Testing architecture of circuits integrated on a wafer
An embodiment of a testing architecture of integrated circuits on a wafer is described of the type including at least one first circuit of a structure TEG realized in a scribe line providing separation between at least one first and one second integrated circuit. The architecture includes at least one pad shared by a second circuit inside at least one of these first and second integrated circuit and the first circuit, as well as a switching circuitry coupled to the at least one pad and to these first and second circuits.
1. A wafer, comprising:
a first integrated-circuit die;
a scribe line adjacent to the first integrated-circuit die;
a testing circuit disposed in the scribe line;
a first contact pad disposed in the first integrated-circuit die;
a second contact pad disposed in the first integrated-circuit die; and
a first switch element disposed in the first integrated-circuit die and having a first node coupled to the testing circuit and having a second node coupled to the first contact pad and having a control node directly connected to the second contact pad,
wherein an open and closed state of the first switch for selectively connecting the testing circuit and the first contact pad is changeable during execution of a test solely in response to changing a control signal applied to the second contact pad.
2. The wafer of claim 1 wherein the testing circuit forms part of a test element group.
3. The wafer of claim 1 , further comprising:
a circuit element disposed in the first integrated-circuit die; and
a second switch element disposed in the first integrated-circuit die and having a first node coupled to the circuit element and having a second node coupled to the first contact pad and having a control node directly connected to the second contact pad,
wherein an open and closed state of the second switch for selectively connecting the circuit element and the testing circuit is changeable during execution of said test solely in response to changing the control signal applied to the second contact pad.
4. The wafer of claim 1 , further comprising:
a second integrated-circuit die adjacent to the scribe line;
a third contact pad disposed in the second integrated-circuit die; and
a second switch element disposed in the second integrated-circuit die and having a first node coupled to the testing circuit and having a second node coupled to the third contact pad and having a control node directly connected to the second contact pad,
wherein an open and closed state of the second switch for selectively connecting the third contact pad and the testing circuit is changeable during execution of said test solely in response to changing the control signal applied to the second contact pad.
5. The wafer of claim 1 , further comprising:
a second integrated-circuit die adjacent to the scribe line;
a third contact pad disposed in the second integrated-circuit die;
a circuit element disposed in the second integrated-circuit die;
a second switch element disposed in the second integrated-circuit die and having a first node coupled to the testing circuit and having a second node coupled to the third contact pad and having a control node directly connected to the second contact pad; and
a third switch element disposed in the second integrated-circuit die and having a first node coupled to the circuit element and having a second node coupled to the third contact pad and having a control node directly connected to the second contact pad,
wherein an open and closed state of the second and third switches for selectively connecting is changeable during execution of said test solely in response to changing the control signal applied to the second contact pad.
6. The wafer of claim 1 , further comprising:
a circuit element disposed on the first integrated-circuit die; and
a second switch element disposed on the first integrated-circuit die and having a first node coupled to the test circuit and having a second node coupled to the circuit element and having a control node directly connected to the second contact pad,
wherein an open and closed state of the second switch for selectively connecting the circuit element and the testing circuit is changeable during execution of said test solely in response to changing the control signal applied to the second contact pad.
7. The wafer of claim 1 , further comprising:
a control circuit disposed in the scribe line and coupled to the testing circuit;
a third contact pad disposed in the first integrated-circuit die; and
a second switch element having a first node coupled to the third contact pad and having a second node coupled to the control circuit and having a control node directly connected to the second contact pad,
wherein an open and closed state of the second switch for selectively connecting the third contact pad and the control circuit is changeable during execution of said test solely in response to changing the control signal applied to the second contact pad.
8. An integrated circuit, comprising:
an edge region at a scribe line;
a first conductive path extending to the edge region;
a first contact pad;
a second contact pad; and
a first switch element having a first node coupled to the first conductive path and having a second node coupled to the first contact pad and having a control node directly connected to the second contact pad,
wherein an open and closed state of the first switch for selectively connecting the first contact pad and the first conductive path is changeable during execution of said test solely in response to changing a control signal applied to the second contact pad.
9. The integrated circuit of claim 8 , further comprising:
a circuit element; and
a second switch element having a first node coupled to the circuit element and having a second node coupled to the first contact pad and having a control node directly connected to the second contact pad,
wherein an open and closed state of the second switch for selectively connecting the first contact pad and the circuit element is changeable during execution of said test solely in response to changing the control signal applied to the second contact pad.
10. The integrated circuit of claim 8 , further comprising:
a second conductive path extending to the edge region; and
a circuit element coupled to the second conductive path.
11. The integrated circuit of claim 8 , further comprising:
a seal ring disposed in the edge region; and
wherein the first and second contact pads are disposed inside of a region bounded by the seal ring.
12. The integrated circuit of claim 8 , further comprising:
a seal ring disposed in the edge region; and
wherein the first and second contact pads are disposed in the seal ring.
13. The integrated circuit of claim 8 , further comprising:
a seal ring disposed in the edge region; and
wherein at least one of the first and second contact pads forms part of the seal ring.
14. The integrated circuit of claim 8 , further comprising a substrate having a doped portion that forms part of the first conductive path.