Aluminum EMI / RF shield
A shield made from aluminum (AL) or an aluminum-based alloy coated with a solderable plating such as nickel or tin provides thermal improvement over existing shielding materials. The shield for circuitry on a circuit board comprising an aluminum material plated with a solderable material, the shield providing electromagnetic interference and radio frequency interference shielding and heat transfer when positioned over a circuit.
1. A shield for a circuit board comprising:
an aluminum substrate plated with a solderable material, the substrate forming a continuous, unitary, generally planar lid with bends forming depending side walls, the side walls extending over and around a fence and frictionally engaging an outside perimeter of the fence, the fence mounted to a circuit board to engage the shield over a circuit component to shield radio frequency interference, the continuous, unitary, generally planar lid, extending over the circuit component.
2. A shield for a circuit board comprising:
an aluminum substrate plated with a solderable material, the substrate forming a generally planar lid for solderably receiving an array of fins, the lid having depending side walls, an aluminum fence plated with a solderable material soldered to a circuit board, the lid positioned on the fence, in snap down attachment with the fence, over a circuit component to shield radio frequency interference.
3. A two piece shield attached to a circuit board for providing electromagnetic interference and radio frequency interference shielding and heat transfer when positioned over a circuit, comprising:
a fence made of a first material, the fence attached to a circuit board; and
a lid made of a second material, the lid plated with a solderable material, the lid removably snap down attached to the fence, the second material being aluminum.
4. The two piece shield of claim 3 , wherein the second material is different than the first material.
5. A shield for attachment to a circuit board, wherein the circuit board includes circuitry, the shield comprising:
an aluminum substrate defining a continuous, unitary, generally planar top wall and a plurality of side walls depending from the top wall, wherein the top walls and side walls of the substrate are coated with a solderable material;
an aluminum fence coated with a solderable material, the side walls of the aluminum substrate in snap down engagement with the fence to define an engaged position, and in the engaged position, the top wall and side walls enclose the circuitry on the circuit board, and the aluminum substrate and solderable coating shield the circuitry from electromagnetic interference and radio frequency interference; and
an aluminum conductive heat transfer path extending from the top wall and down the side walls, wherein in the engaged position, heat generated by the enclosed circuitry is transferred into the aluminum conductive heat transfer path and, in turn, into the fence and circuit board and is dissipated therein.
6. A shield as defined in claim 5 , wherein the solderable material is tin or nickel.
7. A shield as defined in claim 5 , wherein the solderable coating is a plating.
8. A shield as defined in claim 5 , further in combination with the circuit board and circuitry to which the aluminum fence is engaged and which the aluminum substrate encloses.
9. A shield as defined in claim 5 , wherein the substrate defines a planar top wall and four depending side walls.
10. A shield as defined in claim 5 , wherein in the engaged position, the side walls engage an outside perimeter of the fence.