Systems and methods for coupling a semiconductor device of an automation device to a heat sink
A system includes a heat sink, a semiconductor device, and a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device. The TIM may facilitate dissipation of heat generated by the semiconductor device via the heat sink. The system also includes a fastener system that couples the semiconductor device to the heat sink about the layer of TIM. The system also includes one or more washers of the fastener system that maintain a coupling force between the semiconductor device and the heat sink after the TIM flows.
1. A system, comprising:
a heat sink;
a semiconductor device;
a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device, wherein the TIM is configured to facilitate dissipation of heat generated by the semiconductor device via the heat sink;
a fastener system configured to couple the semiconductor device to the heat sink about the layer of TIM; and
a plurality of washers of the fastener system, wherein each washer of the plurality of washers comprises:
a first side and a second side, wherein the first side has a larger diameter than the second side; and
wherein each washer of the plurality of washers is positioned such that the first side of a first washer of the plurality of washers is adjacent to the first side of a second washer of the plurality of washers, or the second side of the first washer is adjacent to the second side of the second washer, and wherein the plurality of washers are configured to maintain a coupling force between the semiconductor device and the heat sink after the TIM flows.
2. The system of claim 1 , wherein the plurality of washers comprises a plurality of Belleville-type washers.
3. The system of claim 1 , wherein the first side of the first washer of the plurality of washers is positioned against a head of a fastener in the fastener system; and
wherein the second side of the second washer is positioned against the second side of the first washer.
4. The system of claim 1 , wherein a type of the plurality of washers and a number of the plurality of washers correlate to a size of a fastener of the fastener system, an amount of torque being applied to the fastener, and an amount of expected deflection between the heat sink and the semiconductor device after the TIM flows.
5. The system of claim 1 , wherein the plurality of washers are configured to maintain the coupling force between the semiconductor device and the heat sink after the TIM flows by providing a spring force, wherein the spring force is configured to limit a loss of an axial force between the heat sink and the semiconductor device, wherein the axial force corresponds to a torque value applied to a fastener of the fastener system.
6. The system of claim 1 , wherein the coupling force corresponds to a percentage of an axial force between the heat sink and the semiconductor device when a fastener of the fastener system is torqued to a torque value associated with the semiconductor device.
7. The system of claim 6 , wherein the percentage is between 70% and 80%.
8. An industrial automation drive, comprising:
a heat sink-semiconductor assembly comprising:
a thermal interface material (TIM) configured to be disposed between a semiconductor device and a heat sink, wherein the semiconductor device is configured to convert an alternating current (AC) voltage into a direct current (DC) voltage or convert the DC voltage into a controllable AC voltage;
a fastener configured to couple the semiconductor device to the heat sink; and
a plurality of washers, wherein each washer of the plurality of washers comprises:
a first side and a second side, wherein the first side has a larger diameter than the second side; and
wherein the plurality of washers are configured to be inserted onto the fastener, wherein each washer of the plurality of washers is positioned such that the first side of a first washer of the plurality of washers is adjacent to the first side of a second washer of the plurality of washers, or the second side of the first washer is adjacent to the second side of the second washer, and wherein the plurality of washers is configured to maintain a force between the semiconductor device and the heat sink after the TIM flows.
9. The industrial automation device of claim 8 , wherein the force corresponds to a percentage of an axial force applied between the heat sink and the semiconductor device, wherein the axial force is associated with a torque value applied to the fastener before the TIM flows.
10. The industrial automation device of claim 9 , wherein the percentage is between 70% and 80%.
11. The industrial automation device of claim 8 , wherein a type of the plurality of washers and a number of the plurality of washers are determined based on a size of the fastener, an amount of torque being applied to the fasteners, and an amount of expected deflection between the heat sink and the semiconductor device after the TIM flows.