Semiconductor device and method of manufacturing a semiconductor device

1. A method of manufacturing a semiconductor device, comprising:

forming a super-junction field effect transistor by:

forming trenches in a semiconductor body from a first side, wherein a depth of the trenches ranges between 10 μm and 120 μm;

forming charge compensation layers by doping parts of the semiconductor body via sidewalls of the trenches by introducing dopants by plasma doping; and thereafter

forming an out-diffusion barrier layer on the sidewalls of the trenches; and thereafter

widening a profile of the dopants introduced by plasma doping by diffusion caused by a thermal heating process, wherein the super-junction field effect transistor has a breakdown voltage of at least 100 V; and

forming a drain contact at a second side opposite to the first side, and wherein

doping the parts of the semiconductor body by plasma doping comprises introducing dopants into the parts of the semiconductor body via the sidewalls of the trenches at a dose in a range of 5×10 11 cm −2 to 5×10 12 cm −2 ;

doping the parts of the semiconductor body by plasma doping comprises adjusting a DC-voltage pulse rise time smaller than 0.1 μs; and

wherein a surface concentration of dopants introduced by plasma doping via a unit area of the sidewalls is at least ten times larger than a concentration of dopants in a mesa region of the semiconductor body between neighboring trenches which corresponds to N, wherein N is a net doping of the semiconductor body between the neighboring trenches.

2. The method of claim 1 , wherein the semiconductor body is a silicon semiconductor body.

3. The method of claim 1 , wherein the semiconductor body is a silicon carbide semiconductor body.

4. The method of claim 1 , wherein doping the parts of the semiconductor body by plasma doping comprises adjusting a DC-voltage pulse distance in a range of 100 μs to 10 ms.

5. The method of claim 1 , wherein doping the parts of the semiconductor body by plasma doping comprises adjusting a DC-voltage pulse width in a range of 0.5 μs to 20 μs.

6. The method of claim 1 , further comprising filling the trenches with a semiconductor material.

7. The method of claim 1 , further comprising filling the trenches with an insulating material.

8. The method of claim 1 , further comprising forming a first semiconductor layer on the doped parts of the semiconductor body.

9. The method of claim 8 , wherein the forming the first semiconductor layer on the doped parts of the semiconductor body comprises forming a silicon layer by lateral epitaxy or low-temperature chemical vapor deposition.

10. The method of claim 8 , wherein forming the first semiconductor layer on the doped parts of the semiconductor body comprises:

forming an amorphous silicon layer on the doped parts of the semiconductor body; and

crystallizing the amorphous silicon layer by a heat treatment.

11. The method of claim 1 , further comprising forming an insulating outdiffusion barrier layer on the parts of the semiconductor body.

12. The method of claim 1 , wherein a transistor device is formed as the semiconductor device including the doped parts of the semiconductor body as an edge termination structure.

13. The method of claim 1 , wherein the semiconductor body includes a drift zone of a first conductivity type, and wherein doping the parts of the semiconductor body by plasma doping comprises doping the parts of the semiconductor body with dopants of a second conductivity type complementary to the first conductivity type.

14. The method of claim 1 , wherein the semiconductor body includes a drift zone of a first conductivity type, and wherein doping the parts of the semiconductor body by plasma doping comprises doping the parts of the semiconductor body with dopants of the first conductivity type, the method further comprising:

forming a first semiconductor layer over the parts of the semiconductor body in the trenches; and

doping the first semiconductor layer by plasma doping with dopants of a second conductivity type complementary to the first conductivity type.

15. The method of claim 14 , further comprising:

removing the first semiconductor layer from a bottom side of the trenches;

forming a second semiconductor layer over the first semiconductor layer in the trenches; and

doping the second semiconductor layer by plasma doping with dopants of the first conductivity type.

16. The method of claim 1 , further comprising forming body regions in the semiconductor body at the first side, the body regions overlapping the charge compensation layers.