Semiconductor devices and methods of manufacturing the same

1. A semiconductor device, comprising:

a pair of line patterns disposed on a substrate;

a contact plug disposed between the pair of line patterns;

an air gap disposed between the contact plug and the line patterns;

a landing pad extending from a top end of the contact plug to cover a first part of the air gap; and

an insulating layer disposed on a second part of the air gap, which is not covered by the landing pad;

wherein each of the pair of line patterns comprises a conductive wire and a hard mask pattern sequentially stacked on the substrate, the hard mask pattern comprising an insulating material, and

wherein the landing pad is contact with a top surface of the hard mask pattern of a line pattern adjacent to the first part of the air gap.

2. The semiconductor device of claim 1 , wherein a height of the first part of the air gap covered by the landing pad is greater than a height of the second part of the air gap not covered by the landing pad.

3. The semiconductor device of claim 1 , further comprising:

a first protecting spacer disposed between the line pattern and the contact plug; and

a second protecting spacer disposed between the contact plug and the first protecting spacer,

wherein the air gap is disposed between the first protecting spacer and the second protecting spacer.

4. The semiconductor device of claim 3 , wherein top ends of the first and second protecting spacers under the landing pad are in contact with each other, so that a top end of the first part of the air gap is closed by the top ends of the first and second protecting spacers under the landing pad.

5. The semiconductor device of claim 3 , wherein a top end of the first part of the air gap is closed by the landing pad.

6. The semiconductor device of claim 1 , further comprising:

a pair of insulating fences disposed between the pair of line patterns,

wherein the contact plug is disposed between the pair of line patterns and between the pair of insulating fences; and

wherein a bottom surface of the contact plug has a quadrangular shape in a plan view.

7. The semiconductor device of claim 1 , further comprising:

a selection component under the line patterns on the substrate; and

a data storage part electrically connected to a top surface of the landing pad,

wherein each of the line patterns includes a conductive wire;

wherein the conductive wire of one of the pair of line patterns is electrically connected to a first terminal of the selection component; and

wherein the data storage part is electrically connected to a second terminal of the selection component through the landing pad and the contact plug.

8. A semiconductor device, comprising:

a pair of line patterns disposed on a substrate;

a contact plug disposed between the pair of line patterns;

an air gap disposed between the contact plug and the line patterns;

a landing pad extending from a top end of the contact plug to cover a first part of the air gap; and

an insulating layer disposed on the landing pad and a second part of the air gap, which is not covered by the landing pad;

wherein the air gap has a closed loop-shape surrounding the contact plug in a plan view.

9. A semiconductor device, comprising:

a pair of line patterns disposed on a substrate;

a contact plug disposed between the pair of line patterns; and

a spacer structure disposed between the contact plug and each of the line patterns,

wherein the spacer structure comprises:

a first protecting spacer adjacent to each of the line patterns;

a second protecting spacer adjacent to a sidewall of the contact plug; and

an air gap disposed between the first and second protecting spacers;

wherein the second protecting spacer extends to surround the sidewall of the contact plug and has a closed loop-shape in a plan view;

wherein the air gap extends to surround the sidewall of the contact plug and has a closed loop-shape in a plan view; and

wherein the first protecting spacer has a line-shape extending along a sidewall of each of the line patterns.

10. The semiconductor device of claim 9 , further comprising:

a pair of insulating fences disposed between the pair of line patterns,

wherein the contact plug is disposed between the pair of line patterns and between the pair of insulating fences; and

wherein the extending part of the air gap is disposed between the extending part of the second protecting spacer and each of the insulating fences.