Sensor integration with an outgassing barrier and a stable electrical signal path

1. An integrated circuit (IC) comprising:

a semiconductor die comprising a first top surface and a first bottom surface;

a MEMS (micro-electromechanical system) die comprising a second top surface and a second bottom surface, wherein the MEMS die is disposed over the semiconductor die, and the first top surface is coupled to the second top surface;

a cap bonded to the second bottom surface defining a cavity between the MEMS die and the cap; and

an outgas barrier layer disposed within the MEMS die configured to prevent outgassing from the semiconductor die to the cavity;

wherein the MEMS die comprises:

a MEMS substrate and a MEMS interconnect;

patterned conductors disposed within an oxide layer of the MEMS interconnect, and wherein the outgas barrier layer is disposed between the MEMS substrate and the oxide layer; and

an electrode layer formed between the outgas barrier layer and the MEMS substrate.

2. The IC of claim 1 , wherein the first top surface of the semiconductor die comprises an oxide layer separating two patterned conductors.

3. The IC of claim 1 , wherein the outgas barrier layer comprises polysilicon or a metal.

4. The IC of claim 1 , wherein the MEMS die is bonded to the semiconductor die through direct bonding between patterned conductors on the first top surface and patterned conductors on the second top surface.

5. The IC of claim 4 , wherein the patterned conductors on the first top surface and the second top surface comprise Cu (copper).

6. The IC of claim 1 ,

wherein the patterned conductors and oxide layer have co-planar surfaces that collectively define the second top surface.

7. The IC of claim 1 , wherein the cap is bonded with the MEMS die through a eutectic bond or a fusion bond.

8. The IC of claim 1 , wherein the semiconductor die comprises a CMOS (complementary metal oxide semiconductor) die.

9. An integrated circuit (IC) comprising:

a semiconductor die comprising a semiconductor interconnect overlying a semiconductor substrate, wherein the semiconductor interconnect comprises a first oxide layer and two patterned conductors which are co-planar and which form a top surface of the semiconductor interconnect;

a MEMS (micro-electromechanical system) die comprising a MEMS interconnect overlying a MEMS substrate, wherein the MEMS interconnect includes a second oxide layer and two patterned MEMS conductors that are co-planar and form a top surface of the MEMS interconnect, wherein:

the MEMS die is disposed over the semiconductor die, and the top surface of the MEMS interconnect abuts the top surface of the semiconductor interconnect, aligning the two patterned MEMS conductors with the two patterned conductors of the semiconductor die;

the MEMS die is coupled to the semiconductor die through a direct bond;

a cap bonded to a bottom surface of the MEMS substrate, defining a cavity between the MEMS die and the cap;

an outgas barrier layer disposed between the MEMS substrate and the second oxide layer, configured to prevent outgassing from the semiconductor die to the cavity; and

an electrode layer formed between the outgas barrier layer and the MEMS substrate.

10. The IC of claim 9 , wherein the outgas barrier layer comprises poly silicon or a metal.

11. The IC of claim 9 , wherein an area of the outgas barrier layer is the same as an area of the semiconductor die.

12. The IC of claim 9 , wherein the electrode layer comprises poly silicon or a metal.

13. The IC of claim 9 , wherein the semiconductor die comprises a CMOS (complementary metal oxide semiconductor) die.

14. An integrated circuit (IC) comprising:

a CMOS (complementary metal oxide semiconductor) die comprising a CMOS semiconductor substrate with CMOS devices in or on the CMOS semiconductor substrate and a CMOS interconnect structure made up of metal lines and vias that couple the CMOS devices to one another, wherein a top surface of the CMOS die corresponds to an uppermost surface of the CMOS interconnect structure and a bottom surface of the CMOS die corresponds to a bottom surface of the CMOS semiconductor substrate;

a MEMS (micro-electromechanical system) die comprising a MEMS semiconductor substrate including a MEMS device and a MEMS interconnect structure made of metal lines and vias electrically coupled to the MEMS device, wherein a top surface of the MEMS die corresponds to an uppermost surface of the MEMS interconnect structure and a bottom surface of the MEMS die corresponds to a bottom surface of the MEMS semiconductor substrate, the top surface of the MEMS die being in direct physical and electrical contact with the top surface of the CMOS die; and

a cap bonded to the bottom surface of the MEMS die and defining a cavity between the MEMS die and the cap, wherein the cavity is hermetically sealed from an ambient environment around the IC;

wherein the MEMS interconnect structure includes an outgas barrier layer configured to prevent outgassing, which is generated by the CMOS interconnect structure, from reaching the cavity;

wherein the MEMS device includes a proof mass surrounded on multiple sides by anchors and by springs which moveably couple the proof mass to the anchors, and wherein the outgas barrier layer comprises a continuous sheet of polysilicon or metal that extends continuously over the proof mass, the springs, and the anchors.

15. The IC of claim 14 , wherein the MEMS die further comprises:

a conductive electrode lining an inner surface of the cavity between the proof mass and the MEMS interconnect structure; and

an oxide separating the conductive electrode from the outgas barrier layer in the MEMS interconnect structure.

16. The IC of claim 14 , wherein the outgas barrier layer is encapsulated by oxide and is electrically isolated from the metal lines and the vias of the MEMS interconnect structure.

17. The IC of claim 14 , wherein the top surface of the CMOS die comprises a first set of patterned conductors laterally separated by a first oxide.

18. The IC of claim 17 , wherein the top surface of the MEMS die comprises a second set of patterned conductors laterally separated by a second oxide.

19. The IC of claim 18 , wherein the first set of patterned conductors correspond to the second set of patterned conductors so as to form a direct electrical connection between the MEMS die and CMOS die.