Organic light-emitting diode (OLED) display comprising flexible substrate, electronic device including the same, and method of manufacturing the OLED display
An organic light-emitting diode (OLED) display, electronic device including the same and method of manufacturing the OLED display are disclosed. In one aspect, the OLED display includes a first plastic layer, a first barrier layer formed over the first plastic layer and a first intermediate layer formed over the first barrier layer. The OLED display also includes a second plastic layer formed over the first intermediate layer, a second intermediate layer formed over the second plastic layer and a second barrier layer formed over the second intermediate layer. The OLED display further includes an OLED layer formed over the second barrier layer and a thin-film encapsulation layer encapsulating the OLED layer.
1. An organic light-emitting diode (OLED) display, comprising:
a first plastic layer;
a first barrier layer formed over the first plastic layer;
a first intermediate layer formed over the first barrier layer, wherein the first intermediate layer comprises amorphous silicon;
a second plastic layer formed over the first intermediate layer;
a second intermediate layer formed over the second plastic layer;
a second barrier layer formed over the second intermediate layer;
an OLED layer formed over the second barrier layer; and
a thin-film encapsulation layer encapsulating the OLED layer.
2. The OLED display of claim 1 , wherein the second intermediate layer comprises amorphous silicon.
3. The OLED display of claim 1 , wherein the first intermediate layer comprises a metal thin film.
4. The OLED display of claim 1 , wherein the second intermediate layer comprises a metal thin film.
5. The OLED display of claim 1 , wherein an ultraviolet (UV) transmittance of the first intermediate layer is greater than or equal to about 10%.
6. The OLED display of claim 1 , wherein each of the first plastic layer and the second plastic layer comprises at least one of the following materials: polyimide, polyethylene naphthalate, polyethylene terephthalate (PET), polyarylate, polycarbonate, polyethersulfone, and polyetherimide (PEI).
7. The OLED display of claim 1 , wherein the second plastic layer has a thickness that is greater than that of the first plastic layer.
8. The OLED display of claim 1 , wherein the second plastic layer has a viscosity that is less than that of the first plastic layer.
9. The OLED display of claim 1 , wherein the first barrier layer comprises a first silicon nitride layer, wherein the second barrier layer comprises a second silicon nitride layer, and wherein a silicon nitride density of the second barrier layer is greater than that of the first silicon nitride layer.
10. The OLED display of claim 9 , wherein the first barrier layer further comprises a metal oxide film or a silicon oxide film.
11. The OLED display of claim 9 , wherein the second barrier layer further comprises a metal oxide film or a silicon oxide film.
12. The OLED display of claim 9 , wherein the silicon nitride density of the first silicon nitride layer is greater than or equal to about 2.2 g/cm 3 and is less than or equal to about 2.4 g/cm 3 .
13. The OLED display of claim 1 , wherein the thin-film encapsulation layer comprises at least one of an inorganic layer and an organic layer.
14. An electronic device comprising:
an organic light-emitting diode (OLED) display, comprising:
a first plastic layer;
a first barrier layer formed over the first plastic layer;
a first intermediate layer formed over the first barrier layer, wherein the first intermediate layer comprises amorphous silicon;
a second plastic layer formed over the first intermediate layer;
a second barrier layer formed over the second plastic layer;
an OLED layer formed over the second barrier layer; and
a thin-film encapsulation layer encapsulating the OLED layer.
15. A method of manufacturing an organic light-emitting diode (OLED) display, comprising:
preparing a carrier substrate;
forming a mother flexible substrate on the carrier substrate, wherein the mother substrate comprises a first plastic layer, a first barrier layer, a first intermediate layer, a second plastic layer, and a second barrier layer that are sequentially stacked, wherein the first intermediate layer comprises amorphous silicon;
forming a plurality of OLED layers on the mother flexible substrate;
forming a thin-film encapsulation layer so as to encapsulate the OLED layers;
separating the mother flexible substrate from the carrier substrate; and
dividing the OLED layers formed on the mother flexible substrate into a plurality of display units.
16. The method of claim 15 , wherein the separating of the mother flexible substrate from the carrier substrate comprises emitting laser light toward a surface of the carrier substrate that is opposite to a surface of the carrier substrate on which the mother flexible substrate is formed.
17. The method of claim 16 , wherein the laser light is ultraviolet (UV) light.
18. The method of claim 15 , wherein the carrier substrate is a glass substrate.
19. The method of claim 15 , wherein the first barrier layer comprises at least a first silicon nitride layer, wherein the second barrier layer comprises a second silicon nitride layer, and wherein a silicon nitride density of the second silicon nitride layer is greater than that of the first silicon nitride layer.