Printed circuit board, semiconductor device connection structure, and method of manufacturing a printed circuit board
First electrode pads formed on one semiconductor package surface include a first reinforcing electrode pad having a surface area larger than that of other first electrode pads. Second electrode pads formed on a printed wiring board on which the semiconductor package is mounted include at least one second reinforcing electrode pad. The second reinforcing electrode pad opposes the first reinforcing electrode pad, and has a surface area greater than that of the other second electrode pads. The first and second electrode pads are connected by solder connection parts. A cylindrical enclosing member encloses an outer perimeter of a solder connection part connecting the first and second reinforcing electrode pads. Increases in the amount of warping of semiconductor devices such as the package substrate and the printed wiring board are suppressed, and the development of solder bridges with respect to adjacent solder connecting parts or adjacent components is reduced.
1. A printed circuit board, comprising:
a semiconductor package having:
a package substrate having a plurality of first electrode pads arranged on one surface of the semiconductor package, the plurality of first electrode pads includes at least one first reinforcing electrode pad having a surface area larger than a surface area of each of the other first electrode pads; and
a semiconductor element mounted on the package substrate;
a printed wiring board having a plurality of second electrode pads that is arranged opposing each of the first electrode pads, the semiconductor package is mounted on the printed wiring board and the plurality of second electrode pads includes at least one second reinforcing electrode pad being disposed in a location opposing the at least one first reinforcing electrode pad and having a surface area larger than a surface area of each of the other second electrode pads;
a plurality of solder connection parts being configured to connect the plurality of first electrode pads and the plurality of second electrode pads, the plurality of solder connection parts includes a plurality of first solder connection parts and a second solder connection part being configured to connect the at least one first reinforcing electrode pad and the at least one second reinforcing electrode pad; and
a cylindrical enclosing member being configured to enclose an outer perimeter of the second solder connection part,
wherein the cylindrical enclosing member is formed using a porous member.
2. A printed circuit board according to claim 1 , wherein the cylindrical enclosing member has a melting point higher than a melting point of solder used in the plurality of solder connection parts, and the cylindrical enclosing member is prevented from being directly fixed to the package substrate and to the printed wiring board.
3. A printed circuit board according to claim 1 ,
wherein the plurality of solder connecting parts is arranged in matrix, and
wherein the second solder connection part is disposed in an outer perimeter of the plurality of solder connection parts arranged in matrix.
4. A printed circuit board according to claim 3 , wherein the second solder connection part is disposed in each of four corner portions of the plurality of solder connection parts arranged in matrix.
5. A printed circuit board according to claim 3 , wherein the second solder connection part is disposed in each of four corner portions and location other than the four corner portions of the plurality of solder connection parts arranged in matrix.
6. A printed circuit board according to claim 1 ,
wherein the first solder connection parts, from among the plurality of solder connection parts, are arranged in matrix, and
wherein the second solder connection part is disposed further to an outer perimeter portion than the first solder connection parts arranged in matrix.
7. A printed circuit board according to claim 6 , wherein the second solder connecting part is disposed in each of four corner portions of the package substrate, which are located further to the outer perimeter portion than the first solder connection parts arranged in matrix.
8. A printed circuit board according to claim 1 , wherein the cylindrical enclosing member has one of an opening and a slit with a width equal to or less than 20 μm.
9. A printed circuit board according to claim 1 , wherein the semiconductor package corresponds to an LGA semiconductor package.
10. A semiconductor device connection structure, comprising:
a first semiconductor device having a plurality of first electrode pads arranged on one surface of the first semiconductor device, the plurality of first electrode pads including at least one first reinforcing electrode pad having a surface area larger than a surface area of each of other first electrode pads;
a second semiconductor device having a plurality of second electrode pads that is arranged opposing each of the first electrode pads, the plurality of second electrode pads includes at least one second reinforcing electrode pad being disposed in a location opposing the at least one first reinforcing electrode pad and having a surface area larger than a surface area of each of the other second electrode pads;
a plurality of solder connection parts being configured to connect the plurality of first electrode pads and the plurality of second electrode pads, the plurality of solder connection parts includes a plurality of first solder connection parts and a second solder connection part being configured to connect the at least one first reinforcing electrode pad and the at least one second reinforcing electrode pad; and
a cylindrical enclosing member being configured to enclose an outer perimeter of the second solder connection part,
wherein the cylindrical enclosing member is formed using a porous member.