IP Library › Granted Patent US 9,542,028
Granted Patent B2
US 9,542,028 · App. 14/972,917 · Granted Jan 10, 2017

Temperature compensating transparent force sensor having a compliant layer

Inventors: Sinan Filiz (Cupertino, CA); James E. Pedder (Cupertino, CA); Charley T. Ogata (Cupertino, CA); John Stephen Smith (Cupertino, CA); Dhaval Chandrakant Patel (Cupertino, CA); Shin John Choi (Cupertino, CA); Brian Q. Huppi (Cupertino, CA); Christopher J. Butler (Cupertino, CA); Martin P. Grunthaner (Cupertino, CA)
Assignee: Apple Inc.
G06F3/0414G01L1/005G01L1/16G01L1/18G01L1/20G01L1/205G06F3/044G06F3/045G06F3/0412G06F3/0416G06F2203/04103G06F2203/04105
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Quick Facts
Patent No.
US 9,542,028
App. No.
14/972,917
Granted
Jan 10, 2017
Kind
B2
Abstract

An optically transparent force sensor that may compensate for environmental effects, including, for example, variations in temperature of the device or the surroundings. In some examples, two force-sensitive layers are separated by a compliant layer. The relative electrical response of the two force-sensitive layers may be used to compute an estimate of the force of a touch that reduces the effect of variations in temperature. In some examples, piezoelectric films having anisotropic strain properties are used to reduce the effects of temperature.

Claims (28)

1. An electronic device comprising:

a touch-sensitive surface;

a force sensor positioned below the touch-sensitive surface and comprising:

a first strain-sensitive element;

a compliant layer disposed below the first strain-sensitive element; and

a second strain-sensitive element below the compliant layer and electrically coupled to the first-strain sensitive element; and

a sensor circuit configured to obtain a differential measurement between a first strain of the first strain-sensitive element and a second strain of the second strain-sensitive element; wherein

the differential measurement changes in response to a force applied to the touch-sensitive surface; and

the sensor circuit compensates for a difference in temperature between the first and second strain-sensitive elements in response to the differential measurement.

2. The electronic device of claim 1 , wherein the compliant layer is configured to conduct heat between the first strain-sensitive element and the second strain-sensitive element.

3. The electronic device of claim 1 , wherein

the first strain-sensitive element is a member of a first array of strain-sensitive elements; and

the second strain-sensitive element is a member of a second array of strain-sensitive elements.

4. The electronic device of claim 3 , wherein the first array of strain-sensitive elements is arranged as a grid.

5. The electronic device of claim 3 , wherein the first array of strain-sensitive elements is arranged as a line.

6. The electronic device of claim 3 , wherein the second array of strain-sensitive elements is arranged in a manner complementary to an arrangement of the first array of strain-sensitive elements.

7. The electronic device of claim 1 , wherein the first strain-sensitive element is disposed on a glass substrate.

8. The electronic device of claim 1 , wherein the first strain-sensitive element is formed from indium tin oxide.

9. The electronic device of claim 1 , wherein the compliant layer comprises an optically clear adhesive.

10. The electronic device of claim 1 , wherein at least one of the first or second strain-sensitive elements are optically transparent.

11. An electronic device comprising:

a cover defining a touch-sensitive surface;

a force sensor positioned below the cover and comprising a strain-sensitive element configured to deform in response to a force applied to the touch-sensitive surface; and

a sensor circuit configured to obtain a differential measurement between a strain response of the strain-sensitive element and an electrical response of a resistive element, the resistive element electrically coupled to the strain-sensitive element; wherein

the resistive element is formed from the same material as the strain-sensitive element; and

the resistive element is thermally coupled to the strain-sensitive element such that the electronic device is configured to reduce a difference in temperature between the resistive element and the strain-sensitive element in response to the differential measurement.

12. The electronic device of claim 11 , wherein the strain-sensitive element is a member of an array of strain-sensitive elements disposed on a substrate.

13. The electronic device of claim 12 , wherein the array of strain-sensitive elements is arranged in a grid on the substrate.

Continuity (8)
Continuation 14729508 · Jun 3, 2015
Continuation 14594835 · Jan 12, 2015
Provisional Application 61926905 · Jan 13, 2014
Provisional Application 61937465 · Feb 7, 2014
Provisional Application 61939257 · Feb 12, 2014
Provisional Application 61942021 · Feb 19, 2014
Provisional Application 62024566 · Jul 15, 2014
Related Publication 20160103545A1 · Apr 14, 2016