Method and apparatus for dynamic memory termination
Described herein are a method and an apparatus for dynamically switching between one or more finite termination impedance value settings to a memory input-output (I/O) interface of a memory in response to a termination signal level. The method comprises: setting a first termination impedance value setting for a termination unit of an input-output (I/O) interface of a memory; assigning the first termination impedance value setting to the termination unit when the memory is not being accessed; and switching from the first termination impedance value setting to a second termination impedance value setting in response to a termination signal level.
1. An apparatus comprising:
an interface operable to access a memory, the memory comprising a register to store a termination impedance setting for termination of an input-output (I/O) interface of the memory; and
a logic unit operable to
send a signal to set a default termination impedance value with the termination impedance setting of the register, wherein the default termination impedance value to be applied to the I/O interface in response to de-assertion of a termination signal to activate termination of the I/O interface of the memory, and
send a termination signal to switch from the default termination impedance value to a different termination impedance value for the I/O interface of the memory, wherein the default termination impedance value and the different termination impedance value are both finite values.
2. The apparatus of claim 1 , wherein the I/O interface of the memory comprises a Double Data Rate 4 (DDR4) interface of the memory.
3. The apparatus of claim 1 , wherein the memory comprises a Dynamic Random Access Memory (DRAM).
4. The apparatus of claim 1 , wherein the memory resides in a memory module which is a Dual In-Line Memory Module (DIMM) with one or more Dynamic Random Access Memories (DRAMs).
5. The apparatus of claim 1 , wherein the termination signal is to cause at least one termination unit of the memory to selectively turn on or turn off a plurality of pull-up resistors.
6. The apparatus of claim 5 , wherein the logic unit is further operable to set the different termination impedance value for a read access to the I/O interface of the memory.
7. The apparatus of claim 1 , wherein the logic unit is operable to set the default termination impedance value and the different termination impedance value in response to control from an operating system.
8. The apparatus of claim 1 , wherein the termination signal is an on-die termination (ODT) signal.
9. The apparatus of claim 1 , wherein the default termination impedance value is greater than the different termination impedance value.
10. The apparatus of claim 1 , wherein the default termination impedance value comprises a termination impedance for the memory when the memory is not accessed for a read command.
11. A method comprising:
setting a termination impedance setting to a default termination impedance value for an input/output (I/O) interface of a memory, including setting a field of a register of the memory that stores a termination impedance setting, wherein the default termination impedance value to be applied to the I/O interface in response to de-assertion of a termination signal to activate termination of the I/O interface of the memory; and
sending a termination signal to switch from the default termination impedance value to a different termination impedance value for the I/O interface of the memory, wherein the default termination impedance value and the different termination impedance value are both finite values.
12. The method of claim 11 , wherein the I/O interface of the memory comprises a Double Data Rate 4 (DDR4) interface of a Synchronous Dynamic Random Access Memory (SDRAM).
13. The method of claim 11 , wherein the memory resides in a memory module which is a Dual In-Line Memory Module (DIMM) with one or more Dynamic Random Access Memories (DRAMs).
14. The method of claim 11 , sending the termination signal causes at least one termination unit of the memory to selectively turn on or turn off a plurality of pull-up resistors.
15. The method of claim 14 , further comprising:
setting the different termination impedance value for a read access to the I/O interface of the memory.
16. The method of claim 11 , further comprising:
setting the default termination impedance value and the different termination impedance value in response to control from an operating system.
17. The method of claim 11 , sending the termination signal comprises sending an on-die termination (ODT) signal.
18. The method of claim 11 , wherein the default termination impedance value is greater than the different termination impedance value.
19. The method of claim 11 , wherein the default termination impedance value comprises a termination impedance for the memory when the memory is not accessed for a read command.
20. A system comprising:
a memory comprising a register to store a termination impedance setting for termination of an input-output (I/O) interface of the memory; and
a memory controller coupled to the memory, the memory controller including:
an interface operable to access the memory; and
a logic unit operable to
send a signal to set a default termination impedance value with the termination impedance setting of the register, wherein the default termination impedance value to be applied to the I/O interface in response to de-assertion of a termination signal to activate termination of the I/O interface of the memory, and
send a termination signal to switch from the default termination impedance value to a different termination impedance value for the I/O interface of the memory, wherein the default termination impedance value and the different termination impedance value are both finite values.
21. The system of claim 20 , wherein the I/O interface of the memory comprises a Double Data Rate 4 (DDR4) interface of the memory.
22. The system of claim 20 , wherein the memory comprises a Dynamic Random Access Memory (DRAM).
23. The system of claim 20 , wherein the memory resides in a memory module which is a Dual In-Line Memory Module (DIMM) with one or more Dynamic Random Access Memories (DRAMs).
24. The system of claim 20 , wherein the termination signal is to cause at least one termination unit of the memory to selectively turn on or turn off a plurality of pull-up resistors.
25. The system of claim 24 , wherein the logic unit is further operable to set the different termination impedance value for a read access to the I/O interface of the memory.
26. The system of claim 20 , wherein the logic unit is operable to set the default termination impedance value and the different termination impedance value in response to control from an operating system.
27. The system of claim 20 , wherein the termination signal comprises an on-die termination (ODT) signal.
28. The system of claim 20 , wherein the default termination impedance value is greater than the different termination impedance value.
29. The system of claim 20 , wherein the default termination impedance value comprises a termination impedance for the memory when the memory is not accessed for a read command.