Semiconductor device
A semiconductor device includes a semiconductor substrate; and a temperature sense diode fixed on the semiconductor substrate. The temperature sense diode includes: an anode electrode; a p-type semiconductor layer being in contact with the anode electrode; an n-type semiconductor layer being in contact with the p-type semiconductor layer; and a cathode electrode being in contact with the n-type semiconductor layer; and the anode electrode. The p-type semiconductor layer, the n-type semiconductor layer, and the cathode electrode are stacked along a thickness direction of the semiconductor substrate. An electric resistivity of the anode electrode or the cathode electrode whichever is located closer to the semiconductor substrate is lower than an electric resistivity of the n-type semiconductor layer and an electric resistivity of the p-type semiconductor layer.
1. A semiconductor device, comprising:
a semiconductor substrate; and
a temperature sense diode fixed on the semiconductor substrate,
wherein
the temperature sense diode comprises:
an anode electrode;
a p-type semiconductor layer being in contact with the anode electrode;
an n-type semiconductor layer being in contact with the p-type semiconductor layer; and
a cathode electrode being in contact with the n-type semiconductor layer; and
the anode electrode, the p-type semiconductor layer, the n-type semiconductor layer, and the cathode electrode are stacked along a thickness direction of the semiconductor substrate, and
an electric resistivity of the anode electrode or the cathode electrode whichever is located closer to the semiconductor substrate is lower than an electric resistivity of the n-type semiconductor layer and an electric resistivity of the p-type semiconductor layer.
2. The semiconductor device of claim 1 , further comprising a heatsink connected to the semiconductor substrate at positions located on both sides of the temperature sense diode.
3. The semiconductor device of claim 1 , wherein
the semiconductor substrate comprises a switching element,
the semiconductor device further comprises:
a power source configured to supply a reference current to the temperature sense diode in a forward direction, and
a controller circuit configured to, when a forward voltage drop of the temperature sense diode during flow of the reference current through the temperature sense diode is lower than a threshold value, control a current flowing through the switching element to be smaller than the current flowing through the switching element when the forward voltage drop is equal to or higher than the threshold value.
4. The semiconductor device of claim 1 , wherein
the cathode electrode is configured of an n-type semiconductor having a density of n-type impurities ten or more times higher than a density of n-type impurities in the n-type semiconductor layer,
the cathode electrode includes a stacked portion and an extension portion, the stacked portion being a portion on which the n-type semiconductor layer, the p-type semiconductor layer and the anode electrode are stacked, and the extension portion being a portion extending outward from the stacked portion, and
the semiconductor device further comprises a wiring layer located on the extension portion.