Exposure method, exposure apparatus, and method of manufacturing device
In an exposure method of performing a scan exposure of a substrate, held by a substrate stage, in a first direction for each shot region, a surface position of an exposure area is pre-measured before the exposure area reaches a region, to be irradiated with exposure light, of the substrate, movement of the substrate stage in order to change a shot region to undergo the scan exposure includes first movement in which the substrate stage moves along a curved trajectory, and second movement in which the substrate stage rectilinearly moves in the first direction, and, while the movement of the substrate stage is the first movement, the surface position is pre-measured, and a pre-measure position in a shot region is common among a plurality of shot regions.
1. An exposure method of performing a scan exposure of a substrate, held by a substrate stage, in a first direction for each shot region of the substrate, the method comprising:
a first scan exposure step of performing a scan exposure of a shot region of the substrate;
a measuring step of measuring a surface position of a next shot region to undergo a scan exposure after the first scan exposure step while the substrate stage moves in a second direction, which is perpendicular to the first direction; and
a second scan exposure step of performing the scan exposure of the next shot region based on a measurement result of the measuring step,
wherein the shot region and the next shot region are arranged at different positions in the first direction and adjacent to each other in the second direction.
2. The method according to claim 1 , further comprising:
a moving step of moving the substrate stage to change a shot region to undergo the scan exposure and includes a first movement in which the substrate stage moves along a curved trajectory and a second movement in which the substrate stage moves rectilinearly in the first direction,
wherein movement of the substrate stage is measured during the first movement.
3. The method according to claim 1 , wherein letting Txs be a time at which the substrate stage starts to move in the second direction, Xxs be a position of the substrate stage in the second direction at the time Txs, Tp be a time at which the surface position starts to be measured in the second shot region, Xp be a position of the substrate stage in the second direction at the time Tp, Texpo be a time at which a scan exposure starts in the second shot region, Yf be an interval in the first direction between the region to be irradiated with the exposure light and a position at which measure of the surface position starts, and Vy(t) and Vx(t) be velocities of the substrate stage in the first direction and the second direction, respectively, Yf, Texpo, Txs, Vy(t), Vx(t), and Xxs are set to satisfy:
Yf=∫ Tp Texpo Vy ( t ) dt , and
Xp=∫ Txs Tp Vx ( t ) dt+Xxs.
4. An exposure apparatus for performing a scan exposure of a substrate, held by a substrate stage, in a first direction for each shot region of the substrate, the apparatus comprising:
a detector configured to measure a surface position of a next shot region to undergo a scan exposure after performing a scan exposure of a shot region of the substrate; and
a controller configured to control movement of the substrate stage in accordance with a profile defining the movement of the substrate stage,
wherein the detector measures the surface position of the next shot region while the substrate stage moves in a second direction, which is perpendicular to the first direction,
wherein the controller controls the movement of the substrate stage to perform the scan exposure of the next shot region based on a measurement result of the surface position of the next shot region, and
wherein the shot region and the next shot region are arranged at different positions in the first direction and adjacent to each other in the second direction.
5. The apparatus according to claim 4 , wherein the profile is represented as a change over time of one of a velocity, an acceleration, or a jerk of the substrate stage.
6. An exposure method of performing a scan exposure of a substrate, held by a substrate stage, in a first direction for each shot region of the substrate, the method comprising:
a first scan exposure step of performing a scan exposure of a first shot region of the substrate;
a first measuring step of measuring a surface position of a second shot region to undergo a scan exposure after the first scan exposure step while the substrate stage moves in a second direction, which is perpendicular to the first direction;
a second scan exposure step of performing the scan exposure of the second shot region based on a measurement result of the first measuring step;
a third scan exposure step of performing a scan exposure of a third shot region of the substrate;
a second measuring step of measuring a surface position of a fourth shot region to undergo a scan exposure after the third scan exposure step while the substrate stage moves in the second direction; and
a fourth scan exposure step of performing the scan exposure of the fourth shot region based on a measurement result of the second measuring step,
wherein the first shot region and the second shot region are arranged at an identical position in the first direction and adjacent to each other in the second direction,
wherein the third shot region and the fourth shot region are arranged at different positions in the first direction and adjacent to each other in the second direction, and
wherein a measurement position of the surface position is common among the second shot region and the fourth shot region.
7. The method according to claim 6 , further comprising:
a moving step of moving the substrate stage to change a shot region to undergo the scan exposure includes a first movement in which the substrate stage moves along a curved trajectory and a second movement in which the substrate stage moves rectilinearly in the first direction,
wherein movement of the substrate stage is measured during the first movement.
