Display device and method of manufacturing the same
A display device includes: a substrate having a mounting area; a pad electrically coupled to a wire on the substrate and at the same layer as the wire; an adhesive layer bonded to a bottom of the substrate having the mounting area; a supporting substrate bonded to a bottom of the adhesive layer to which the substrate is bonded; a flexible printed circuit board electrically coupled to the pad to input a power and a signal to the pad; and a conductive layer between the flexible printed circuit board and the pad to electrically couple the flexible printed circuit board to the pad, and at least a portion of the adhesive layer on the mounting area is exposed to the outside to be coupled to the conductive layer.
1. A display device comprising:
a substrate having a mounting area;
a pad electrically coupled to a wire on the substrate and at the same layer as the wire;
an adhesive layer bonded to a side of the substrate facing away from the pad;
a supporting substrate bonded to a bottom of the adhesive layer;
a flexible printed circuit board electrically coupled to the pad to input a power and a signal to the pad;
a conductive layer between the flexible printed circuit board and the pad to electrically couple the flexible printed circuit board to the pad on a side of the substrate opposite the adhesive layer,
wherein at least a portion of the adhesive layer on the mounting area is exposed to the outside to be coupled to the conductive layer; and
an insulation layer on the substrate, wherein the adhesive layer is coupled to the conductive layer via a conductive layer contact hole in the insulation layer.
2. The display device of claim 1 , wherein
at least a portion of the insulation layer on the mounting area and at least a portion of the substrate are penetrated by the conductive layer contact hole.
3. The display device of claim 1 , wherein the conductive layer contact hole is at a border of the insulation layer.
4. The display device of claim 1 , wherein the conductive layer is an anisotropic conductive film or a self-organizing conductive film.
5. The display device of claim 1 , further comprising a pad protective layer at ends of the pad.
6. The display device of claim 5 , wherein the pad protective layer comprises at least one of an organic layer and an inorganic layer.
7. The display device of claim 1 , wherein the adhesive layer comprises at least one of a silicon inorganic layer, an oxide layer having substantially the same insulating property as the silicon inorganic layer, and a metallic layer.
8. The display device of claim 1 , wherein the supporting substrate is formed of a plastic or SUS material.
9. The display device of claim 1 , wherein the substrate is formed of a polyimide (PI) material.
10. The display device of claim 1 , wherein the flexible printed circuit board comprises:
a body part electrically coupled to an outside; and
a terminal part formed at one end of the body part and electrically coupled to the pad through the conductive layer.
11. A display device comprising:
a substrate having a mounting area;
a pad electrically coupled to a wire on the substrate and at the same layer as the wire;
an adhesive layer bonded to a side of the substrate facing away from the pad, wherein the substrate is between the pad and the adhesive layer;
a supporting substrate bonded to a bottom of the adhesive layer;
a flexible printed circuit board electrically coupled to the pad to input a power and a signal to the pad; and
a conductive layer between the flexible printed circuit board and the pad to electrically couple the flexible printed circuit board to the pad on a side of the substrate opposite the adhesive layer,
wherein at least a portion of the adhesive layer on the mounting area is exposed to the outside to be coupled to the conductive layer.
12. A display device having a display area and a non-display area, the display device comprising:
a substrate formed only in the display area;
a pad electrically coupled to a wire on the substrate and at the same layer as the wire;
an adhesive layer bonded to a side of the substrate facing away from the pad;
a supporting substrate bonded to a bottom of the adhesive layer;
a flexible printed circuit board electrically coupled to the pad in a mounting area of the non-display area, to input a power and a signal to the pad; and
a conductive layer between the flexible printed circuit board and the pad to electrically couple the flexible printed circuit board to the pad on a side of the substrate opposite the adhesive layer,
wherein at least a portion of the adhesive layer on the mounting area is exposed to the outside to be coupled to the conductive layer.
13. The display device of claim 12 , further comprising an insulation layer on the substrate.
14. The display device of claim 13 , wherein the insulation layer and the pad are in the mounting area where the substrate is not located, and the conductive layer surrounds a border of the insulation layer.