IP Library Granted Patent US 9,598,859
Granted Patent B2
US 9,598,859 · App. 14/996,824 · Granted Mar 21, 2017

Sound reducing underlayment composition, system and method

Inventors: Robert Kintu Ddamulira (Chattanooga, TN); Akbar Ghaneh-Fard (Dalton, GA)
Assignee: W.F. Taylor LLC
E04B1/8409E04C2/28E04C2/284E04F15/0215E04F15/102E04F15/107E04F15/12E04F15/203
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Quick Facts
Patent No.
US 9,598,859
App. No.
14/996,824
Granted
Mar 21, 2017
Kind
B2
Abstract

An underlayment layer composition and flooring system, method of using the composition and method of obtaining desirable sound reducing results are provided. The underlayer can provide sound reducing properties. The underlayer material is preferably provided as a liquid or paste. It can take the form of a trowel applied, rapid curing material suitable for many floor systems. In preferred embodiments of the invention, a layer membrane of the material can help lead to an ASTM E492/ASTM E-986-06 impact sound transmission IIC rating or ASTM E90-04/E413-10 sound transmission loss STC rating of about 45 dB or greater, preferably over 65 dB and even over 69 dB.

Claims (50)

1. A flooring system assembled at a flooring installation site, including a sound reducing underlayment material, comprising

a sub-floor, adapted to have a top-floor installed thereon;

a sound reducing interlayer comprising a curable or cured polymer base with hollow microspheres dispersed therein, to reduce sound transmission through the flooring system, the hollow microspheres having a diameter of about 10 μm to about 200 μm and comprising about 0.2% to about 5.0% by weight of the polymer material, formed by spreading the interlayer material from a bulk source into a layer over the sub-floor at the flooring installation site; and

a top-floor, suitable to serve as the finished flooring installed over the interlayer at the flooring installation site.

2. The flooring system of claim 1 , consisting essentially of the sub-floor, the interlayer and the top-floor.

3. The flooring system of claim 1 , comprising interlayer means for reducing sound transmission through the flooring system.

4. The flooring system of claim 1 , wherein the flooring system comprises a cured 3/32 inch layer of the interlayer and has the structural sound insulating properties to achieve an Impact Insulation Class (IIC) value of at least 50 dB when tested under ASTM E 492-09/ASTM E 989-06 or a Sound Transmission Class (STC) value of at least 50 dB, when tested under ASTM E 90-04/ASTM E 413-10.

5. The flooring system of claim 1 , wherein the interlayer material comprises about 0.4%-3.0% hollow microspheres.

6. The flooring system of claim 4 , wherein the polymer base comprises at least one of a silane terminated prepolymer and a polyurethane prepolymer.

7. The flooring system of claim 4 , wherein the polymer base comprises an alkoxy silane terminated prepolymer.

8. The flooring system material of claim 4 , wherein the polymer base comprises about 15% to about 50% by weight of the interlayer material.

9. The flooring system of claim 4 , wherein the polymer base comprises about 25% to about 35% by weight of the interlayer material.

10. The flooring system of claim 4 , wherein the hollow microspheres comprise at least one of glass microspheres, polymer microspheres, or ceramic microspheres.

11. The flooring system of claim 1 , wherein the interlayer material comprises about 15%-50% moisture curable polymer system and about 20%-60% filler.

12. The flooring system of claim 1 , wherein the interlayer material comprises about 25%-35% moisture curable polymer system and about 30%-50% filler.

13. The flooring system of claim 11 , wherein the interlayer material comprises about 0.10% to about 0.30% by weight of a an antioxidant/light stabilizer.

14. The flooring system of claim 4 , wherein the interlayer material comprises about 25%-35% polymer base and about 30%-50% filler.

15. The flooring system of claim 11 , wherein the interlayer material comprises an amino silane adhesion promoter.

16. The flooring system of claim 11 , wherein the interlayer material comprises a dibutyltin dilaurate catalyst.

17. The flooring system of claim 1 , comprising a cured 3/32 inch interlayer and the system having the structural sound insulating properties to achieve an Impact Insulation Class (IIC) of at least 60 dB when tested under ASTM E 492-09/ASTM E 989-06 or a Sound Transmission Class (STC) of at least 60 dB, when tested under ASTM E 90-04/ASTM E 413-10.

