Semiconductor electrostatic protection circuit device
An electrostatic protection circuit in a semiconductor device includes a first first-conductivity type well extending in a first direction over a semiconductor substrate, a second first-conductivity type well extending in a second direction over the semiconductor substrate and perpendicular to the first direction with one end coupled to a first long side of the first first-conductivity type well, and a second-conductivity type well formed around the first first-conductivity type well and the second first-conductivity type well. It also includes a first high-concentration second-conductivity type region extending in the second direction on a surface of the second first-conductivity type well and a first high-concentration first-conductivity type region extending in the second direction on a surface of the second-conductivity type well while facing the first high-concentration second-conductivity type region.
1. A thyristor-type semiconductor electrostatic protection circuit device for protecting an internal circuit, comprising:
a semiconductor substrate (Psub) defining a first direction and a second direction perpendicular to the first direction, in a plan view of the substrate;
an element isolation insulating film (IN) formed over the semiconductor substrate; a plurality of spaced-apart first high-concentration first-conductivity type regions (NP 1 a , NP 1 b , NP 1 c , NP 1 d ) extending in the second direction over the semiconductor substrate;
a plurality of spaced-apart first high-concentration second-conductivity type regions (PP 1 a , PP 1 b , PP 1 c ) extending in the second direction over the semiconductor substrate and alternating with and facing the plurality of first high-concentration first-conductivity type regions (NP 1 a , NP 1 b , NP 1 c , NP 1 d ), said first high-concentration second-conductivity type regions (PP 1 a, PP 1 b, PP 1 c) being physically unconnected with one another in both the first direction and the second direction, the second conductivity type being opposite to the first conductivity type; and
a second high-concentration first-conductivity type region (NP 2 ) extending in the first direction over the semiconductor substrate; wherein:
each of the plurality of first high-concentration second-conductivity type regions (PP 1 a , PP 1 b , PP 1 c ) is formed in a corresponding one of a plurality of second first-conductivity type wells (NW 2 a , NW 2 b , NW 2 c ), said second first-conductivity type wells (NW 2 a , NW 2 b , NW 2 c ) being formed over the substrate (Psub);
each of the plurality of first high-concentration first-conductivity type regions (NP 1 a , NP 1 b , NP 1 c , NP 1 d ) is formed in a second-conductivity type well (PW), said second-conductivity type well (PW) being formed over the substrate (Psub);
each two adjacent ones of the first high-concentration first-conductivity type regions (NP 1 a , NP 1 b , NP 1 c , NP 1 d ) are separated from one another by one of the first high-concentration second-conductivity type regions (PP 1 a , PP 1 b , PP 1 c );
in a cross-sectional view of the device passing through both the plurality of first high-concentration first-conductivity type regions (NP 1 a , NP 1 b , NP 1 c , NP 1 d ) and the plurality of first high-concentration second-conductivity type regions (PP 1 a , PP 1 b , PP 1 c ), the element isolation insulating film (IN) separates the plurality of first high-concentration first-conductivity type regions (NP 1 a , NP 1 b , NP 1 c , NP 1 d ) from the plurality of first high-concentration second-conductivity type regions (PP 1 a , PP 1 b , PP 1 c );
the plurality of first high-concentration first-conductivity type regions (NP 1 a , NP 1 b , NP 1 c , NP 1 d ) are coupled to ground potential as a cathode;
the plurality of first high-concentration second-conductivity type regions (PP 1 a , PP 1 b , PP 1 c ) are coupled to an I/O pad, and connect to the internal circuit as an anode; and
the second high-concentration first-conductivity type region (NP 2 ) is configured as a trigger gate tap of the electrostatic protection circuit device, and connects to a trigger element.
2. The semiconductor electrostatic protection circuit device according to claim 1 , wherein:
the plurality of first high-concentration first-conductivity type regions (NP 1 a , NP 1 b, NP 1 c , NP 1 d ) extend parallel to, and for a same length as, the plurality of first high-concentration second-conductivity type regions (PP 1 a , PP 1 b , PP 1 c ).
