Liquid nitrogen cooled MRI coils and coil arrays
New method of cooling of MRI coil and resonators is disclosed and described. MRI coil designs showed in the disclosure are based solely on the use of copper tube elements filled with liquid nitrogen. Inside the conducting tubes at rf frequency there is no rf electric field, thus the liquid nitrogen presence inside such coils will not have any influence on MRI coil dielectric losses and on the resonant frequency modulation. Liquid nitrogen cooled coils, when in the coil noise regime, demonstrate 2-3 gain of signal-to-noise ratio comparing with room temperature equivalent coils. Methods for making and using both superconducting and normal metal MRI coils and/or arrays in such configurations are also disclosed.
1. A magnetic resonance imaging coil comprising:
a conductor,
at least one capacitor, where the capacitor is built in and adjusts a capacitance of the coil, and
at least one internal flow channel within the coil,
where an electric field generated by the conductor is zero or substantially zero.
2. The coil of claim 1 , wherein the conductor comprises a conducting tube including a superconducting shell and the flow channel comprises an interior of the tube.
3. The coil of claim 1 , wherein the conductor comprises a conducting tube including opposing superconducting layers formed on opposite portions of the tube and the flow channel comprises an interior of the tube.
4. The coil of claim 1 , wherein the conductor comprises a non-conducting tube and a conducting shell formed on an outer surface of the tube and the flow channel comprises an interior of the non-conducting tube.
5. The coil of claim 4 , wherein the non-conducting tube includes a metal coating on its interior surface to improve thermal conductivity of the non-conducting tube.
6. The coil of claim 1 , wherein the conductor comprises a non-conducting tube and wherein the conductor comprises opposing conducting layers formed on opposite portions of the tube and the flow channel comprises an interior of the tube.
7. The coil of claim 6 , wherein the non-conducting tube includes a metal coating on its interior surface to improve thermal conductivity of the non-conducting tube.
8. The coil of claim 1 , wherein the conductor comprises a pattern of conducting layers formed on a top surface and a bottom surface of a dielectric layer and the flow channel comprises micro-channels formed in the dielectric layer, the conducting layers or both the dielectric layer and the conducting layers.
9. The coil of claim 1 , wherein the built in capacitor comprises a dielectric interposed between two portions of the conductor.
10. A magnetic imagining coil system comprising:
a vacuum subsystem including:
a housing comprising:
a top having a top outlet conduit aperture,
a bottom,
an interior,
a vacuum valve, and
a feed through fitting,
a vacuum pump detachably connected to the vacuum valve via a vacuum conduit for evacuating the interior of the housing,
a reservoir, disposed in an upper portion of the housing, including:
a top having:
a reservoir top outlet conduit aperture,
a bottom having:
a reservoir bottom inlet conduit aperture,
a reservoir bottom outlet conduit aperture, and
an interior for receiving a coolant,
a magnetic imagining coil subsystem including:
at least one magnetic imagining coil comprising:
a conductor,
at least one capacitor, where the capacitor adjusts a capacitance of the coil, and
an internal flow channel situated within the conductor,
an electronic subsystem including:
a power supply,
an external electronic unit comprising:
a power cable connected to the power supply,
a signal receiving component,
a processing and analyzing component, and
a display for displaying an magnetic resonance image generated by the processing and analyzing component, and
an internal electronic unit comprising:
tuning/matching and detuning circuitry,
wires connecting the circuitry to the coils,
a power cable connected to the power supply, and
an rf cable connected to the rf receiving component of the external electronic unit, where the cables extend from the internal electronic unit through the fitting.
11. The system of claim 10 , wherein the conductor comprises a conducting tube including a superconducting shell and the flow channel comprises an interior of the tube.
12. The system of claim 10 , wherein the conductor comprises a conducting tube including opposing superconducting layers formed on opposite portions of the tube and the flow channel comprises an interior of the tube.
13. The system of claim 10 , wherein the conductor comprises a non-conducting tube and a conducting shell formed on an outer surface of the tube and the flow channel comprises an interior of the non-conducting tube.
14. The system of claim 13 , wherein the non-conducting tube includes a metal coating on its interior surface to improve thermal conductivity of the non-conducting tube.
15. The system of claim 10 , wherein the conductor comprises a non-conducting tube and wherein the conductor comprises opposing conducting layers formed on opposite portions of the tube and the flow channel comprises an interior of the tube.
16. The system of claim 15 , wherein the non-conducting tube includes a metal coating on its interior surface to improve thermal conductivity of the non-conducting tube.