18. The flooring system of claim 1 , comprising a cured 3/32 inch interlayer and the system having the structural sound insulating properties to achieve an Impact Insulation Class (IIC) of at least 65 dB when tested under ASTM E 492-09/ASTM E 989-06 or a Sound Transmission Class (STC) of at least 65 dB, when tested under ASTM E 90-04/ASTM E 413-10.

19. The flooring system of claim 4 , wherein the interlayer, when cured, can reduce moisture vapor transmission of at least 8 pounds per 1000 square feet per 24 hours and 90% relative humidity to under 5 pounds per 1000 square feet per 24 hours.

20. A method of installing a sound reducing flooring system over an existing sub-floor substrate at a flooring installation site, comprising

providing at the flooring installation site, a bulk source of a sound reducing liquid or paste interlayer material comprising a curable polymer base with hollow microspheres dispersed therein, the hollow microspheres having a diameter of about 10 μm to about 200 μm and comprising about 0.20% to about 5.0% by weight of the interlayer;

spreading the interlayer material over the sub-floor to form a layer of interlayer material; permitting the interlayer material to cure; and

installing a finished floor over the layer of interlayer material.

21. The method of claim 20 , consisting essentially of spreading the interlayer material over the sub-floor, permitting the interlayer material to cure and installing the finished floor over the interlayer material.

22. The method of claim 20 , comprising forming interlayer means, for reducing sound transmission through the flooring system.

23. The method of claim 20 , wherein the interlayer material is spread with a trowel.

24. The method of claim 20 , wherein, the interlayer material is formulated and applied in a manner adapted to provide a cured 3/32 inch layer that has the structural sound insulating properties for the finished flooring system to achieve an Impact Insulation Class (IIC) value of at least 50 dB when tested under ASTM E 492-09/ASTM E 989-06 or a Sound Transmission Class (STC) value of at least 50 dB, when tested under ASTM E 90-04/ASTM E 413-10.

25. The method of claim 20 , wherein the interlayer material comprises about 0.4%-3.0% hollow microspheres.

26. The method of claim 20 , wherein, the interlayer material is formulated and applied in a manner adapted to provide a cured 3/32 inch layer that has the structural sound insulating properties for the finished flooring system to achieve an Impact Insulation Class (IIC) value of at least 60 dB when tested under ASTM E 492-09/ASTM E 989-06 or a Sound Transmission Class (STC) value of at least 60 dB, when tested under ASTM E 90-04/ASTM E 413-10.

27. The method of claim 20 , wherein, interlayer material is formulated and applied in a manner to provide a cured 3/32 inch layer that has the structural sound insulating properties for the finished flooring system to achieve an Impact Insulation Class (IIC) value of at least 65 dB when tested under ASTM E 492-09/ASTM E 989-06 or a Sound Transmission Class (STC) value of at least 65 dB, when tested under ASTM E 90-04/ASTM E 413-10.

28. The method of claim 24 , wherein the interlayer material layer comprises about 15%-50% moisture curable polymer system and about 30%-60% filler.

29. The method of claim 25 , wherein the interlayer material layer comprises about 25%-35% moisture curable polymer system and about 30%-50% filler.

30. The method of claim 24 , wherein the finished floor comprises a floating floor over the sub-floor or a floor system adhered in place over the sub-floor with a layer of adhesive.

31. A flooring system, assembled at a flooring installation site, comprising a subfloor, a finished floor and a sound reducing underlayment layer spread from a bulk source into a layer at the installation site between the finished floor and subfloor, the underlayment layer comprising a polymer base and hollow microspheres dispersed therein, the hollow microspheres having a diameter of about 10 μm to about 200 μm and comprising about 0.20% to about 5.0% by weight of the underlayment layer.

32. The flooring system of claim 31 , wherein the underlayment layer has a construction such that a 3/32 inch layer of the underlayment has the sound insulating properties to achieve an Impact Insulation Class (IIC) value of at least 50 dB when tested under ASTM E 492-09/ASTM E 989-06 or a Sound Transmission Class (STC) value of at least 50 dB, when tested under ASTM E 90-04/ASTM E 413-10.

33. The flooring system of claim 31 , wherein the underlayment layer has a construction such that a 3/32 inch layer of the underlayment has the sound insulating properties to achieve an Impact Insulation Class (IIC) value of at least 60 dB when tested under ASTM E 492-09/ASTM E 989-06 or a Sound Transmission Class (STC) value of at least 60 dB, when tested under ASTM E 90-04/ASTM E 413-10.

