IP Library Granted Patent US 9,520,779
Granted Patent B2
US 9,520,779 · App. 15/072,675 · Granted Dec 13, 2016

Three-D power converter in three distinct strata

Inventors: Paul S. Andry (Yorktown Heights, NY); Leland Chang (New York, NY); Evan G. Colgan (Chestnut Ridge, NY); John U. Knickerbocker (Yorktown Heights, NY); Bucknell C. Webb (Yorktown Heights, NY); Robert Wisnieff (Ridgefield, CT)
Assignee: International Business Machines Corporation
H02M3/156G06F1/263G06F1/266H01L23/642H01L23/645H01L24/14H01L24/17H01L25/0657H01L2224/16145H01L2224/16265
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Quick Facts
Patent No.
US 9,520,779
App. No.
15/072,675
Granted
Dec 13, 2016
Kind
B2
Abstract

A switching power supply in an integrated circuit, an integrated circuit comprising a switching power supply, and a method of assembling a switching power supply in an integrated circuit are disclosed. In one embodiment, the invention provides a three-dimensional switching power supply in an integrated circuit comprising a device layer. The switching power supply comprises three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors. This switching power supply further comprises a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer. The switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.

Claims (47)

1. A three-dimensional switching power supply in an integrated circuit stack comprising a device layer including a plurality of processor cores, the switching power supply comprising:

three distinct strata arranged in series with the device layer, the three distinct strata including

a switching layer including switching circuits,

a capacitor layer including banks of capacitors, and

an inductor layer including inductors; and

a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer; and wherein:

the switching circuits, the capacitors and the inductors form a plurality of switching power supplies, each of the switching power supplies supplying power to a respective one of the processor cores.

2. The three-dimensional switching power supply according to claim 1 , wherein each of the switching power supplies applies a respective one voltage level to one of the processor cores.

3. The three-dimensional switching power supply according to claim 1 , wherein each of the switching power supplies includes a voltage regulator to regulate the voltage level applied to the respective one of the processor cores.

4. The three-dimensional switching power supply according to claim 1 , wherein:

the processor cores are on a common processor chip; and

the switching power supplies generate the respective one voltage level on said processor chip.

5. The three-dimensional switching power supply according to claim 4 , wherein the voltage regulators are integrated in the processor chip.

6. The three-dimensional switching power supply according to claim 5 , wherein the voltage regulators provide local on-chip generation of different voltages.

7. The three-dimensional switching power supply according to claim 6 , wherein the switching power supplies apply different voltages to different areas of the common processor chip.

8. The three-dimensional switching power supply according to claim 1 , wherein each of the switching power supplies is controllable to apply a controllable voltage to each of the processor cores.

9. The three-dimensional switching power supply according to claim 8 , wherein the switching power supplies are separately controllable.

10. The three dimensional switching power supply according to claim 1 , wherein the switching power supplies operate different portions of the processor cores at different voltages.

11. An integrated circuit comprising:

a device layer including a plurality of processor cores;

a switching power supply comprising three distinct strata arranged in series with the device layer, the three distinct strata including

a switching layer including switching circuits,

a capacitor layer including banks of capacitors, and

an inductor layer including inductors; and

a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer; and wherein:

the switching circuits, the capacitors and the inductors form a plurality of switching power supplies, each of the switching power supplies supplying power to a respective one of the processor cores.

12. The integrated circuit according to claim 11 , wherein:

each of the switching power supplies applies a respective one voltage level to one of the processor cores; and

each of the switching power supplies includes a voltage regulator to regulate the voltage level applied to the respective one of the processor cores.

13. The integrated circuit according to claim 12 , wherein:

the processor cores are on a common processor chip:

the switching power supplies generate the respective one voltage level on said processor chip; and

the voltage regulators are integrated on the processor chip and provide local on-chip generation of different voltages.

14. The integrated circuit according to claim 13 , wherein the switching power supplies apply different voltages to different areas of the common processor chip.

15. The integrated circuit according to claim 11 , wherein each of the switching power supplies are separately controllable to apply a separately controllable voltage to each of the processor cores.

16. A method of assembling a switching power supply in an integrated circuit, the switching power supply including three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors, the integrated circuit including a device layer including a plurality of processor cores, the method comprising:

arranging the three distinct strata of the switching power supply in series with the device layer; and

electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer to form a plurality of switching power supplies, each of the switching power supplies supplying power to a respective one of the processor cores.

17. The method according to claim 16 , wherein:

each of the switching power supplies applies a respective one voltage level to one of the processor cores; and

each of the switching power supplies includes a voltage regulator to regulate the voltage level applied to the respective one of the processor cores.

18. The method according to claim 16 , wherein

the processor cores are on a common processor chip:

the switching power supplies generate the respective one voltage level on said processor chip; and

the voltage regulators are integrated on the processor chip and provide local on-chip generation of different voltages.

19. The method according to claim 16 , wherein the switching power supplies apply different voltages to different areas of the common processor chip.

20. The method according to claim 19 , wherein the switching power supplies operate different portions of the processor cores at different voltages.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 17, 2016
From: ANDRY, PAUL S.; CHANG, LELAND; COLGAN, EVAN G.; KNICKERBOCKER, JOHN U.; WEBB, BUCKNELL C.; WISNIEFF, ROBERT
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 038012/0696 →
Continuity (2)
Continuation 14178791 · Feb 12, 2014
Related Publication 20160254744A1 · Sep 1, 2016