3. The semiconductor electrostatic protection circuit device according to claim 1 , having a layout such that:
a silicon-controlled rectifier current I SCR is configured to flow, along the first direction, from the plurality of first high-concentration second-conductivity type regions (PP 1 a, PP 1 b , PP 1 c ) to the plurality of first high-concentration first-conductivity type regions (NP 1 a, NP 1 b , NP 1 c , NP 1 d ); and
a trigger current I trig is configured to flow, along the second direction, from the plurality of first high-concentration second-conductivity type regions (PP 1 a , PP 1 b , PP 1 c ) to the second high-concentration first-conductivity type region_(NP 2 ).
4. The semiconductor electrostatic protection circuit device according to claim 1 , wherein:
a first short side ( 21 ) of each of the first high-concentration second conductivity type regions (PP 1 a , PP 1 b , PP 1 c ) faces a long side ( 27 ) of the second high-concentration first-conductivity type region (NP 2 ); and
the long side ( 27 ) of the second high-concentration first-conductivity type region (NP 2 ) overlaps all of the first short sides ( 21 ) of the first high-concentration second conductivity type regions (PP 1 a , PP 1 b , PP 1 c ).
5. The semiconductor electrostatic protection circuit device according to claim 4 , wherein:
each of the first high-concentration second conductivity type regions (PP 1 a, PP 1 b , PP 1 c ) has two long sides which extend in the second direction;
each of the first high-concentration first-conductivity type regions (NP 1 a , NP 1 b, NP 1 c , NP 1 d ) has two long sides which extend in the second direction; and
each of the two long sides of each of the first high-concentration second conductivity type regions (PP 1 a , PP 1 b , PP 1 c ) faces a long side of a respective one of the first high-concentration first-conductivity type regions (NP 1 a, NP 1 b , NP 1 c , NP 1 d ).
6. The semiconductor electrostatic protection circuit device according to claim 1 , further comprising:
a second high-concentration second-conductivity type region (PP 2 ) extending in the first direction and configured as a second trigger tap region; wherein:
each of the first high-concentration second conductivity type regions (PP 1 a , PP 1 b , PP 1 c ) has a short side which faces a long side of the second high-concentration second-conductivity type region (PP 2 ) configured as the second trigger tap region. further comprising:
a plurality of spaced-apart third high-concentration first-conductivity type regions (NP 3 a, NP 3 b , NP 3 c , NP 3 d ) extending in the second direction over the semiconductor substrate;
a plurality of spaced-apart third high-concentration second-conductivity type regions (PP 3 a , PP 3 b , PP 3 c ) extending in the second direction over the semiconductor substrate and alternating with and facing the plurality of third high-concentration first-conductivity type regions (NP 3 a , NP 3 b , NP 3 c , NP 3 d ).
7. The semiconductor electrostatic protection circuit device according to claim 6 , wherein the second high-concentration second-conductivity type region (PP 2 ) extends over a surface of the second-conductivity type well (PW).
8. The semiconductor electrostatic protection circuit device according to claim 1 , further comprising:
a first first-conductivity type well (NW 1 ) extending in the first direction over the semiconductor substrate, the first first-conductivity type well (NW 1 ) having a first long side ( 10 ) and a second long side ( 12 ) opposite the first long side ( 10 ); wherein:
the plurality of second first-conductivity type wells (NW 2 a , NW 2 b , NW 2 c ) extend in the second direction over the semiconductor substrate with a first end of each of the plurality of second first-conductivity type wells (NW 2 a , NW 2 b , NW 2 c ) coupled to the second long side ( 12 ) of the first first-conductivity type well (NW 1 );
the second-conductivity type well (PW) is formed around the first first-conductivity type well (NW 1 ) and the plurality of second first-conductivity type wells (NW 2 a , NW 2 b , NW 2 c ); and
the second high-concentration first-conductivity type region (NP 2 ) is formed on the first first-conductivity type well (NW 1 ).
9. The semiconductor electrostatic protection circuit device according to claim 1 , further comprising:
a plurality of spaced-apart third high-concentration first-conductivity type regions (NP 3 a , NP 3 b , NP 3 c , NP 3 d ) extending in the second direction over the semiconductor substrate;
a plurality of spaced-apart third high-concentration second-conductivity type regions (PP 3 a , PP 3 b , PP 3 c ) extending in the second direction over the semiconductor substrate and alternating with and facing the plurality of third high-concentration first-conductivity type regions (NP 3 a , NP 3 b , NP 3 c , NP 3 d ).
