Semiconductor device including built-in crack-arresting film structure
According to at least one embodiment of the present invention, a wafer-to-wafer semiconductor device includes a first wafer substrate having a first bonding layer formed on a first bulk substrate layer. A second wafer substrate includes a second bonding layer formed on a second bulk substrate layer. The second bonding layer is bonded to the first bonding layer to define a bonding interface. At least one of the first wafer substrate and the second wafer substrate includes a crack-arresting film layer configured to increase a bonding energy of the bonding interface.
1. A wafer-to-wafer semiconductor device, comprising:
a first wafer substrate including a first bonding layer formed on a first bulk substrate layer; and
a second wafer substrate including a second bonding layer formed on a second bulk substrate layer, the second bonding layer bonded to the first bonding layer to define a bonding interface,
wherein the first wafer substrate comprises:
a first oxide layer formed on an upper surface of the first bulk substrate layer, the first bulk substrate layer and the first oxide layer each extending along a first axis to define a first length and a second axis opposite the first axis to define a first thickness;
a first crack-arresting layer formed on an upper surface of the first oxide layer; and
the first bonding layer formed on an upper surface of the first crack-arresting layer such that the first crack-arresting layer is interposed between the first bond layer and the first oxide layer, the first crack-arresting layer configured to inhibit formation of at least one uniform crack in the first bonding layer; and
wherein the second wafer substrate comprises:
a second oxide layer formed on an upper surface of the second substrate layer;
a second crack-arresting layer formed on an upper surface of the second oxide layer; and
the second bonding layer formed on an upper surface of the second crack-arresting layer such that the second crack-arresting layer is interposed between the second bond layer and the second oxide layer, the second crack-arresting layer configured to inhibit formation of at least one uniform crack in the second bonding layer, the inhibition of crack formation increasing the bond energy between the first and second wafer substrates at the bonding interface,
the first and second crack-arresting film layers configured to increase a bonding energy of the bonding interface.
2. The wafer-to-wafer semiconductor device of claim 1 , wherein the first and second crack-arresting film layers comprise a low-k dielectric material.
3. The wafer-to-wafer semiconductor device of claim 2 , wherein the low-k dielectric material comprises octamethylcyclotetrasiloxane (OMCTS).
4. The wafer-to-wafer semiconductor device of claim 3 , wherein the first and second bonding layers comprise a low temperature oxide material.
5. The wafer-to-wafer semiconductor device of claim 4 , wherein the first and second bonding layers are formed from silicon oxide.
6. The wafer-to-wafer semiconductor device of claim 5 , wherein a first thickness of the first and second bonding layers are substantially equal to a second thickness of the first and second crack-arresting film layers.