Backside configured surface plasmonic structure for infrared photodetector and imaging focal plane array enhancement
The invention relates to quantum dot and photodetector technology, and more particularly, to quantum dot infrared photodetectors (QDIPs) and focal plane array. The invention further relates to devices and methods for the enhancement of the photocurrent of quantum dot infrared photodetectors in focal plane arrays.
1. A backside configured focal plane array device having a series of quantum dot layers disposed between a first contacting layer and a second contacting layer; a metal contact in contact with said second contacting layer; and an indium bump in contact with said metal contact; wherein the improvement comprises:
a) surface plasmon polaritons structure in contact with said second contacting layer, and
b) a first passivation layer which covers said surface plasmon polaritions structure and is in contact with said indium bump and metal contact, and
c) a second passivation layer which covers the sidewall of the first and second contacting layers, buffer layers, and said series of quantum dot layers.
2. The device of claim 1 , wherein the device further comprises d) wherein the surface plasmonic polariton structure is configured on the opposite side of the substrate, and the light incident is upon on the substrate side.