth electrode layer formed over the second organic layer and electrically connected to the first and second electrode layers; and
a third organic layer formed over the fourth electrode layer,
wherein the second electrode layer is formed over the third organic layer.
6. The display device of claim 5 , wherein the second to fourth electrode layers have the same width.
7. The display device of claim 1 , wherein the first organic layer is formed of an electrical insulating material.
8. The display device of claim 1 , wherein the first organic layer is bonded to the second electrode layer at a first adhesion strength, the third electrode layer is bonded to the first organic layer at a second adhesion strength, the adhesive layer is bonded to the third electrode layer at a fourth adhesion strength, and
wherein the first adhesion strength is less than the second adhesion strength and the first adhesion strength is less than the third adhesion strength and the fourth adhesion strength. the substrate is flexible.
9. The display device of claim 1 , further comprising a buffer layer formed over the substrate so as to protect the substrate.
10. The display device of claim 1 , wherein the display area includes a pixel configured to display the image,
wherein the pixel includes i) a thin film transistor including a gate electrode, a source electrode, and a drain electrode, and ii) a pixel electrode electrically connected to the drain electrode,
wherein the first electrode layer is formed on the same layer as the gate electrode,
wherein the second electrode layer is formed on the same layer as the source and drain electrodes, and
wherein the third electrode layer is formed on the same layer as the pixel electrode.
11. The display device of claim 1 , wherein the second and third electrodes have the same width.
12. A method of manufacturing a display device, the method comprising:
forming a display area over one area of a flexible substrate and configured to display an image; and
forming a pad area over another area of the substrate and configured to provide an electrical signal to the display area, wherein the forming of the pad area includes:
forming a first electrode layer electrically connected to the display area;
forming a second electrode layer over the first electrode layer and electrically connected to the first electrode layer;
forming a third electrode layer electrically connected to the second electrode layer;
adhering a first organic layer to the second electrode layer at a first adhesion strength and the third electrode layer at a second adhesion strength, wherein the first adhesion strength is greater than the second adhesion strength;
electrically connecting a first flexible printed circuit board (PCB) to the third electrode layer;
testing for defects in the display device;
separating the first organic layer from the second electrode layer so as to remove the first flexible PCB when there are defects in the display device; and
connecting a second flexible PCB to the second electrode layer.
13. The method of claim 12 , wherein the forming of the first organic layer includes:
forming an adhesive layer on a first surface of the first organic layer; and
bonding a second surface of the first organic layer to the second electrode layer.
14. The method of claim 13 , further comprising forming a second organic layer between the first and second electrode layers.
15. The method of claim 14 , further comprising:
forming a fourth electrode layer over the second organic layer and electrically connected to the first and second electrode layers; and
forming a third organic layer over the fourth electrode layer,
wherein the second electrode layer is formed over the third organic layer.
16. A display device comprising:
a flexible substrate;
a display area formed over one area of the substrate and configured to display an image; and
a pad area formed over another area of the substrate and configured to provide an electrical signal to the display area,
wherein the pad area includes:
a first electrode layer formed over the substrate;
a second electrode layer formed over and directly contacting the first electrode layer;
a first organic layer bonded to a portion of the second electrode layer;
a second organic layer formed between the portion of the second electrode layer and a portion of the first electrode layer;
a third electrode layer bonded to the first organic layer, wherein the third electrode layer directly contacts the second electrode layer; and
a flexible printed circuit board (PCB) formed over the first to third electrode layers.
17. The display device of claim 16 , further comprising an adhesive layer bonded to the first organic layer and bonded to the third electrode layer.
18. The display device of claim 16 , further comprising:
a fourth electrode layer formed over the second organic layer and electrically connected to the first and second electrode layers; and
a third organic layer formed over the fourth electrode layer,
wherein the second electrode layer is formed over the third organic layer.
19. The display device of claim 16 , wherein the substrate is flexible.
20. The display device of claim 16 , wherein the display area includes a pixel configured to display the image,
wherein the pixel includes i) a thin film transistor including a gate electrode, a source electrode, and a drain electrode, and ii) a pixel electrode electrically connected to the drain electrode,
wherein the first electrode layer is formed on the same layer as the gate electrode,
wherein the second electrode layer is formed on the same layer as the source and drain electrodes, and
wherein the third electrode layer is formed on the same layer as the pixel electrode.