10. The semiconductor electrostatic protection circuit device according to claim 9 , wherein:
the plurality of first high-concentration first-conductivity type regions (NP 1 a , NP 1 b, NP 1 c , NP 1 d ) extend parallel to, and for a same first length as, the plurality of first high-concentration second-conductivity type regions (PP 1 a , PP 1 b , PP 1 c ); and
the plurality of third high-concentration first-conductivity type regions (NP 3 a , NP 3 b, NP 3 c , NP 3 d ) extend parallel to, and for a same second length as, the plurality of third high-concentration second-conductivity type regions (PP 3 a , PP 3 b , PP 3 c ).
11. The semiconductor electrostatic protection circuit device according to claim 9 , wherein:
the semiconductor electrostatic protection circuit device has mirror symmetry about a line (P 1 ) extending in the first direction through the second high-concentration first-conductivity type region (NP 2 ).
12. The semiconductor electrostatic protection circuit device according to claim 9 , further comprising:
a second high-concentration second-conductivity type region (PP 2 ) extending in the first direction and configured as a second trigger tap region;
a fourth high-concentration second-conductivity type region (PP 4 ) extending in the first direction as a third trigger tap region;
wherein:
each of the first high-concentration second conductivity type regions (PP 1 a , PP 1 b, PP 1 c ) has a short side which faces a long side of the second high-concentration second-conductivity type region (PP 2 ) configured as the second trigger tap region; and
each of the third high-concentration second conductivity type regions (PP 3 a , PP 3 b, PP 3 c ) has a short side which faces a long side of the fourth high-concentration second-conductivity type region (PP 4 ) configured as the third trigger tap region.
13. The semiconductor electrostatic protection circuit device according to claim 9 , further comprising:
a first first-conductivity type well (NW 1 ) extending in the first direction over the semiconductor substrate, the first first-conductivity type well (NW 1 ) having a first long side ( 10 ) and a second long side ( 12 ) opposite the first long side ( 10 ); and
a plurality of third first-conductivity type wells (NW 3 a , NW 3 b , NW 3 c ) extending in the second direction over the semiconductor substrate with a first end of each of the plurality of third first-conductivity type wells (NW 3 a, NW 3 b, NW 3 c) coupled to the first long side ( 10 ) of the first first-conductivity type well (NW 1 ); wherein:
the plurality of second first-conductivity type wells (NW 2 a , NW 2 b . NW 2 c ) extend in the second direction over the semiconductor substrate with a first end of each of the plurality of second first-conductivity type wells (NW 2 a , NW 2 b , NW 2 c ) coupled to the second long side ( 12 ) of the first first-conductivity type well (NW 1 );
the second-conductivity type well (PW) is formed around the first first-conductivity type well (NW 1 ), the plurality of second first-conductivity type wells (NW 2 a, NW 2 b , NW 2 c ), and the plurality of third first-conductivity type wells (NW 3 a , NW 3 b, NW 3 c );
the second high-concentration first-conductivity type region (NP 2 ) is formed on the first first-conductivity type well (NW 1 );
each of the plurality of third high-concentration second-conductivity type regions (PP 3 a , PP 3 b , PP 3 c ) is formed on a corresponding one of the plurality of third first-conductivity type wells (NW 3 a , NW 3 b , NW 3 c ); and
each of the plurality of third high-concentration first- conductivity type regions (NP 3 a , NP 3 b , NP 3 c , NP 3 d ) is formed on the second-conductivity type well (PW).
