Electromagnetic shielding film, flexible printed wiring board with electromagnetic shielding film, electronic device and method for forming the same
A electromagnetic shielding film includes a conductive supporting substrate which includes a cured material of a thermosetting resin including a conductive filler; a metal thin film layer which covers one surface of the conductive supporting substrate; a thermosetting adhesive layer which covers a surface of the metal thin film layer; and a peeling substrate which covers the other surface of the conductive supporting substrate.
1. An electromagnetic shielding film comprising:
a conductive supporting substrate which includes a cured material of a thermosetting resin including a conductive filler;
a metal thin film layer which covers one surface of the conductive supporting substrate;
a thermosetting adhesive layer which covers a surface of the metal thin film layer; and
a peeling substrate which covers the other surface of the conductive supporting substrate,
wherein a storage modulus of the conductive supporting substrate at 180° C. is from 8×10 6 to 1×10 8 Pa.
2. The electromagnetic shielding film according to claim 1 , wherein
the conductive filler is a fibrous conductive filler.
3. A flexible printed wiring board with the electromagnetic shielding film comprising:
a flexible printed wiring board which includes a base film including polyimide and a printed circuit positioned on at least one surface of the base film; and
the electromagnetic shielding film according to claim 1 in which the thermosetting adhesive layer is adhered to at least one surface of the flexible printed wiring board and the thermosetting adhesive layer is cured.
4. A flexible printed wiring board with the electromagnetic shielding film comprising:
a flexible printed wiring board which includes a base film including polyimide and a printed circuit positioned on at least one surface of the base film; and
an electromagnetic shielding film,
wherein the electromagnetic shielding film comprises:
a conductive supporting substrate which includes a cured material of a thermosetting resin including a conductive filler;
a metal thin film layer which covers one surface of the conductive supporting substrate; and
a thermosetting adhesive layer which covers a surface of the metal thin film layer,
wherein the thermosetting adhesive layer is adhered to at least one surface of the flexible printed wiring board,
the thermosetting adhesive layer is cured, and
a storage modulus of the conductive supporting substrate at 180° C. is from 8×10 6 to 1×10 8 Pa.
5. An electronic device comprising:
a housing at least a portion of which has conductivity;
the flexible printed wiring board with the electromagnetic shielding film according to claim 4 ;
an anisotropic conductive adhesive sheet which is positioned between the housing and the flexible printed wiring board with the electromagnetic shielding film, electrically connects the housing and the conductive supporting substrate, and has conductivity in a thickness direction.
6. A method of forming an electromagnetic shielding film, the method comprising:
forming a conductive supporting substrate made of a cured material of a thermosetting resin which includes a conductive filler by applying and curing a thermosetting resin composition which includes the conductive filler on one surface of a peeling substrate;
forming a metal thin film layer on a surface of the conductive supporting substrate; and
forming a thermosetting adhesive layer on a surface of the metal thin film layer,
wherein a storage modulus of the conductive supporting substrate at 180° C. is from 8×10 6 to 1×10 8 Pa.
7. A method of forming a flexible printed wiring board with an electromagnetic shielding film, the method comprising:
adhering and curing the thermosetting adhesive layer of the electromagnetic shielding film obtained by the method for forming the electromagnetic shielding film according to claim 6 on at least one surface of a flexible printed wiring board in which a printed circuit is provided on at least one surface of a base film including polyimide.
8. The method of forming a flexible printed wiring board with an electromagnetic shielding film according to claim 7 , the method further comprising:
peeling the peeling substrate.
9. A method for forming an electronic device comprising:
attaching a housing at least a portion of which has conductivity and the flexible printed wiring board with the electromagnetic shielding film obtained by the method of forming the flexible printed wiring board with the electromagnetic shielding film according to claim 8 by an anisotropic conductive adhesive sheet having conductivity in a thickness direction and electrically connecting the housing and the conductive supporting substrate.