Two-dimensional large-area growth method for chalcogen compound, method for manufacturing CMOS-type structure, film of chalcogen compound, electronic device comprising film of chalcogen compound, and CMOS-type structure
Provided is a two-dimensional large-area growth method for a chalcogen compound, the method including: depositing a film of a transition metal element or a Group V element on a substrate; thereafter, uniformly diffusing a vaporized chalcogen element, a vaporized chalcogen precursor compound or a chalcogen compound represented by M′X′ 2+δ within the film; and, thereafter, forming a film of a chalcogen compound represented by MX 2 by forming the chalcogen compound represented by MX 2 through post-heating.
1. A two-dimensional large-area growth method for a chalcogen compound, the method comprising:
forming a film of a transition metal element or a Group V, or Group VI element by depositing the transition metal element or the Group V, or Group VI element on a substrate;
diffusing the chalcogen element, the chalcogen precursor compound or the chalcogen compound represented by M′X′ 2+δ into the film of the transition metal element or the Group V, or Group VI element by contacting through vaporization at least one selected from the group consisting of a chalcogen element, a chalcogen precursor compound and a chalcogen compound represented by M′X′ 2+δ and combinations thereof with the film of the transition metal element or the Group V, or Group VI element, wherein M′ is a transition metal element or a Group V, or Group VI element, X′ is a chalcogen element, and 0≦δ≦0.5; and
forming a film of the chalcogen compound represented by MX 2 by post-heating the film of the transition metal element or the Group V, or Group VI element including the resultant diffused chalcogen element, chalcogen precursor compound or chalcogen compound represented by M′X′ 2+δ wherein M is a transition metal element or a Group V, or Group VI element and X is a chalcogen element.
2. The two-dimensional large-area growth method according to claim 1 , wherein the transition metal is at least one selected from the group including Cr, Mo, W, Sn and combinations thereof, and the Group V, or Group VI element is at least one selected from the group including As, Sb, Bi and combinations thereof.
3. The two-dimensional large-area growth method according to claim 1 , wherein the each chalcogen element is at least one selected from the group including S, Se, Te and combinations thereof, and the chalcogen precursor compound is at least one selected from the group including SO 2 , H 2 S, H 2 Se, SeO 2 , SeF 4 , TeO 3 , TeO 2 , TeF 4 and combinations thereof.
4. The two-dimensional large-area growth method according to claim 1 , wherein the film of the transition metal element or the Group V element is deposited and formed through a physical or chemical vapor-phase synthesis method.
5. The two-dimensional large-area growth method according to claim 1 , wherein the chalcogen element, the chalcogen precursor compound or the chalcogen compound represented by M′X′ 2+δ is diffused into the film of the transition metal element or the Group V, or Group VI element at 100 to 1500° C. by contacting through vaporization the chalcogen element, the chalcogen precursor compound or the chalcogen compound represented by M′X′ 2+δ with the film of the transition metal element or the Group V element.
6. The two-dimensional large-area growth method according to claim 1 , wherein the chalcogen element, the chalcogen precursor compound or the chalcogen compound represented by M′X′ 2+δ vaporized into the film of the transition metal element or the Group V, or Group VI element is diffused through a method selected from the group consisting of chemical vapor deposition (CVD), thermal CVD, plasma enhanced chemical vapor deposition (PECVD), low pressure chemical vapor deposition (LPCVD), atomic layer deposition (ALD), pulsed laser deposition (PLD), sputtering and combinations thereof, using at least one raw material selected from the chalcogen element, the chalcogen precursor or the chalcogen compound represented by M′X′ 2+δ and combinations thereof.
7. The two-dimensional large-area growth method according to claim 1 , wherein the vaporized chalcogen element, chalcogen precursor compound or chalcogen compound represented by M′X′ 2+δ is migrated by a carrier gas and diffused into the film of the transition metal element or the Group V, or Group VI element.
8. The two-dimensional large-area growth method according to claim 7 , wherein the carrier gas comprises at least one selected from the group including iodine, bromine and combinations thereof.
9. The two-dimensional large-area growth method according to claim 1 , wherein, upon the post-heating, a large amount of the chalcogen element and a remainder of the precursor compound are vaporized.
10. The two-dimensional large-area growth method according to claim 1 , wherein, upon the post-heating, the carrier gas is vaporized.
11. The two-dimensional large-area growth method according to claim 1 , wherein the post-heating is carried out at 100 to 1500° C.
12. The two-dimensional large-area growth method according to claim 1 , wherein the substrate comprises at least one selected from the group including a glass substrate, a Si substrate, a quartz substrate, a sapphire substrate and combinations thereof.
13. The two-dimensional large-area growth method according to claim 1 , further comprising recrystallizing the chalcogen compound represented by MX 2 by annealing the film of the chalcogen compound represented by MX 2 .
14. The two-dimensional large-area growth method according to claim 13 , wherein the recrystallizing is carried out through energy beam irradiation.