14. A semiconductor electrostatic protection circuit device, comprising:
a semiconductor substrate (Psub) defining a first direction and a second direction perpendicular to the first direction, in a plan view of the substrate;
an element isolation insulating film (IN) formed over the semiconductor substrate;
a plurality of spaced-apart first high-concentration first-conductivity type regions (NP 1 a , NP 1 b , NP 1 c , NP 1 d ) extending in the second direction over the semiconductor substrate;
a plurality of spaced-apart first high-concentration second-conductivity type regions (PP 1 a , PP 1 b , PP 1 c ) extending in the second direction over the semiconductor substrate and alternating with and facing the plurality of first high-concentration first-conductivity type regions (NP 1 a , NP 1 b , NP 1 c , NP 1 d ), said first high-concentration second-conductivity type regions (PP 1 a , PP 1 b , PP 1 c ) being physically unconnected with one another in both the first direction and the second direction, the second conductivity type being opposite to the first conductivity type; and
a second high-concentration first-conductivity type region (NP 2 ) extending in the first direction over the semiconductor substrate; wherein:
each of the plurality of first high-concentration second-conductivity type regions (PP 1 a , PP 1 b , PP 1 c ) is formed in a corresponding one of a plurality of second first-conductivity type wells (NW 2 a , NW 2 b , NW 2 c ), said second first-conductivity type wells (NW 2 a , NW 2 b , NW 2 c ) being formed over the substrate (Psub);
each of the plurality of first high-concentration first-conductivity type regions (NP 1 a , NP 1 b , NP 1 c , NP 1 d ) is formed in a second-conductivity type well (PW), said second-conductivity type well (PW) being formed over the substrate (Psub);
each two adjacent ones of the first high-concentration first-conductivity type regions (NP 1 a , NP 1 b , NP 1 c , NP 1 d ) are separated from one another by one of the first high-concentration second-conductivity type regions (PP 1 a , PP 1 b , PP 1 c );
in a cross-sectional view of the device passing through both the plurality of first high-concentration first-conductivity type regions (NP 1 a , NP 1 b , NP 1 c , NP 1 d ) and the plurality of first high-concentration second-conductivity type regions (PP 1 a , PP 1 b, PP 1 c ), the element isolation insulating film (IN) separates the plurality of first high-concentration first-conductivity type regions (NP 1 a , NP 1 b , NP 1 c , NP 1 d ) from the plurality of first high-concentration second-conductivity type regions (PP 1 a , PP 1 b, PP 1 c );
the plurality of first high-concentration first-conductivity type regions (NP 1 a, NP 1 b , NP 1 c , NP 1 d ) are coupled to ground potential;
the plurality of first high-concentration second-conductivity type regions (PP 1 a, PP 1 b , PP 1 c ) are coupled to an I/O pad; and
the second high-concentration first-conductivity type region (NP 2 ) is configured as a trigger tap of the electrostatic protection circuit device.
15. The semiconductor electrostatic protection circuit device according to claim 14 , comprising:
a comb-shaped well (NW 1 ) of the first conductivity type comprising:
a first portion extending in said first direction, and
a plurality of second portions which are spaced apart from one other, extend in said second direction, and are connected to one another at one end only, via the first portion; wherein:
the second high-concentration first-conductivity type region (NP 2 ) is formed in the first portion of the comb-shaped well (NW 1 ); and
the second first-conductivity type wells (NW 2 a , NW 2 b , NW 2 c ) form the second portions of the comb-shaped well (NW 1 ).
16. The semiconductor electrostatic protection circuit device according to claim 1 , comprising:
a comb-shaped well (NW 1 ) of the first conductivity type comprising:
a first portion extending in said first direction, and
a plurality of second portions which are spaced apart from one other, extend in said second direction, and are connected to one another at one end only, via the first portion; wherein:
the second high-concentration first-conductivity type region (NP 2 ) is formed in the first portion of the comb-shaped well (NW 1 ); and
the second first-conductivity type wells (NW 2 a , NW 2 b , NW 2 c ) form the second portions of the comb-shaped well (NW 1 ).
17. The semiconductor electrostatic protection circuit device according to claim 9 , wherein:
the second high-concentration first-conductivity type region (NP 2 ) is formed in an n-type well (NW 1 ); and
the semiconductor electrostatic protection circuit device has mirror symmetry about a line (P 1 ) extending in the first direction through both the n-type well (NW 1 ) and the second high-concentration first-conductivity type region (NP 2 ).
18. The semiconductor electrostatic protection circuit device according to claim 12 , wherein:
the second high-concentration first-conductivity type region (NP 2 ) is formed in an n-type well (NW 1 ); and
the semiconductor electrostatic protection circuit device has mirror symmetry about a line (P 2 ) extending in the first direction through both the n-type well (NW 1 ) and the second high-concentration first-conductivity type region (NP 2 ).