Mask assembly and photolithography process using the same
A mask assembly including a first mask and a second mask is provided. The first mask includes a plurality of first main features parallel to each other, a plurality of first sub-resolution assistant features (SRAFs) and a plurality of second SRAFs. The second SRAFs are separately disposed at one side of the first main features. The first SRAFs are separately disposed between the first main features and the second SRAFs. An extension direction of the first main features is parallel to an extension direction of the second SRAFs. The second mask includes a plurality of second main features parallel to each other. When the first mask and the second mask are placed at a predetermined position above a negative-type development photoresist layer for performing exposure respectively, the second main features intersect with the first main features and the second main features overlap with the first SRAFs.
1. A mask assembly for performing double exposure on a negative-type development photoresist layer, the mask assembly comprising:
a first mask comprising a plurality of first main features parallel to each other, a plurality of first sub-resolution assistant features, and a plurality of second sub-resolution assistant features, wherein the second sub-resolution assistant features are disposed separately from each other at one side of the first main features, the first sub-resolution assistant features are disposed separately from each other between the first main features and the second sub-resolution assistant features, and an extension direction of the first main features is parallel to an extension direction of the second sub-resolution assistant features; and
a second mask comprising a plurality of second main features parallel to each other, wherein the second main features intersect with the first main features, and the second main features overlap with the first sub-resolution assistant features when the first mask and the second mask are placed at a predetermined position above the negative-type development photoresist layer for performing exposure respectively.
2. The mask assembly according to claim 1 , wherein the extension direction of the first main features is vertical to an extension direction of the second main features when the first mask and the second mask are placed at the predetermined position for performing exposure respectively.
3. The mask assembly according to claim 1 , wherein an extension direction of the first sub-resolution assistant features is parallel to the extension direction of the second main features when the first mask and the second mask are placed at the predetermined position for performing exposure respectively.
4. The mask assembly according to claim 1 , wherein an arrangement interval of the first sub-resolution assistant features is identical to an arrangement interval of the second main features.
5. The mask assembly according to claim 1 , wherein the second sub-resolution assistant features do not overlap with the first main features and the second main features when the first mask and the second mask are placed at the predetermined position for performing exposure respectively.
6. The mask assembly according to claim 1 , wherein the second mask further comprises a plurality of third sub-resolution assistant features and a plurality of fourth sub-resolution assistant features, wherein the fourth sub-resolution assistant features are disposed separately from each other at one side of the second main features, the third sub-resolution assistant features are disposed separately from each other between the second main features and the fourth sub-resolution assistant features, and the extension direction of the second main features is parallel to an extension direction of the fourth sub-resolution assistant features.
7. The mask assembly according to claim 6 , wherein an extension direction of the third sub-resolution assistant features is parallel to the extension direction of the first main features when the first mask and the second mask are placed at the predetermined position for performing exposure respectively.
8. The mask assembly according to claim 6 , wherein an arrangement interval of the third sub-resolution assistant features is identical to an arrangement interval of the first main features.
9. The mask assembly according to claim 6 , wherein each of the third sub-resolution assistant features is disposed between two adjacent first main features, and the third sub-resolution assistant features do not overlap with the first main features when the first mask and the second mask are placed at the predetermined position for performing exposure respectively.
10. The mask assembly according to claim 6 , wherein the fourth sub-resolution assistant features do not overlap with the first main features and the second main features when the first mask and the second mask are placed at the predetermined position for performing exposure respectively.
11. A photolithography process comprising:
providing the mask assembly according to claim 1 ;
exposing the negative-type photoresist layer twice respectively with the first mask and the second mask as a mask; and
performing development on the negative-type photoresist layer.
12. The photolithography process according to claim 11 , wherein the extension direction of the first main features is vertical to the extension direction of the second main features when the first mask and the second mask are placed at the predetermined position for performing exposure respectively.
13. The photolithography process according to claim 11 , wherein the extension direction of the first sub-resolution assistant features is parallel to the extension direction of the second main features when the first mask and the second mask are placed at the predetermined position for performing exposure respectively.
14. The photolithography process according to claim 11 , wherein the arrangement interval of the first sub-resolution assistant features is identical to the arrangement interval of the second main features.
15. The photolithography process according to claim 11 , wherein the second mask further comprises a plurality of third sub-resolution assistant features and a plurality of fourth sub-resolution assistant features, wherein the fourth sub-resolution assistant features are disposed separately from each other at one side of the second main features, the third sub-resolution assistant features are disposed separately from each other between the second main features and the fourth sub-resolution assistant features, and the extension direction of the second main features is parallel to an extension direction of the fourth sub-resolution assistant features.
16. The photolithography process according to claim 15 , wherein an extension direction of the third sub-resolution assistant features is parallel to the extension direction of the first main features when the first mask and the second mask are placed at the predetermined position for performing exposure respectively.
17. The photolithography process according to claim 15 , wherein an arrangement interval of the third sub-resolution assistant features is identical to an arrangement interval of the first main features.
18. The photolithography process according to claim 15 , wherein the development comprises negative-tone development.