8. The method according to claim 6 , wherein letting Txs be a time at which the substrate stage starts to move in the second direction, Xxs be a position of the substrate stage in the second direction at the time Txs, Tp be a time at which the surface position starts to be measured in the second shot region or the fourth shot region, Xp be a position of the substrate stage in the second direction at the time Tp, Texpo be a time at which a scan exposure starts in the second shot region or the fourth shot region, Yf be an interval in the first direction between the region to be irradiated with the exposure light and a position at which measure of the surface position starts, and Vy(t) and Vx(t) be velocities of the substrate stage in the first direction and the second direction, respectively, Yf, Texpo, Txs, Vy(t), Vx(t), and Xxs are set to satisfy:
Yf=∫ Tp Texpo Vy ( t ) dt
and
Xp=∫ Txs Tp Vx ( t ) dt+Xxs.
9. A method of manufacturing a device, the method comprising:
a scan exposure step of performing a scan exposure of a substrate, held by a substrate stage, in a first direction for each shot region of the substrate;
a developing step of developing the substrate having undergone the scan exposure; and
a processing step of processing the developed substrate to manufacture the device,
wherein the scan exposure step includes:
a first scan exposure step of performing a scan exposure of a first shot region of the substrate;
a first measuring step of measuring a surface position of a second shot region to undergo a scan exposure after the first scan exposure step while the substrate stage moves in a second direction, which is perpendicular to the first direction; and
a second scan exposure step of performing the scan exposure of the second shot region based on a measurement result of the first measuring step,
wherein the first shot region and the second shot region are arranged at different positions in the first direction and adjacent to each other in the second direction.
10. An exposure apparatus for performing a scan exposure of a substrate, held by a substrate stage, in a first direction for each shot region of the substrate, the apparatus comprising:
a detector configured to measure a surface position of a shot region of the substrate before the shot region reaches a region to be irradiated with exposure light; and
a controller configured to control movement of the substrate stage in accordance with a profile defining the movement of the substrate stage,
wherein the controller controls the movement of the substrate stage to perform a scan exposure of a first shot region of the substrate,
wherein the detector measures a surface position of a second shot region to undergo a scan exposure after performing the scan exposure of the first shot region while the substrate stage moves in a second direction, which is perpendicular to the first direction,
wherein the controller controls the movement of the substrate stage to perform the scan exposure of the second shot region based on a measurement result of the surface position of the second shot region,
wherein the controller controls the movement of the substrate stage to perform a scan exposure of a third shot region of the substrate,
wherein the detector measures a surface position of a fourth shot region to undergo a scan exposure after performing the scan exposure of the third shot region while the substrate stage moves in the second direction,
wherein the controller controls the movement of the substrate stage to perform the scan exposure of the fourth shot region based on a measurement result of measuring the surface position of the fourth shot region,
wherein the first shot region and the second shot region are arranged at an identical position in the first direction and adjacent to each other in the second direction,
wherein the third shot region and the fourth shot region are arranged at different positions in the first direction and adjacent to each other in the second direction, and
wherein a measurement position of the surface position is common among the second shot region and the fourth shot region.
11. The apparatus according to claim 10 , wherein the profile is represented as a change over time of one of a velocity, an acceleration, or a jerk of the substrate stage.
12. A method of manufacturing a device, the method comprising:
a scan exposure step of performing a scan exposure of a substrate, held by a substrate stage, in a first direction for each shot region of the substrate;
a developing step of developing the substrate having undergone the scan exposure; and
a processing step of processing the developed substrate to manufacture the device,
wherein the scan exposure step includes:
a first scan exposure step of performing a scan exposure of a first shot region of the substrate;
a first measuring step of measuring a surface position of a second shot region to undergo a scan exposure after the first scan exposure step while the substrate stage moves in a second direction, which is perpendicular to the first direction;
a second scan exposure step of performing the scan exposure of the second shot region based on a measurement result of the first measuring step;
a third scan exposure step of performing a scan exposure of a third shot region of the substrate;
a second measuring step of measuring a surface position of a fourth shot region to undergo a scan exposure after the third scan exposure step while the substrate stage moves in the second direction; and
a fourth scan exposure step of performing the scan exposure of the fourth shot region based on a measurement result of the second measuring step,
wherein the first shot region and the second shot region are arranged at an identical position in the first direction and adjacent to each other in the second direction,
wherein the third shot region and the fourth shot region are arranged at different positions in the first direction and adjacent to each other in the second direction, and
wherein a measurement position of the surface position is common among the second shot region and the fourth shot region.