IP Library › Granted Patent US 9,583,546
Granted Patent B2
US 9,583,546 · App. 14/516,307 · Granted Feb 28, 2017

Organic light emitting device and method of fabricating the same

Inventors: YoungHoon Shin (Paju-si, KR); SungJin Hong (Goyang-si, KR); Myungseop Kim (Goyang-si, KR); JoongSun Yoon (Goyang-si, KR)
Assignee: LG DISPLAY CO., LTD.
H01L27/3258H01L27/1225H01L29/7869H01L51/5259
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,583,546
App. No.
14/516,307
Granted
Feb 28, 2017
Kind
B2
Abstract

An organic light emitting device and a method of fabricating the same includes a first substrate; a thin film transistor (TFT) on the first substrate; a planarization layer on the TFT; an organic light emitting diode (OLED) on the planarization layer; a passivation layer on the OLED; a second substrate on the passivation; and a hydrogen capturing material between the first and the second substrates to prevent oxidation of materials forming the TFT.

Claims (24)

1. An organic light emitting device comprising:

a first substrate;

a thin film transistor (TFT) on the first substrate;

an insulating layer on the TFT;

an organic light emitting diode (OLED) on the insulating layer;

a passivation layer on the OLED;

an adhesive layer on the passivation layer;

a second substrate on the adhesive layer; and

a hydrogen capturing material between the first and the second substrates,

wherein the hydrogen capturing material dissociates hydrogen to prevent de-oxidation of materials forming the TFT, and

wherein the passivation layer, the adhesive layer and the second substrate include the hydrogen capturing material.

2. The organic light emitting device of claim 1 , wherein the first substrate includes the hydrogen capturing material.

3. The organic light emitting device of claim 1 , wherein the TFT includes an oxide layer selected from the group consisting of Indium Gallium Zinc Oxide (IGZO), Zinc Tin Oxide (ZTO), and Zinc Indium Oxide (ZIO).

4. The organic light emitting device of claim 1 , wherein the second substrate includes a metal foil or a metal foil alloy including the hydrogen capturing metal.

5. The organic light emitting device of claim 1 , wherein the second substrate includes a material selected from the group consisting of Li, Na, Cr, α-Fe, Mo, W, and K.

6. The organic light emitting device of claim 1 , wherein the second substrate includes a material selected from the group consisting of Pt, Pb, Ni, γ-Fe, Cu, Al, Au, and Ag.

7. The organic light emitting device of claim 1 , wherein the first substrate includes a metal foil or metal foil alloy including the hydrogen capturing metal.

8. The organic light emitting device of claim 1 , wherein the hydrogen capturing material is capable of dissociating a hydrogen molecule into hydrogen atoms.

9. The organic light emitting device of claim 1 , wherein the hydrogen capturing material is capable of dissociating a hydrogen molecule into hydrogen atoms to form an interstitial solid solution or metal hydride.

10. The organic light emitting device of claim 1 , wherein the hydrogen capturing material includes an element selected from the group consisting of Ba, Ca, Cu, Fe, Hf, La, Mg, Nb, Ni, Pd, Pt, Se, Sr, Ta, Ti, V, and Zr.

11. The organic light emitting device of claim 5 , wherein the metal foil or the metal foil alloy has a body centered cubic lattice structure having about 32% porosity.

12. The organic light emitting device of claim 11 , wherein the metal foil or metal foil alloy having the body centered lattice structure has a packing factor of about 68%.

13. The organic light emitting device of claim 6 , wherein the metal foil or the metal foil alloy has a face centered cubic lattice structure having about 26% porosity.

14. The organic light emitting device of claim 13 , wherein the metal foil or metal foil alloy having the face centered cubic lattice structure has a packing factor of about 74%.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 16, 2014
From: SHIN, YOUNGHOON; HONG, SUNGJIN; KIM, MYUNGSEOP; YOON, JOONGSUN
To: LG DISPLAY CO., LTD.
Reel/Frame 033966/0263 →
Priority Claims (1)
KR 10-2013-0123631 · Oct 16, 2013 · national
Continuity (1)
Related Publication 20150102332A1 · Apr 16, 2015