Composite module
Provided is a technique capable of improving isolation characteristics between a plurality of signal paths through which RF signals pass, without using ground electrodes or the like. Wiring electrodes 10 a and 20 a through which RF signals do not pass simultaneously are formed so as to be adjacent to each other in a central region of a component mounting surface 2 a of a circuit board 2 , and wiring electrodes 11 a and 21 a through which RF signals pass simultaneously are formed so as to be distanced from transmission paths 10 and 20 . Accordingly, the RF signals do not simultaneously pass through the transmission paths 10 and 20 , which are disposed near each other, and thus there is no risk that the RF signal passing through one of the signal paths will interfere with the RF signal passing through the other signal path.
1. A composite module comprising a circuit board having a plurality of communication systems provided thereon, wherein the plurality of communication systems communicate using respective predetermined frequency bands,
wherein each of the communication systems includes a plurality of signal paths allowing RF signals to pass; and
wiring electrodes forming signal paths not allowing the RF signals to pass simultaneously, among the plurality of signal paths and provided respectively in at least two of the communication systems are formed together so as to be adjacent to each other in a predetermined region of the circuit board,
wherein the plurality of communication systems are first and second communication systems;
each of the first and second communication systems includes a transmission path not allowing the RF signals to pass simultaneously and a reception path allowing the RF signals to pass simultaneously as the signal paths;
transmission path wiring electrodes each forming the transmission paths are formed in the circuit board so as to be disposed adjacent to each other when viewed from above;
a reception path wiring electrode forming the reception path of the first communication system is formed in a region of the circuit board closer to the first communication system; and
a reception path wiring electrode that forms the reception path of the second communication system is formed in a region of the circuit board closer to the second communication system.
2. The composite module according to claim 1 ,
wherein the wiring electrodes forming the signal paths not allowing the RF signals to pass simultaneously are formed together in a central region of the circuit board when viewed from above.
3. The composite module according to claim 2 ,
wherein the wiring electrodes are formed on one main surface of the circuit board.
4. The composite module according to claim 1 ,
wherein the wiring electrodes are formed on one main surface of the circuit board.
5. The composite module according to claim 1 ,
wherein the first communication system includes a first antenna terminal and the second communication system includes a second antenna terminal;
the first antenna terminal is formed at an end edge of a region of the circuit board in which the transmission path wiring electrode and the reception path wiring electrode of the first communication system are formed; and
the second antenna terminal is formed at an end edge of a region of the circuit board in which the transmission path wiring electrode and the reception path wiring electrode of the second communication system are formed.
6. The composite module according to claim 1 , wherein the wiring electrodes, the transmission path wiring electrodes, and the reception path wiring electrodes connect front end modules corresponding to the plurality of communication systems with a radio frequency integrated circuit.