Organic light emitting diode device and method for fabricating the same
Disclosed are an organic light emitting diode device, and a method for fabricating the same. The organic light emitting diode device comprises a non-active area formed outside an active area of a substrate; a switching thin film transistor and a driving thin film transistor at each of the pixel regions; a planarization layer on the substrate; a first electrode on the planarization layer; a bank formed in the non-active area outside each pixel region; an organic light emitting layer on the first electrode; a second electrode on an entire surface of the substrate; a first passivation layer on the substrate; an organic layer on the first passivation layer; a second passivation layer on the organic layer and the first passivation layer; a barrier film disposed to face the substrate.
1. A method for fabricating an organic light emitting diode device, the method comprising:
providing a substrate divided into an active area including a plurality of pixel regions, and a non-active area formed outside the active area;
forming a switching thin film transistor and a driving thin film transistor at each of the pixel regions on the substrate;
forming a planarization layer on the substrate including the switching thin film transistor and the driving thin film transistor;
forming a moisture blocking portion at the planarization layer in the non-active area;
forming, on the planarization layer, a first electrode connected to a drain electrode of the driving thin film transistor;
forming a bank in the non-active area outside each pixel region of the substrate including the first electrode;
forming an organic light emitting layer on the first electrode in the pixel region;
forming a second electrode on an entire surface of the substrate including the organic light emitting layer;
forming a first passivation layer on an entire surface of the substrate including the second electrode;
forming an organic layer on the first passivation layer;
forming a second passivation layer on the organic layer and the first passivation layer;
forming a barrier film so as to face the substrate; and
forming an adhesive between the substrate and the barrier film, the adhesive configured to attach the substrate and the barrier film to each other to thus implement a panel state.
2. The method of claim 1 , wherein the moisture blocking portion is formed in at least one in number, along an edge region of the non-active area of the substrate.
3. The method of claim 1 , wherein the moisture blocking portion is formed at the planarization layer corresponding to driving circuit lines, in the non-active area of the substrate.
4. The method of claim 3 , wherein the moisture blocking portion is formed at the planarization layer positioned above a driving circuit line to which a direct current is applied, among the gate driving circuit lines.
5. The method of claim 1 , wherein an auxiliary electrode pattern, electrically connected to the first electrode and having a plurality of anode holes, is formed on the planarization layer, in the non-active area of the substrate.
6. The method of claim 5 , wherein the auxiliary electrode pattern is simultaneously formed with the first electrode.
7. The method of claim 1 , wherein the substrate is configured as one of a glass substrate, a flexible glass substrate and a plastic substrate.