Porosity control in piezoelectric films
A piezoelectric film having a porosity between 20 and 40%, a thickness ranging from tens of microns to less than a few millimeters can be used to form an ultrasonic transducer UT for operation in elevated temperature ranges, that emit pulses having a high bandwidth. Such piezoelectric films exhibit greater flexibility allowing for conformation of the UT to a surface, and obviate the need for couplings or backings. Furthermore, a method of fabricating an UT having these advantages as well as better bonding between the piezoelectric film and electrodes involves controlling porosity within the piezoelectric film.
1. An ultrasonic transducer (UT) comprising a piezoelectric film sandwiched between two electrodes, wherein the film:
is 2 microns to 2 mm thick;
has a controlled porosity of 15-40% with micron-scale or sub-micron scale pores; and
comprises piezoelectric powders having micron or submicron sizes mixed with a residue of a binder, wherein the binder residue comprises residue of a liquid or gel oxidizing agent that forms an intermediate oxidation layer on at least one of the electrodes, said at least one electrode formed of an electrically conductive material so that the UT is endowed with an ultrasonic bandwidth of at least 30%.
2. The UT of claim 1 wherein the binder residue is:
a residue deposited after thermal treatment that is piezoelectric; or
a residue deposited after thermal treatment that is chemically and thermally stable at a desired operating temperature of the UT, and having a high dielectric constant.
3. The UT of claim 1 wherein the binder residue is:
a residue deposited after thermal treatment that is piezoelectric; and
a residue deposited after thermal treatment that is chemically and thermally stable at a desired operating temperature of the UT, and having a high dielectric constant.
4. The UT of claim 1 wherein the film consists of the powders and the binder residue.
5. The UT of claim 1 wherein the −6 dB bandwidth of the UT is greater than 30%.
6. A combination comprising:
a part of an apparatus, the part having a first surface and a second surface opposite the first surface; and
a high-temperature ultrasonic transducer (UT) comprising a piezoelectric film sandwiched between two electrodes, and control circuitry for the film, wherein the film:
is 2 microns to 2 mm thick;
has a controlled porosity of 15-40% with micron-scale or sub-micron scale pores; and
comprises piezoelectric powders having micron or submicron sizes mixed with a residue of a binder, wherein the binder residue comprises residue of a liquid or gel oxidizing agent that forms an intermediate oxidation layer on at least one of the electrodes, said at least one of the electrodes being formed of an electrically conductive material; and
wherein one of the electrodes is directly coupled to the first surface for emitting or detecting ultrasonic waves in the part at the second surface, opposite the film, without an impedance matching layer, and the UT does not include a backing.
7. The high-temperature UT of claim 6 wherein the binder residue is:
a residue deposited after thermal treatment that is piezoelectric; or
a residue deposited after thermal treatment that is chemically and thermally stable at a desired operating temperature of the UT, and having a high dielectric constant, preferably higher than that of the powders.
8. The high-temperature UT of claim 6 wherein the binder residue is:
a residue deposited after thermal treatment that is piezoelectric; and
a residue deposited after thermal treatment that is chemically and thermally stable at a desired operating temperature of the UT, and having a high dielectric constant, preferably higher than that of the powders.
9. The high-temperature UT of claim 6 wherein the film consists of the powders and the binder residue.
10. The high-temperature UT of claim 6 wherein the −6 dB bandwidth of the UT is greater than 30%.