Sputtering device and gas supply pipe for sputtering device
A sputtering device and a gas supply pipe for a sputter device are disclosed. In one aspect, the sputtering device includes a chamber, a stage located in the chamber and configured to receive a substrate thereon, and a plurality of gas supply pipes arranged substantially parallel to each other. The gas supply pipes have a plurality of gas supply holes and the gas supply pipes are configured to supply gas into the chamber. The sputtering device further includes at least one exhaust pump placed at a side of the chamber, wherein the exhaust pump is substantially symmetrically arranged with respect to a center axis of the side of the chamber.
1. A sputtering device, comprising:
a chamber;
a stage located in the chamber and configured to receive a substrate thereon;
a plurality of gas supply pipes arranged substantially parallel to each other, wherein the gas supply pipes have a plurality of gas supply holes and wherein the gas supply pipes are configured to supply gas into the chamber; and
at least one exhaust pump placed at a side of the chamber, wherein the exhaust pump is substantially symmetrically arranged with respect to a center axis of the side of the chamber,
wherein each of the gas supply pipes comprises a plurality of inner pipes,
wherein each inner pipe has at least one hole formed on a surface thereof, and
wherein the holes of the inner pipes of the same gas supply pipe are respectively connected to each other.
2. The sputtering device of claim 1 , wherein at least one target opposing the stage is interposed between the exhaust pump and the stage.
3. The sputtering device of claim 2 , wherein the gas supply pipes are interposed between the target and the stage.
4. The sputtering device of claim 3 , wherein the gas supply pipes are configured to emit the gas toward the target or the stage.
5. The sputtering device of claim 2 , wherein the at least one target comprises a plurality of targets and wherein the gas supply pipes are alternately arranged with the targets.
6. The sputtering device of claim 2 , wherein the gas supply pipes are located behind the stage and are configured to emit the gas toward the stage and wherein the target is interposed between the gas supply pipes and the stage.
7. The sputtering device of claim 1 , wherein each of the gas supply pipes comprises:
a first inner pipe including a plurality of gas tunnels formed on a surface of the first inner pipe, wherein a plurality of first holes are formed in a substantially straight line on the surface of the first inner pipe, wherein the first holes are respectively connected to the gas tunnels, and wherein the cross sectional areas of the gas tunnels are substantially proportional to the lengths of the gas tunnels;
a third inner pipe having one or more third holes connected to the first holes and configured to receive the gas from the first holes; and
a fourth inner pipe having a plurality of fourth holes connected to the third holes and configured to i) receive the gas from the third holes and ii) emit the received gas.
8. The sputtering device of claim 7 , wherein each of the gas supply pipes further comprises a second inner pipe which interposed between the first inner pipe and the third inner pipe and wherein each of the second inner pipes has a plurality of second holes respectively connected to the first holes.
9. The sputtering device of claim 8 , wherein each of the first, second, third, and fourth inner pipes is formed of one or more of aluminum oxide (Al 2 O 3 ), SUS304 stainless steel, hard anodized aluminum, titanium (Ti), and ceramics.
10. The sputtering device of claim 7 , wherein the number of the third holes equals the number of the first holes, wherein the third holes are respectively connected to the first holes, and wherein the areas of the third holes are greater than the areas of the first holes.
11. The sputtering device of claim 1 , wherein the gas supply pipes are electrically connected to a ground voltage.
12. The sputtering device of claim 1 , wherein the gas supply pipes are electrically connected to a DC power supply voltage or an AC power supply voltage.
13. A gas supply pipe for a sputtering device, comprising:
a first inner pipe including a plurality of gas tunnels formed on a surface of the first inner pipe, wherein a plurality of first holes are formed in a substantially straight line, wherein the first holes are respectively connected to the gas tunnels, and wherein the cross sectional areas of the gas tunnels are substantially proportional to the lengths of the gas tunnels;
a third inner pipe having one or more third holes connected to the first holes and configured to receive a gas from the first holes; and
a fourth inner pipe having a plurality of fourth holes connected to the third holes and configured to i) receive the gas from the third holes and ii) emit the received gas.
14. The gas supply pipe of claim 13 , further comprising a second inner pipe interposed between the first inner pipe and the third inner pipe, wherein the second inner pipe has a plurality of second holes respectively connected to the first holes.
15. The gas supply pipe of claim 13 , wherein the cross section of each of the gas tunnels has a substantially circular shape and wherein the gas tunnels satisfy Equation 1:
d
1
3
l
1
=
d
2
3
l
2
=
k
[
Equation
1
]
where d 1 is the diameter of a first one of the gas tunnels, l 1 is the length of the first one of the gas tunnels, d 2 is the diameter of a second one of the gas tunnels, l 2 is the length of the second one of the gas tunnels, and k is a constant.
16. The gas supply pipe of claim 13 , further comprising a connection pipe connected to an end of the fourth inner pipe, wherein the first inner pipe further includes a penetration tunnel arranged along a center axis of the first inner pipe and configured to deliver the gas to the connection pipe.
17. The gas supply pipe of claim 16 , wherein the cross sectional area of the penetration tunnel is substantially inversely proportional to the length of the penetration tunnel.
18. A sputtering device, comprising:
a chamber;
a stage located in the chamber and configured to receive a substrate thereon; and
a plurality of gas supply pipes located in the chamber and arranged substantially parallel to each other, wherein each of the gas supply pipes comprises a plurality of inner pipes, wherein each inner pipe has at least one hole formed on a surface thereof, and wherein the holes of the inner pipes of the same gas supply pipe are respectively connected to each other.
19. The sputtering device of claim 18 , wherein the inner pipes of each of the gas supply pipes comprise a first inner pipe including a plurality of gas tunnels formed on the surface thereof and wherein the cross sectional areas of the gas tunnels are substantially proportional to the lengths of the gas tunnels.
20. The sputtering device of claim 19 , wherein the holes of each the inner pipes of the same supply pipe have different areas from each other.