Phase change memory and method of fabricating same
A phase change memory (“PCM”) cell is provided in accordance with some embodiments. The PCM includes a spacer defining a reaction area; a phase change material layer disposed within the reaction area; a protection layer disposed over the phase change material layer and within the reaction area defined by the spacer; and a capping layer disposed over the protection layer and the spacer.
1. A phase change memory (PCM) cell comprising:
a spacer defining a reaction area;
a phase change material layer disposed within the reaction area;
a protection layer disposed over the phase change material layer and within the reaction area defined by the spacer;
a first electrode and a second electrode disposed within a dielectric material layer below the phase change material layer such that the first electrode is separated from the second electrode by the dielectric material layer, the first electrode and the second electrode physically contacting the phase change material layer; and
a capping layer disposed over the protection layer and the spacer.
2. The PCM cell of claim 1 , wherein the first electrode physically contacts the spacer.
3. The PCM cell of claim 1 further comprising a stop layer disposed along an outer edge of the spacer.
4. The PCM cell of claim 1 wherein the spacer comprises at least one of SiN, SiO 2 , and SiON and has a thickness in a range of approximately 100 Å-500 Å.
5. The PCM cell of claim 1 wherein the phase change material comprises a GeSbTe alloy film.
6. The PCM cell of claim 1 wherein the protection layer comprises one of SiN and SiO 2 and has a thickness in a range of 200 Å-500 Å.
7. The PCM cell of claim 1 wherein the capping layer comprises SiN and has a thickness in a range of 400 Å-1000 Å.
8. The PCM cell of claim 1 further comprising a conductor disposed below and in physical contact with the first electrode.
9. A phase change memory (PCM) cell comprising:
a spacer formed on a substrate and defining a reaction area;
a phase change material layer disposed within the reaction area;
a protection layer disposed within the reaction area and embedded in the phase change material layer; and
a first electrode and a second electrode disposed within a dielectric material layer below the phase change material layer such that the first electrode is separated from the second electrode by the dielectric material layer, the first electrode and the second electrode physically contacting the phase change material layer.
10. The PCM cell of claim 9 , wherein a top surface of the protection layer is coplanar with a top surface of the phase change material layer.
11. The PCM cell of claim 10 , wherein a top surface of the spacer is coplanar with the top surface of the phase change material layer.
12. The PCM cell of claim 11 , further comprising a stop layer disposed along an outer edge of the spacer and having a top surface coplanar with the top surface of the PCM layer, wherein the top surfaces of the protection layer, the phase change material layer and the spacer constitute a continuous planar surface.
13. The PCM cell of claim 12 , further comprising a capping layer disposed over the continuous planar surface.
14. The PCM cell of claim 13 , wherein
the spacer includes at least one of SiN, SiO 2 , and SiON;
the protection layer comprises one of SiN and SiO 2 ; and
the capping layer comprises SiN.
15. The PCM cell of claim 11 , wherein bottom surfaces of the phase change material layer, the spacer and the stop layer are coplanar.
16. The PCM cell of claim 9 , wherein the phase change material includes a GeSbTe alloy film.
17. A phase change memory cell comprising:
a spacer formed on a substrate and defining a reaction area;
a phase change material layer disposed within the reaction area;
a protection layer disposed over the phase change material layer, wherein the spacer surrounds sidewalls of the phase change material layer, and the phase change material layer surrounds sidewalls of the protection layer; and
a first electrode and a second electrode disposed within a dielectric material layer below the phase change material layer such that the first electrode is separated from the second electrode by the dielectric material layer, the first electrode and the second electrode physically contacting the phase change material layer.
18. The PCM cell of claim 17 , wherein a top surface of the protection layer is coplanar with a top surface of the phase change material layer; and
wherein a top surface of the spacer is coplanar with the top surface of the phase change material layer.
19. The PCM cell of claim 11 , comprising a dielectric layer disposed along an outer edge of the spacer and having a top surface coplanar with the top surface of the phase change material layer.
20. The PCM cell of claim 19 , wherein the phase change material includes a GeSbTe alloy film, and
wherein bottom surfaces of the PCM layer, the spacer and the dielectric layer are coplanar.