17. The system of claim 10 , wherein the conductor comprises a pattern of conducting layers formed on a top surface and a bottom surface of a dielectric layer and the flow channel comprises micro-channels formed in the dielectric layer, the conducting layers or both the dielectric layer and the conducting layers.
18. The system of claim 10 , wherein the capacitor is built in and comprises a dielectric interposed between two portions of the conductor.
19. The system of claim 10 , wherein the at least one coil includes:
a dielectric substrate including:
a first conductor disposed on a top surface of the substrate,
a second conductor disposed on a bottom surface of the substrate, and
at least one coolant channel formed in the substrate, where the first conductor and second conductor form the top and bottom of the channels.
20. The system of claim 10 , wherein the at least one coil includes:
a dielectric substrate including:
a first conductor disposed on a top surface of the substrate, and
a second conductor disposed on a bottom surface of the substrate,
a plurality of coolant micro channels formed in the substrate.
21. The system of claim 19 , the at least one coil further includes:
a plurality of coolant micro channels formed in the first conductor.
22. The system of claim 20 , the at least one coil further includes:
a plurality of coolant micro channels formed in the second conductors.
23. The system of claim 19 , wherein the capacitor is built in and comprises a dielectric interposed between two portions of the first and second conductors.
24. The system of claim 20 , wherein the capacitor is built in and comprises a dielectric interposed between two portions of the first and second conductors.
25. A magnetic imagining coil system comprising:
a housing:
a coolant reservoir,
a coolant outlet conduit,
a coolant inlet conduit,
an interior including:
a magnetic imagining coil comprising:
a conductor,
at least one capacitor, where the capacitor adjusts a capacitance of the coil, and
an internal flow channel situated within the conductor and connected to the coolant inlet and the coolant outlet so that coolant flows through the channel,
an internal electronic unit comprising:
tuning/matching and detuning circuitry,
a cable passthrough fitting,
a power cable passing through the fitting and connected to the internal electronic unit, and
an rf cable passing through the fitting and connected to the internal electronic unit,
where the coolant outlet extends outside the housing.
26. The system of claim 25 , wherein the conductor comprises:
a conducting tube including a superconducting shell and the flow channel comprises an interior of the tube;
a conducting tube including opposing superconducting layers formed on opposite portions of the tube and the flow channel comprises an interior of the tube;
a non-conducting tube and a conducting shell formed on an outer surface of the tube and the flow channel comprises an interior of the non-conducting tube.
27. The system of claim 26 , wherein the non-conducting tube includes a metal coating on its interior surface to improve thermal conductivity of the non-conducting tube.
28. The system of claim 25 , wherein the conductor comprises a non-conducting tube and wherein the conductor comprises opposing conducting layers formed on opposite portions of the tube and the flow channel comprises an interior of the tube.
29. The system of claim 28 , wherein the non-conducting tube includes a metal coating on its interior surface to improve thermal conductivity of the non-conducting tube.
30. The system of claim 25 , wherein the conductor comprises a pattern of conducting layers formed on a top surface and a bottom surface of a dielectric layer and the flow channel comprises micro-channels formed in the dielectric layer, the conducting layers or both the dielectric layer and the conducting layers.
31. The system of claim 25 , wherein the capacitor is built in and comprises a dielectric interposed between two portions of the conductor.
32. The system of claim 25 , wherein the at least one coil includes:
a dielectric substrate including:
a first conductor disposed on a top surface of the substrate,
a second conductor disposed on a bottom surface of the substrate, and
at least one coolant channel formed in the substrate, where the first conductor and second conductor form the top and bottom of the channels.
33. The system of claim 25 , wherein the at least one coil includes:
a dielectric substrate including:
a first conductor disposed on a top surface of the substrate, and
a second conductor disposed on a bottom surface of the substrate,
a plurality of coolant micro channels formed in the substrate.
34. The system of claim 33 , the at least one coil further includes:
a plurality of coolant micro channels formed in the first conductor.
35. The system of claim 34 , the at least one coil further includes:
a plurality of coolant micro channels formed in the second conductors.
36. The system of claim 32 , wherein the capacitor is built in and comprises a dielectric interposed between two portions of the first and second conductors.
37. The system of claim 33 , wherein the capacitor is built in and comprises a dielectric interposed between two portions of the first and second conductors.
38. The system of claim 25 , further comprising:
a power supply,
an external electronic unit comprising:
a power cable connected to the power supply,
a signal receiving component,
a processing and analyzing component, and
a display for displaying an magnetic resonance image generated by the processing and analyzing component.