All 2D, high mobility, flexible, transparent thin film transistor

1. A method for manufacturing a two-dimensional thin film transistor, the method comprising:

layering a semiconducting channel material on a substrate;

providing a first electrode material on top of the semiconducting channel material;

patterning a source metal electrode and a drain metal electrode at opposite ends of the semiconducting channel material from the first electrode material;

opening a window between the source metal electrode and the drain metal electrode;

removing the first electrode material from the window located above the semiconducting channel material;

providing a gate dielectric above the semiconducting channel material; and

providing a top gate above the gate dielectric, the top gate formed from a second electrode material,

wherein each of the semiconducting channel material, the source metal electrode, the drain metal electrode, and the gate dielectric is comprised of one to seven atomic layers in crystalline form.

2. The method of claim 1 , wherein

the semiconducting channel material is comprised of tungsten diselenide;

the first electrode material and the second electrode material are comprised of graphene; and

the gate dielectric is comprised of hexagonal boron nitride.

3. The method of claim 1 , wherein the semiconducting channel material is comprised of a bilayer of tungsten diselenide prepared by placing a sample of tungsten diselenide onto a non-permanently adhesive substrate and then folding and unfolding the non-permanently adhesive substrate a plurality of times, thereby creating progressively thinner layers of tungsten dislenide, until the bilayer of tungsten diselenide remains on the non-permanently adhesive substrate.

4. The method of claim 1 , wherein patterning the source metal electrode and the drain metal electrode comprises using optical lithography followed by an electron beam evaporation of aluminum to create an aluminum mask for etching.

5. The method of claim 4 , wherein opening the window between the source metal electrode and the drain metal electrode comprises:

using oxygen plasma etching to remove the first electrode material from everywhere except a source metal electrode/drain metal electrode region hard masked by the aluminum mask; and

using optical lithography to open the window and remove the aluminum mask from areas in which the source metal electrode and the drain metal electrode contact the semiconducting channel material.

6. The method of claim 1 , wherein the top gate is patterned using optical lithography followed by an electron beam evaporation of aluminum to create a top gate aluminum mask for etching.

7. The method of claim 6 , wherein providing the top gate above the gate dielectric comprises:

using oxygen plasma etching to remove the second electrode material from everywhere except a gate dielectric/top gate region hard masked by the aluminum mask; and

removing the top gate aluminum mask.

8. The method of claim 1 , wherein

the substrate a rigid substrate comprised of a back gate electrode and a back gate oxide layered on the back gate electrode, and

the semiconducting channel material is layered on the back gate oxide.

9. The method of claim 8 , wherein the back gate electrode is comprised of highly doped silicon and the back gate oxide is comprised of silicon dioxide.

10. The method of claim 1 , wherein the substrate is a flexible substrate comprised of a flexible glass or a flexible polyethylene terephthalate (PET).

11. A two-dimensional thin film transistor comprising:

a substrate;

a semiconducting channel material layered on the substrate;

a source metal electrode and a drain metal electrode located above the semiconducting channel material, the source metal electrode and the drain metal electrode being mirror images of one another within a plane;

a window between the source metal electrode and the drain metal electrode, the window being located above the semiconducting channel material;

a gate dielectric located above the source metal electrode and the drain metal electrode; and

a top gate located above the gate dielectric,

wherein each of the semiconducting channel material, the source metal electrode, the drain metal electrode, and the gate dielectric is comprised of one to seven atomic layers in crystalline form.

12. The two-dimensional thin film transistor of claim 11 , wherein

the semiconducting channel material is comprised of tungsten diselenide;

the source metal electrode, the drain metal electrode and the top gate are comprised of graphene; and

the gate dielectric is comprised of hexagonal boron nitride.

13. The two-dimensional thin film transistor of claim 12 , wherein a field effect carrier mobility is 24-45 cm 2 /Vs.

14. The two-dimensional thin film transistor of claim 12 , wherein a stack comprised of the tungsten diselenide, hexagonal boron nitride, and the graphene is greater than or equal to 88% transparent over an entire visible spectrum.

15. The two-dimensional thin film transistor of claim 12 , wherein the two-dimensional thin film transistor has a temperature stability over 77-400K.

16. The two-dimensional thin film transistor of claim 12 , wherein the two-dimensional thin film transistor has a contact resistance value of 1.2-1.4 kΩ-μm.

17. The two-dimensional thin film transistor of claim 12 , wherein the two-dimensional thin film transistor has a current ON-OFF ratio of 10 6 -10 7 .

18. The two-dimensional thin film transistor of claim 12 , wherein the two-dimensional thin film transistor has a subthreshold slope of 90-130 mv/decade.

19. The two-dimensional thin film transistor of claim 11 , wherein the semiconducting channel material is comprised of a bilayer of tungsten diselenide, and the gate dielectric is comprised of three to four atomic layers of hexagonal boron nitride.

20. The two-dimensional thin film transistor of claim 11 , wherein

the substrate is a rigid substrate comprised of a back gate electrode and a back gate oxide layered on the back gate electrode, and

the semiconducting channel material is layered on the back gate oxide.

21. The two-dimensional thin film transistor of claim 20 , wherein the back gate electrode is comprised of highly doped silicon and the back gate oxide is comprised of silicon dioxide.

22. The two-dimensional thin film transistor of claim 11 , wherein the substrate is a flexible substrate comprised of a flexible glass or a flexible polyethylene terephthalate (PET).

23. The two-dimensional thin film transistor of claim 11 , wherein the semiconducting channel material is layered directly on the substrate.