Light emitter with a conductive transparent p-type layer structure
A light emitting device includes an n-type layer, a p-type layer structure, a layer of p-type nano-dots imbedded in the p-type layer structure, and an active region sandwiched between the n-type layer and the p-type layer structure, where the p-type nano-dots possess a sheet density of 10 10 to 10 12 cm −2 , a lateral dimension of 2-20 nm, and a vertical dimension of 1-5 nm. The p-type layer structure with a layer of p-type nano-dots imbedded therein provides good vertical conductivity and UV transparency. Also provided is a method for making the light emitting device.
1. A method of forming a vertically conductive UV transparent p-type layer structure, comprising steps:
forming a smooth p-type AlGaN layer on a light emitting active-region of a light emitting device via metalorganic chemical vapor deposition at a temperature between 1000-1050° C., wherein the smooth p-type AlGaN layer serves as an electron blocking layer;
forming a rough p-type AlGaN layer on the smooth p-type AlGaN layer via metalorganic chemical vapor deposition at a temperature 50-200° C. lower than that of the smooth p-type AlGaN layer so as to form surface protrusions of height 5 to 30 nm, lateral size 10 to 100 nm, and sheet density 10 10 to 10 12 cm −2 on the rough p-type AlGaN layer, wherein the smooth p-type AlGaN layer and the rough p-type AlGaN layer are UV transparent for wavelength below 320 nm;
forming a p-type InGaN layer with an In-composition of 0-10% or a p-type AlGaN layer with an Al-composition of 0-10% on the rough p-type AlGaN layer via metalorganic chemical vapor deposition at a temperature between 800-1000° C., such that a layer of nano-dots is formed with the nano-dots being formed within depressions between the protrusions of the rough p-type AlGaN layer, wherein the nano-dots possess a sheet density of 10 10 to 10 12 cm −2 , a lateral dimension of 2-20 nm, a vertical dimension of 1-5 nm; and
conformally forming a confining p-type AlGaN layer on the p-type InGaN layer or the p-type AlGaN layer via metalorganic chemical vapor deposition to cover the nano-dots.
2. The method of forming the vertically conductive UV transparent p-type layer structure according to claim 1 , wherein an Al-composition of the confining p-type AlGaN layer is substantially the same as that of the rough p-type AlGaN layer.
3. The method of forming the vertically conductive UV transparent p-type layer structure according to claim 1 , wherein a formation ambient in the metalorganic chemical vapor deposition for forming the rough p-type AlGaN layer is ammonia-nitrogen ambient.
4. The method of forming the vertically conductive UV transparent p-type layer structure according to claim 1 , wherein an Al-composition of the smooth p-type AlGaN layer is 5-10% higher than an Al-composition of the rough p-type AlGaN layer.
5. The method of forming the vertically conductive UV transparent p-type layer structure according to claim 1 , wherein multiple pairs of the confining p-type AlGaN layer and the layer of nano-dots are formed on the rough p-type AlGaN layer.
6. The method of forming the vertically conductive UV transparent p-type layer structure according to claim 1 , further comprising:
forming a UV light reflective p-type ohmic contact on the confining p-type AlGaN layer.
7. The method of forming the vertically conductive UV transparent p-type layer structure according to claim 1 , wherein a thickness of the smooth p-type AlGaN layer is in a range of 5-30 nm.
8. The method of forming the vertically conductive UV transparent p-type layer structure according to claim 1 , wherein a thickness of the confining p-type AlGaN layer is in a range of 2-10 nm.
9. A method of forming a vertically conductive UV transparent p-type structure, comprising steps:
forming a smooth p-type AlGaN layer on a light emitting active-region of a light emitting device via metalorganic chemical vapor deposition at a temperature of 1000-1050° C.;
forming a p-type AlGaN layer on the smooth p-type AlGaN layer via metalorganic chemical vapor deposition at a temperature of 1000-1050° C., wherein the Al-composition of the smooth p-type AlGaN layer is 5-10% higher than an Al-composition of the p-type AlGaN layer;
forming a p-type InGaN layer with an In-composition of 0-10% and a nominal thickness of 1-5 nm on the p-type AlGaN layer in Stranski-Krastanov growth mode via metalorganic chemical vapor deposition at a temperature of 800-1000° C., so that the p-type InGaN layer is formed with a wetting layer portion and nano-dots, wherein the nano-dots possess a sheet density of 10 10 to 10 12 cm −2 , a lateral dimension of 2-20 nm, a vertical dimension of 1-5 nm.
10. The method of forming the vertically conductive UV transparent p-type layer structure according to claim 9 , further comprising:
forming a UV light reflective p-type ohmic contact on the p-type InGaN layer.
11. The method of forming the vertically conductive UV transparent p-type layer structure according to claim 9 , wherein a thickness of the p-type AlGaN layer is in a range of 2-10 nm.
12. The method of forming the vertically conductive UV transparent p-type layer structure according to claim 9 , wherein a thickness of the smooth p-type AlGaN layer is in a range of 5-30 nm.