Thermosetting resin composition
There is provided novel thermosetting resin composition. A thermosetting resin composition comprising a polymer having at least one structural unit of the following Formula (1): {wherein each of R 1 and R 2 is independently a hydrogen atom or a C 1-4 alkyl group, X is a single bond or a divalent organic group, and Y is an arylene group of the following Formula (2): (wherein Z 1 is a carbonyl group or a —CONH— group, Z 2 is a C 1-5 alkylene group or a 5- or 6-membered divalent saturated heterocyclic group containing at least one nitrogen atom, and Z 3 is a 5- or 6-membered aromatic heterocyclic group containing two nitrogen atoms in which at least one of hydrogen atoms may be substituted by a C 1-5 alkyl group)}.
1. A thermosetting resin composition comprising a polymer having at least one structural unit of the following Formula (1):
{wherein each of R 1 and R 2 is independently a hydrogen atom or a C 1-4 alkyl group, X is a single bond or a divalent organic group, and Y is an arylene group of the following Formula (2):
(wherein Z 1 is a carbonyl group or a —CONH— group, Z 2 is a C 1-5 alkylene group or a 5- or 6-membered divalent saturated heterocyclic group containing at least one nitrogen atom, and Z 3 is a 5- or 6-membered aromatic heterocyclic group containing two nitrogen atoms in which at least one of hydrogen atoms may be substituted by a C 1-5 alkyl group)}.
2. The thermosetting resin composition according to claim 1 , wherein Z 3 in Formula (2) is an imidazoryl group.
3. The thermosetting resin composition according to claim 1 , wherein Z 2 in Formula (2) is a C 1-5 alkylene group.
4. The thermosetting resin composition according to claim 1 , wherein Z 1 in Formula (2) is a —CONH— group.
5. The thermosetting resin composition according to claim 1 , wherein X in Formula (1) is a divalent organic group containing a C 1-6 alkylene group in which at least one of hydrogen atoms may be substituted by a halogen atom, a cyclic alkylene group, an arylene group in which at least one of hydrogen atoms may be substituted by a halogen atom, a sulfonyl group, a carbonyl group, a —O— group, or a —COO— group.
6. The thermosetting resin composition according to claim 1 , wherein X in Formula (1) is a divalent organic group of the following Formula (3):
(wherein each of R 3 and R 4 is independently a hydrogen atom or a methyl group in which at least one of hydrogen atoms may be substituted by a halogen atom, and m is 0 or 1).
7. The thermosetting resin composition according to claim 6 , wherein the divalent organic group of Formula (3) is the following Formula (3-a) or (3-b):
8. The thermosetting resin composition according to claim 1 , wherein the polymer further has a structural unit of Formula (4):
{wherein R 1 , R 2 , and X are the same as the definitions according to claim 1 , and Q is a divalent organic group of the following Formula (5) or (6):
(wherein T is a single bond, a sulfonyl group, or a —O— group, each of R 3 and R 4 is independently a hydrogen atom or a methyl group in which at least one of hydrogen atoms may be substituted by a halogen atom, four R 5 are each independently a hydrogen atom, a methyl group, an ethyl group, or a methoxy group, and n is 0 or 1)}.
9. The thermosetting resin composition according to claim 8 , wherein the divalent organic group of Formula (5) or (6) is the following Formula (5-a), (6-a), (6-b) or (6-c):
10. The thermosetting resin composition according to claim 1 , wherein the polymer has a weight average molecular weight of 1,000 to 100,000.
11. The thermosetting resin composition according to claim 1 , further comprising an epoxy resin.
12. The thermosetting resin composition according to claim 1 , further comprising a solvent.
13. The thermosetting resin composition according to claim 1 , which is an adhesive composition or an underfill composition.
14. The thermosetting resin composition according to claim 1 , further comprising a silane coupling agent.
15. The thermosetting resin composition according to claim 1 , further comprising inorganic fillers with a particle diameter of 1 nm or more and 700 nm or less.