Method for producing a flexible piezoelectric sensor
A method for producing a piezoelectric sensor, includes the following steps: producing, on a rigid support ( 10 ), a stack of sensor layers ( 2, 4, 5, 12 ), the sensor layers including a layer of piezoelectric material ( 5 ) included between a first electrode ( 6, 7 ) and a second electrode ( 8, 9 ), the first electrode not being in contact with the second electrode, then, while the sensor layers ( 2, 4, 5, 12 ) are still held by the rigid support ( 10 ), covering the sensor layers with a polymer layer ( 11 ), then removing the stack of sensor layers from the rigid support ( 10 ), such that the sensor layers covered by the polymer layer ( 11 ) are no longer carried by the rigid support ( 10 ).
1. Process for producing a piezoelectric sensor ( 1 ), comprising the following steps:
producing, on a support ( 10 ), a stack of sensor layers ( 2 , 4 , 5 , 12 , 19 ), the sensor layers comprising a layer of piezoelectric material ( 5 ) comprised between a first electrode ( 6 , 7 ) and a second electrode ( 8 , 9 ), the first electrode not being in contact with the second electrode, the stack of sensor layers comprising a first conductive layer ( 2 ), and a second conductive layer ( 4 ), each of the first ( 2 ) and second ( 4 ) conductive layers comprising two parts, a first part ( 6 ) of the first conductive layer being in contact with a first part ( 7 ) of the second conductive layer, a second part ( 8 ) of the first conductive layer being in contact with a second part ( 9 ) of the second conductive layer, the first electrode ( 6 , 7 ) being formed by the first part of the first conductive layer and by the first part of the second conductive layer, the second electrode ( 8 , 9 ) being formed by the second part of the first conductive layer and by the second part of the second conductive layer, the layer of piezoelectric material ( 5 ) being comprised at least in part between the first conductive layer and the second conductive layer, then
while the sensor layers ( 2 , 4 , 5 , 12 , 19 ) are still carried by the support ( 10 ), coating the sensor layers with a first layer ( 11 ) of polymer, then
removing at least a part of the support ( 10 ) from the stack of sensor layers.
2. Process according to claim 1 , wherein, after the removal of the at least a part of the support, a second layer ( 24 ) of polymer is produced, so that the sensor layers ( 2 , 4 , 5 , 12 , 19 ) are encapsulated between the first polymer layer ( 11 ) and the second polymer layer ( 24 ).
3. Process according to claim 1 , wherein all of the support ( 10 ) is removed from the stack of sensor layers.
4. Process according to claim 1 , wherein the support ( 10 ) is a rigid support having, under standard ambient conditions of a temperature of 25° C. and absolute pressure of 0.986 atm., a Young's modulus greater than 100 GPa.
5. Process according to claim 1 , which also comprises the production of an antenna linking the first electrode to the second electrode, said antenna making one or more turns so as to create a closed loop.
6. Process according to claim 5 , wherein the piezoelectric layer ( 5 ) is in the form of a bar extending longitudinally and in that the bar extends longitudinally from the perimeter of the loop and towards the inside of the loop.
7. Process according to claim 5 , wherein the sensor layers comprise an insulating layer, produced between the antenna and the first electrode and produced between the antenna and the second electrode, at zones where the antenna is superimposed on the first electrode or the second electrode.
8. Process according to claim 7 , wherein the insulating layer is produced from an electrically insulating material, having an electrical resistivity greater than 10 3 ohm·cm under standard ambient conditions of a temperature of 25° C. and absolute pressure of 0.986 atm.
9. Process according to claim 7 , wherein the sensor layers also comprise a stiffening layer ( 12 ) superimposed on the piezoelectric layer.
10. Process according to claim 9 , wherein in the stiffening layer and the insulating layer are produced from one and the same material during one and the same layer deposition step.
11. Process according to claim 1 , wherein the total thickness of the sensor layers ( 2 , 4 , 5 , 12 , 19 ) is less than 3 micrometers.
12. Sensor ( 1 ) obtained by a production process according to claim 1 .
13. Process for using a sensor obtained according to claim 1 , comprises the following steps:
the sensor ( 1 ) is applied on a human or animal body, then
for each heartbeat of said body among several beats, the heartbeat deforms the piezoelectric layer ( 5 ), generating a variation in electric charge in the electrodes ( 6 , 7 ; 8 , 9 ),
for each variation in electric charge, this variation in electric charge is detected, and
a heart rate of the body is deduced from these detections.
14. Process for using a sensor obtained according to claim 1 , which comprises the following steps:
the sensor is applied on a human or animal body, then
an electromagnetic field is emitted by excitation electronics, then
the electromagnetic field is picked up by an antenna electrically connected to the first electrode ( 6 , 7 ) and to the second ( 8 , 9 ) electrode of the sensor ( 1 ), generating an electric current in the antenna, at a frequency f 1 equal to a resonance frequency f 0 of the inactive sensor or to a harmonic of this resonance frequency f 0 ,
for each heartbeat of said body among several beats, the heartbeat deforms the piezoelectric layer ( 5 ), causing a variation Df in the resonance frequency,
for each variation Df in the resonance frequency, a signal oscillating at a frequency f 1 +Df is received by measurement electronics,
a heart rate of the body is deduced from these detections.
15. Process according to claim 1 , wherein the sensor layers also comprise a stiffening layer ( 12 ) superimposed on the piezoelectric layer.
16. Process according to claim 8 , wherein the stiffening layer and the insulating layer are produced from one and the same material during one and the same layer deposition step.