34. The flooring system of claim 31 , wherein the underlayment layer has a construction such that a 3/32 inch layer of the underlayment has the sound insulating properties to achieve an Impact Insulation Class (IIC) value of at least 65 dB when tested under ASTM E 492-09/ASTM E 989-06 or a Sound Transmission Class (STC) value of at least 65 dB, when tested under ASTM E 90-04/ASTM E 413-10.

35. The flooring system of claim 31 , wherein the hollow microspheres have a diameter of about 30-100 μm, and comprising about 25%-35% polymer system, 30%-50% filler and 0.4%-3.0% hollow microspheres.

36. The flooring system of claim 31 , wherein the subfloor is cement or plywood and the finished floor comprises at least one of wood, tile or thin sheeting.

37. The flooring system of claim 31 , wherein the finished floor is adhered with a layer of adhesive.

38. The flooring system of claim 31 , wherein the underlayment layer can reduce moisture vapor transmission of at least 8 pounds per 1000 ft2 per 24 hours at 90% relative humidity to under 5 pound per 1000 ft2 per 24 hours.

39. The flooring system of claim 31 , wherein the underlayment layer can reduce moisture vapor transmission of at least 10 pounds per 1000 ft2 per 24 hours at 90% relative humidity to under 5 pound per 1000 ft2 per 24 hours.

40. The flooring system of claim 39 , wherein the moisture transmission can be reduced to below 3 lb per 1000 ft2 per 24 hours.

41. The flooring system of claim 34 , wherein the hollow microspheres have a diameter of about 30-100 μm, and comprising about 25%-35% polymer system, 30%-50% filler and 0.4%-3.0% hollow microspheres.

42. The method of claim 29 , wherein the interlayer material is spread with a trowel.

43. The method of claim 42 , wherein the interlayer material is formulated and applied in a manner adapted to provide a cured 3/32 inch layer that has the structural sound insulating properties for the finished flooring system to achieve an Impact Insulation Class (IIC) value of at least 50 dB when tested under ASTM E 492-09/ASTM E 989-06 or a Sound Transmission Class (STC) value of at least 50 dB, when tested under ASTM E 90-04/ASTM E 413-10.

44. The method of claim 42 , wherein the interlayer material is formulated and applied in a manner adapted to provide a cured 3/32 inch layer that has the structural sound insulating properties for the finished flooring system to achieve an Impact Insulation Class (IIC) value of at least 60 dB when tested under ASTM E 492-09/ASTM E 989-06 or a Sound Transmission Class (STC) value of at least 60 dB, when tested under ASTM E 90-04/ASTM E 413-10.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Feb 4, 2026
From: JPMORGAN CHASE BANK, N.A.
To: W.F. TAYLOR LLC
Reel/Frame 073682/0376 →
SECURITY INTEREST Recorded Sep 16, 2022
From: ASP METEOR ACQUISITION CO LLC; ADHESIVES TECHNOLOGY CORPORATION; AMERICAN SEALANTS, INC.; EPOXIES LLC; EPOXY TECHNOLOGY INC.; EVANS ADHESIVE CORPORATION; W.F. TAYLOR LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 061113/0895 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Sep 1, 2022
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: W.F. TAYLOR LLC
Reel/Frame 061370/0825 →
RELEASE OF SECURITY INTEREST : RECORDED AT REEL/FRAME - 047518/0093 Recorded Aug 15, 2021
From: KAYNE SENIOR CREDIT III LOANCO, LLC
To: W.F. TAYLOR LLC
Reel/Frame 057186/0295 →
SECURITY AGREEMENT Recorded Jul 22, 2021
From: W.F. TAYLOR LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 056957/0873 →
ASSIGNMENT FOR SECURITY PATENTS Recorded Sep 25, 2018
From: W.F. TAYLOR LLC
To: KAYNE SENIOR CREDIT III LOANCO, LLC, AS ADMINISTRATIVE AGENT
Reel/Frame 047518/0093 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 26, 2017
From: W.F. TAYLOR CO., INC.
To: W.F. TAYLOR LLC
Reel/Frame 041091/0140 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2016
From: DDAMULIRA, ROBERT KINTU; GHANEH-FARD, AKBAR
To: W.F. TAYLOR CO., INC.
Reel/Frame 037503/0163 →
Continuity (2)
Provisional Application 62104461 · Jan 16, 2015
Related Publication 20160208482A1 · Jul 21, 2016