IP Library Granted Patent US 9,523,071
Granted Patent B2
US 9,523,071 · App. 13/060,682 · Granted Dec 20, 2016

Pipette tip for electroporation device

Inventors: Jun-Keun Chang (Seoul, KR); Keun-Chang Cho (Seoul, KR); Chan-Il Chung (Gyeonggi-Do, KR); Neon-Cheol Jung (Gyeonggi-Do, KR); Seung Gin Huh (Gyeonggi-do, KR)
Assignee: Life Technologies Corporation
C12M35/02
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Quick Facts
Patent No.
US 9,523,071
App. No.
13/060,682
Granted
Dec 20, 2016
Kind
B2
Abstract

Provided herein is a pipette tip ( 600 ) for electroporation including an outer surface, a void ( 611 ) located within the outer surface, and a conductor ( 622 ) located at least partially on or within the outer surface, in electrical communication with at least a portion of the outer surface and the void. Further provided herein is a pipette tip for electroporation including a body, a connector ( 620 ), and an elongated part ( 630 ). The connector is located at the distal end of the body and further includes at least one connecting post, a connecting part in mechanical communication with the connector, and a conductor located at least partially on or within the connector, wherein the conductor surrounds at least a portion of the connecting post. The elongated part also has a void and is located at the distal end of the connector. The void of the body, connector, and elongated part are in fluid communication.

Claims (16)

1. An electroporation device comprising:

a pipette tip including an outer surface and a void located within the outer surface, wherein the pipette tip has proximal and distal ends, wherein the pipette tip comprises:

a combining part, wherein the combining part is located at the proximal end of the pipette tip and is configured to removably connect to a pipette;

an elongated part located at the distal end of the pipette tip;

a connecting part including at least two connecting posts located between the combining part and the elongated part along the pipette tip; and

a conductor, wherein the conductor is located at least partially within the combining part and is in electrical communication with at least a portion of the outer surface and the void through a gap between the connecting posts.

2. The pipette tip of claim 1 wherein the conductor is in fluid communication with the void.

3. The pipette tip of claim 1 wherein the conductor is ring-shaped.

4. The pipette tip of claim 1 where in the conductor includes a body portion and a surface.

5. The pipette tip of claim 4 wherein the body portion includes a conductive material.

6. The pipette tip of claim 5 wherein the conductive material is selected from at least one of copper, brass, nickel, gold, silver, or aluminum.

7. The pipette tip of claim 4 wherein the body portion is an injection molded conductor.

8. The pipette tip of claim 7 wherein the injection molded conductor includes at least one of plastic or conductive polymer.

9. The pipette tip of claim 4 wherein the surface is plated with at least one of brass, copper, aluminum, nickel, gold, or silver.

10. The pipette tip of claim 1 wherein the connector part is funnel shaped.

11. The pipette tip of claim 1 comprising three connecting posts.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 24, 2011
From: CHANG, JUN-KEUN; CHO, KEUN-CHANG; CHUNG, CHAN-IL; JUNG, NEON-CHEOL; HUH, SEUNG GIN
To: LIFE TECHNOLOGIES CORPORATION
Reel/Frame 027106/0883 →
Priority Claims (1)
KR 10-2008-0034744 · Apr 15, 2008 · national
Continuity (1)
Related Publication 20110263005A1 · Oct 27, 2011