Method for fabricating a semiconductor device by bonding a layer to a support with curvature
The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a method for fabricating a display with curvature, more specifically, a light emitting device having an OLED bonded to a base material with curvature. An external force is applied to a support originally having curvature and elasticity, and the support is bonded to a peeled layer formed over a substrate. Then, when the substrate is peeled, the support returns into the original shape by the restoring force, and the peeled layer as well is curved along the shape of the support. Finally, a transfer object originally having curvature is bonded to the peeled layer, and then a device with a desired curvature is completed.
1. A method for fabricating a display device, the method comprising the steps of:
forming a first layer containing metal over a first substrate;
forming a second layer containing metal and oxygen over the first layer containing metal;
forming a third layer containing a thin film transistor over the second layer containing metal and oxygen;
forming a fourth layer containing a light emitting element over the third layer containing the thin film transistor;
bonding a flexible printed circuit to the third layer containing the thin film transistor;
bonding a second flexible substrate with curvature to the fourth layer containing the light emitting element;
peeling the third layer containing the thin film transistor and the fourth layer containing the light emitting element bonded to the second flexible substrate from the first substrate; and
bonding a third substrate to the third layer containing the thin film transistor to sandwich the third layer containing the thin film transistor and the fourth layer containing the light emitting element between the second flexible substrate and the third substrate,
wherein the step of bonding the flexible printed circuit is performed before the step of peeling the third layer containing the thin film transistor and the fourth layer containing the light emitting element.
2. The method for fabricating the display device according to claim 1 , wherein the second flexible substrate with curvature comprises plastic.
3. The method for fabricating the display device according to claim 1 , wherein the third substrate comprises plastic.
4. The method for fabricating the display device according to claim 1 , wherein the third substrate is flexible.
5. The method for fabricating the display device according to claim 1 , wherein a first adhesive is used in the step of bonding the second flexible substrate with curvature to the fourth layer containing the light emitting element.
6. The method for fabricating the display device according to claim 1 , wherein a second adhesive is used in the step of bonding the third substrate to the third layer containing the thin film transistor.
7. The method for fabricating the display device according to claim 1 , further comprising the step of: attaching the display device to a main body, a window, or a seat of a vehicle.
8. The method for fabricating the display device according to claim 1 , further comprising the step of: attaching the display device to a main body, a window, a dashboard part, an automobile body or a seat of an automobile.
9. A method for fabricating a display device, the method comprising the steps of:
forming a first layer containing metal over a first substrate;
forming a second layer containing metal and oxygen over the first layer containing metal;
forming a third layer containing a thin film transistor over the second layer containing metal and oxygen;
forming a spacer over the third layer containing the thin film transistor;
bonding a flexible printed circuit to the third layer containing the thin film transistor;
bonding a second flexible substrate with curvature to the second layer containing metal and oxygen using a seal agent;
filling a space surrounded by the second layer containing metal and oxygen, the second flexible substrate and the seal agent with liquid crystal;
peeling the third layer containing the thin film transistor from the first substrate; and
bonding a third substrate to the third layer containing the thin film transistor to sandwich the third layer containing the thin film transistor, the spacer, the seal agent and the liquid crystal between the second flexible substrate and the third substrate,
wherein the step of bonding the flexible printed circuit is performed before the step of peeling the third layer containing the thin film transistor.
10. The method for fabricating the display device according to claim 9 , wherein the second flexible substrate with curvature comprises plastic.
11. The method for fabricating the display device according to claim 9 , wherein the third substrate comprises plastic.
12. The method for fabricating the display device according to claim 9 , wherein the third substrate is flexible.
13. The method for fabricating the display device according to claim 9 , wherein a first adhesive is used in the step of bonding the third substrate to the third layer containing the thin film transistor.
14. The method for fabricating the display device according to claim 9 , further comprising the step of: attaching the display device to a main body, a window, or a seat of a vehicle.
15. The method for fabricating the display device according to claim 9 , further comprising the step of: attaching the display device to a main body, a window, a dashboard part, an automobile body or a seat of an automobile.
16. A method for fabricating a display device, the method comprising the steps of:
forming a first layer containing metal over a first substrate;
forming a second layer containing metal and oxygen over the first layer containing metal;
forming a third layer containing a wiring line and a pixel electrode over the second layer containing metal and oxygen;
bonding a flexible printed circuit to the third layer containing the wiring line and the pixel electrode;
bonding a second flexible substrate with curvature to the third layer containing the wiring line and the pixel electrode;
peeling the third layer containing the wiring line and the pixel electrode bonded to the second flexible substrate from the first substrate; and
bonding a third substrate to the third layer containing the wiring line and the pixel electrode to sandwich the third layer containing the wiring line and the pixel electrode between the second flexible substrate and the third substrate,
wherein the step of bonding the flexible printed circuit is performed before the step of peeling the third layer containing the wiring line and the pixel electrode.
17. The method for fabricating the display device according to claim 16 , wherein the second flexible substrate with curvature comprises plastic.
18. The method for fabricating the display device according to claim 16 , wherein the third substrate comprises plastic.
19. The method for fabricating the display device according to claim 16 , wherein the third substrate is flexible.